公开(公告)号：US20100193131A1

公开(公告)日：2010-08-05

申请号：US12443912

申请日：2008-10-29

申请人： Masahisa Ueda ,  Takashi Kurimoto ,  Kyuzo Nakamura ,  Koukou Suu ,  Toshiya Yogo ,  Kazushige Komatsu ,  Nobusuke Tachibana

发明人： Masahisa Ueda ,  Takashi Kurimoto ,  Kyuzo Nakamura ,  Koukou Suu ,  Toshiya Yogo ,  Kazushige Komatsu ,  Nobusuke Tachibana

IPC分类号： C23F1/08

CPC分类号： H01L21/02068 ,  G03F7/427 ,  H01J37/32192 ,  H01J37/32467 ,  H01J37/32477 ,  H01L21/31138

摘要： An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.

摘要翻译： 灰化装置可防止灰度随时间变化。 灰化装置在包括处理室中的暴露金属的基板上灰化有机材料。 灰化装置包括形成在处理室中并通过其提供给处理室的活性物质通过的路径。 该路径由其上由活性物质从衬底散射的金属可收集的表面限定，其表面被形成以暴露同一种类的金属。

公开(公告)号：US20060005920A1

公开(公告)日：2006-01-12

申请号：US11224134

申请日：2005-09-13

申请人： Takanori Muramoto ,  Takuya Ohno ,  Kazushige Komatsu ,  Koji Hashizume ,  Tsukasa Adachi ,  Yoshimasa Miyajima ,  Katsuhiro Nakashima

发明人： Takanori Muramoto ,  Takuya Ohno ,  Kazushige Komatsu ,  Koji Hashizume ,  Tsukasa Adachi ,  Yoshimasa Miyajima ,  Katsuhiro Nakashima

IPC分类号： B29C65/00

CPC分类号： G02F1/1333 ,  B32B37/10 ,  B32B2309/68 ,  B32B2457/20 ,  B32B2457/202 ,  G02F2001/133354 ,  G02F2001/13415

摘要： A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.

摘要翻译： 制造具有较少生产缺陷的粘结基材的方法。 该方法包括在第一基板的表面上形成密封框架; 将第一和第二基板设置在处理室中，对处理室进行减压; 以使得所述第一和第二基板彼此接近的方式移动所述第一和第二基板中的至少一个，计算作用在所述第一和第二基板上的按压载荷; 当所计算的按压负载达到目标负载时，停止第一和第二基板中的至少一个的移动; 并将处理室中的压力设定回大气压力。