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公开(公告)号：US09012783B2
公开(公告)日：2015-04-21
申请号：US13322111
申请日：2010-05-27
申请人： Yuuichi Abe , Kiyotaka Nakamura , Kiyoshi Yakubo
发明人： Yuuichi Abe , Kiyotaka Nakamura , Kiyoshi Yakubo
CPC分类号： H01L23/3735 , B23K35/3006 , B23K35/302 , B23K2101/14 , C22C5/08 , C22C9/00 , C22C30/02 , H01L2924/0002 , H01L2924/00
摘要： A brazing material includes silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten. The content of copper is not less than 35% by mass and not more than 50% by mass, based on the total amount of silver, copper, and the elements A, B and C. A heat dissipation base includes a supporting substrate, circuit members on a first main surface of the substrate, and a heat dissipation member on a second main surface opposite to the first main surface. The circuit members are joined to the supporting substrate by a joining layer composed of the brazing material.
摘要翻译： 钎焊材料包括银和铜作为主要成分; 至少一种选自铟，锌和锡的元素A; 选自钛，锆，铪和铌中的至少一种元素B; 以及选自钼，锇，铼和钨中的至少一种元素C. 铜的含量相对于银，铜，元素A，B，C的总量为35质量％以上且50质量％以下。散热基底包括支撑基板，电路 所述基板的第一主表面上的部件和与所述第一主表面相对的第二主表面上的散热部件。 电路构件通过由钎焊材料构成的接合层与支撑基板接合。
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2.发明申请公开(公告)号：US20120080216A1
公开(公告)日：2012-04-05
申请号：US13322111
申请日：2010-05-27
申请人： Yuuichi Abe , Kiyotaka Nakamura , Kiyoshi Yakubo
发明人： Yuuichi Abe , Kiyotaka Nakamura , Kiyoshi Yakubo
CPC分类号： H01L23/3735 , B23K35/3006 , B23K35/302 , B23K2101/14 , C22C5/08 , C22C9/00 , C22C30/02 , H01L2924/0002 , H01L2924/00
摘要： Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten. In a heat dissipation base 10 in which circuit members 41 and a heat dissipation member 42 are joined to a supporting substrate 21 through joining layers 31, 32 comprising the above brazing material, the brazing material scarcely protrudes unnecessarily from the joint regions thereof to make it possible to reduce a risk that a short circuit is caused between the circuit members 41, which are adjacent to each other.
摘要翻译： 提供能够在接合区域中不必要地被限制的钎焊材料; 散热基座具有高的电绝缘可靠性，并且即使当基体反复散热时也不容易引起短路; 以及其中将电子部件安装在该散热基座的电路部件上的电子设备。 钎焊材料以银和铜为主要成分， 至少一种选自铟，锌和锡的元素A; 选自钛，锆，铪和铌中的至少一种元素B; 以及选自钼，锇，铼和钨中的至少一种元素C. 在通过包括上述钎料的接合层31,32将电路部件41和散热部件42与支撑基板21接合的散热基座10中，钎焊材料几乎不会从接合部不必要地突出， 可能降低在彼此相邻的电路部件41之间产生短路的风险。
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