公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US20240033860A1

公开(公告)日：2024-02-01

申请号：US18257037

申请日：2021-07-22

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Ly May CHEW ,  Wolfgang SCHMITT ,  Michael SCHÄFER

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC分类号： B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K2103/10

摘要： The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).

公开(公告)号：US20230321765A1

公开(公告)日：2023-10-12

申请号：US18328183

申请日：2023-06-02

申请人： HENKEL AG & CO., KGaA

发明人： Pukun Zhu ,  Shashi Gupta ,  Louis Rector ,  Qizhuo Zhuo

IPC分类号： B23K35/02 ,  H01L23/00 ,  B32B27/00 ,  C08L63/00 ,  H01L21/683 ,  B23K35/30 ,  B23K35/36

CPC分类号： B23K35/025 ,  H01L24/27 ,  B32B27/00 ,  C08L63/00 ,  H01L24/29 ,  H01L21/6836 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3613 ,  H01L24/83 ,  B32B2307/202 ,  B32B2307/748 ,  B32B7/06

摘要： Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

公开(公告)号：US20230321764A1

公开(公告)日：2023-10-12

申请号：US18132362

申请日：2023-04-07

申请人： GUANGZHOU NEWLIFE NEW MATERIAL CO., LTD.

发明人： Zhinan Chai ,  Shuiming Zhou ,  Keqiang Wang ,  Xuezhao Wang

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  H01C7/10 ,  H01C1/144 ,  H01C17/28

CPC分类号： B23K35/025 ,  B23K35/3006 ,  B23K35/3602 ,  B23K35/3607 ,  B23K2101/36 ,  H01C7/1006 ,  H01C1/144 ,  H01C17/286 ,  B23K35/3613

摘要： The present invention provides a bottom ohmic silver paste for strontium titanate ring varistor including silver powder, doped SnO2 micro powder, glass powder, organic solvent and organic binder, and the mass ratio of the silver powder, the doped SnO2 micro powder, the glass powder, the organic solvent and the organic binder is [65,85]:[0.9,4.3]:[0.5,5]:[10,20]:[10,15]. The present invention also provides a preparation method and use of the bottom ohmic silver paste for strontium titanate ring varistor of the present invention.

公开(公告)号：US20230238348A1

公开(公告)日：2023-07-27

申请号：US18042894

申请日：2021-08-04

申请人： KYOCERA Corporation

发明人： Yuya NITANAI

IPC分类号： H01L23/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC分类号： H01L24/29 ,  H01L24/32 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  H01L2924/35121 ,  H01L2224/29291 ,  H01L2224/29499 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/12041 ,  B23K2101/40

摘要： This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.

公开(公告)号：US20190203327A1

公开(公告)日：2019-07-04

申请号：US16299682

申请日：2019-03-12

申请人： Iowa State University Research Foundation, Inc.

发明人： Martin Thuo ,  Ian Tevis

IPC分类号： C22C28/00 ,  B22F7/06 ,  B22F1/00 ,  B22D27/08 ,  B22D27/11 ,  B23K35/36 ,  B22F1/02 ,  B23K35/30 ,  B23K35/26 ,  B23K35/02

CPC分类号： C22C28/00 ,  B22D27/08 ,  B22D27/11 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3618

摘要： Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

公开(公告)号：US20190078227A1

公开(公告)日：2019-03-14

申请号：US15700723

申请日：2017-09-11

申请人： Toyota Motor Engineering & Manufacturing North America, Inc.

发明人： Shailesh N. Joshi ,  Ercan Mehmet Dede

IPC分类号： C25D7/12 ,  B23K35/30

CPC分类号： C25D7/12 ,  B23K1/00 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3033 ,  B23K2101/36 ,  C25D5/50 ,  C25D7/00 ,  H01L2224/48139 ,  H01L2224/73265 ,  H01L2924/19107

摘要： A thermal stress compensation layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity disposed between a pair of bonding layers. The thermal stress compensation layer has a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the MIO layer can be transient liquid phase bonded between a metal substrate and a semiconductor device. The pair of bonding layers may comprise a first pair of bonding layers and a second pair of bonding layers with the first pair of bonding layers disposed between the MIO layer and the second pair of bonding layers. The first pair of bonding layers may have a melting point above the TLP sintering temperature and the second pair of bonding layers may have a melting point below the TLP sintering temperature.

公开(公告)号：US20180345421A1

公开(公告)日：2018-12-06

申请号：US15778009

申请日：2016-09-16

申请人： Heraeus Materials Singapore Pte., Ltd. ,  Heraeus Oriental HiTec Co., Ltd.

发明人： Il Tae Kang ,  Yong-Deok Tark ,  Mong Hyun Cho ,  Jong Su Kim ,  Hyun Seok Jung ,  Tae Yeop Kim ,  Xi Zhang ,  Murali Sarangapani

IPC分类号： B23K35/30 ,  B23K20/00 ,  B23K35/02 ,  C22C5/06 ,  C22F1/14 ,  C22F1/02 ,  C22F1/00 ,  C23C14/16 ,  C23C14/02 ,  C25D5/12 ,  C25D7/06 ,  C25D5/50 ,  B23K35/40 ,  H01L23/00

CPC分类号： B23K35/3006 ,  B23K20/007 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/404 ,  C22C5/06 ,  C22C5/08 ,  C22F1/002 ,  C22F1/02 ,  C22F1/14 ,  C23C14/022 ,  C23C14/165 ,  C23C28/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/0607 ,  H01L24/42 ,  H01L24/43 ,  H01L24/44 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43125 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/48511 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755

摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

公开(公告)号：US20180243864A1

公开(公告)日：2018-08-30

申请号：US15442424

申请日：2017-02-24

申请人： LINCOLN GLOBAL, INC.

发明人： Praveen K. Namburu ,  William T. Matthews

IPC分类号： B23K35/22

CPC分类号： B23K35/22 ,  B23K35/0211 ,  B23K35/0216 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/40 ,  H05H1/34 ,  H05H2001/3442 ,  H05H2001/3478

摘要： A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

公开(公告)号：US09982878B2

公开(公告)日：2018-05-29

申请号：US15041471

申请日：2016-02-11

申请人： SCHOTT AG

发明人： Urban Weber ,  Volker Hagemann ,  Peter Brix ,  Michael Kluge

IPC分类号： H01S3/00 ,  F21V29/502 ,  G02B5/02 ,  C04B37/02 ,  F21V29/70 ,  C04B37/00 ,  F21V7/22 ,  F21V13/08 ,  B23K1/20 ,  B23K35/30 ,  B23K37/06

CPC分类号： F21V29/502 ,  B23K1/203 ,  B23K35/3006 ,  B23K37/06 ,  C04B37/003 ,  C04B37/026 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/72 ,  C04B2237/10 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/407 ,  F21V7/22 ,  F21V13/08 ,  F21V29/70 ,  G02B5/0236 ,  G02B5/0268 ,  G02B5/0294

摘要： An assembly is provided that includes a ceramic converter for converting light having a first wavelength into light having a second wavelength, a metal-containing reflective coating, and a cooling element. The surface of the ceramic converter is at least partly coated with the metal-containing reflective coating. The coating dissipates the heat from the converter into the cooling element. The cooling element and the metal-containing reflective coating are connected to one another by a metallic solder connection.