公开(公告)号：US11457529B2

公开(公告)日：2022-09-27

申请号：US17282410

申请日：2019-09-27

Applicant: ZTE CORPORATION

Inventor： Changgang Yin ,  Yingxin Wang ,  Bi Yi ,  Huazhang Cao

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H01L21/768 ,  H01L23/48 ,  H01L23/66 ,  H05K3/00

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.