Thermal Control System for Closed Electronic Platform
    1.
    发明申请
    Thermal Control System for Closed Electronic Platform 审中-公开
    封闭电子平台热控系统

    公开(公告)号:US20160299544A1

    公开(公告)日:2016-10-13

    申请号:US15033075

    申请日:2014-05-29

    Abstract: The embodiments of disclosure disclose a thermal control system for a closed electronic platform, which includes two mutually independent heat exchange cavities; each heat exchange cavity is provided with an air inlet and an air outlet; one heat exchanger is arranged in each of the two heat exchange cavities; the two heat exchangers are interconnected with each other through guide pipes to form a working medium circulating loop; each of tow heat exchangers includes a plurality of microchannel thermo-capillaries and two runoff gathering pits; the plurality of microchannel thermo-capillaries are arranged between the two runoff gathering pits in a parallel connection manner; the runoff gathering pits of the two heat exchangers are connected through the guide pipes, wherein each of the plurality of microchannels which is arranged in parallel are formed in each microchannel thermo-capillary. Thus improving a heat dissipation efficiency of the thermal control system.

    Abstract translation: 本公开的实施例公开了一种用于封闭电子平台的热控制系统,其包括两个相互独立的热交换腔; 每个热交换空腔设有空气入口和出气口; 在两个热交换腔中的每一个中设置一个热交换器; 两个热交换器通过导管相互连接,形成工作介质循环回路; 每个丝束式热交换器包括多个微通道热毛细管和两个径流聚集凹坑; 多个微通道热毛细管以并联的方式布置在两个径流收集坑之间; 两个热交换器的径流收集坑通过导管连接,其中平行布置的多个微通道中的每一个形成在每个微通道热毛细管中。 从而提高热控制系统的散热效率。

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