摘要:
A method for patterning and forming very small structures on a substrate such as a wafer. The process uses a difference in surface energy between a mask and the substrate to selectively deposit a hard mask material such as a metal onto the surface of the substrate. The mask can be formed extremely thin, such as only an atomic mono-layer thick, and can be patterned by ion beam photolithography. The pattern can, therefore, be formed with extremely high resolution. The thin mask layer can be constructed of various materials and can be constructed of perfluoropolyether diacrylate (PDA), which can be dip coated to and exposed to form a desirable positive photoresist mask layer.
摘要:
A method for patterning and forming very small structures on a substrate such as a wafer. The process uses a difference in surface energy between a mask and the substrate to selectively deposit a hard mask material such as a metal onto the surface of the substrate. The mask can be formed extremely thin, such as only an atomic mono-layer thick, and can be patterned by ion beam photolithography. The pattern can, therefore, be formed with extremely high resolution. The thin mask layer can be constructed of various materials and can be constructed of perfluoropolyether diacrylate (PDA), which can be dip coated to and exposed to form a desirable positive photoresist mask layer.
摘要:
A method for patterning and forming very small structures on a substrate such as a wafer. The process uses a difference in surface energy between a mask and the substrate to selectively deposit a hard mask material such as a metal onto the surface of the substrate. The mask can be formed extremely thin, such as only an atomic mono-layer thick, and can be patterned by ion beam photolithography. The pattern can, therefore, be formed with extremely high resolution. The thin mask layer can be constructed of various materials and can be constructed of perfluorpolyether diacrylate (PDA), which can be dip coated to and exposed to form a desirable positive photoresist mask layer.
摘要:
A method according to one embodiment comprises detecting a change in a rotational velocity of a magnetic disk or a spindle coupled to the magnetic disk, the change being caused by head-disk contact. A method for detecting head-disk contact according to another embodiment comprises measuring a rotational velocity of a magnetic disk or a spindle coupled to the magnetic disk; detecting a change in the rotational velocity, the change being caused by head-disk contact; and correlating the change in rotational velocity with the head-disk contact.
摘要:
A method according to one embodiment comprises detecting a change in a rotational velocity of a magnetic disk or a spindle coupled to the magnetic disk, the change being caused by head-disk contact. A method for detecting head-disk contact according to another embodiment comprises measuring a rotational velocity of a magnetic disk or a spindle coupled to the magnetic disk; detecting a change in the rotational velocity, the change being caused by head-disk contact; and correlating the change in rotational velocity with the head-disk contact.
摘要:
A method and system for determining contact potential voltages between a slider body and a hard disk of a hard disk drive. In embodiments of the present invention, at least one continuous negative direct current (DC) voltage is applied between a slider body and a hard disk of a hard disk drive. Then, at least one continuous positive direct current (DC) voltage is applied between the slider body and the hard disk. A contact potential voltage between the slider body and the hard disk is then determined in response to the applying of the direct current voltages.
摘要:
A magnetic recording disk with pre-patterned surface features of elevated lands and recessed grooves or trenches, like a discrete-track media (DTM) or bit-patterned media (BPM) disk, has a planarized surface. A multilayered disk overcoat is used to protect the recording layer, and at least one of the overcoat layers functions as a stop layer for terminating a chemical-mechanical polishing (CMP) process that substantially planarizes the disk. All of the layers of the multilayered overcoat are located above the lands, but none of the overcoat layers, or a number of layers less than the number of layers over the lands, is located above the recesses.
摘要:
A magnetic recording disk drive achieves continuous contact recording with a head-suspension assembly that compensates for the moment generated from an adhesive force between the head carrier or slider and the disk. The slider pivot point, which is the point where the load force is applied to the flexure that supports the slider, is located closer to the front end of the slider than the net force applied by the air-bearing surface of the slider when the disk is rotating at its operational speed. This assures that the net air-bearing force generates a moment about the pivot point to partially counteract the flexure moment and the moment generated from the adhesive force between the disk and the slider's contact pad.
摘要:
Reactive monomers of cyanate esters are vapor deposited onto thin film disks used for magnetic recording. The monomer films are then irradiated with ultraviolet (UV) light to polymerize the deposited monomer to form a solid, robust polycyanate ester overlayer on the disk that becomes smoother, more corrosion resistant and, when lubricated, more durable than disks without the overlayer. The polycyanate ester overlayer can either replace the conventional carbon overcoat or allow a substantially thinner carbon overcoat to be used.
摘要:
A magnetic recording disk with pre-patterned surface features of elevated lands and recessed grooves or trenches, like a discrete-track media (DTM) or bit-patterned media (BPM) disk, has a planarized surface. A multilayered disk overcoat is used to protect the recording layer, and at least one of the overcoat layers functions as a stop layer for terminating a chemical-mechanical polishing (CMP) process that substantially planarizes the disk. All of the layers of the multilayered overcoat are located above the lands, but none of the overcoat layers, or a number of layers less than the number of layers over the lands, is located above the recesses.