公开(公告)号：US09269832B2

公开(公告)日：2016-02-23

申请号：US13915523

申请日：2013-06-11

申请人： ams International AG

发明人： Axel Nackaerts ,  Willem Frederik Adrianus Besling ,  Klaus Reimann

IPC分类号： H01L29/84 ,  H04R23/00 ,  H01L21/00 ,  H01L21/20 ,  H01L21/28 ,  B81C1/00 ,  G01L9/00

CPC分类号： G01L9/0073 ,  B81B7/008 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01L9/0042 ,  H01L21/28 ,  H01L29/84

摘要： Disclosed is an integrated circuit (100), comprising a semiconductor substrate (110) carrying a plurality of circuit elements; and a pressure sensor including a cavity (140) on said semiconductor substrate, said cavity comprising a pair of electrodes (120, 122) laterally separated from each other; and a flexible membrane (130) over and spatially separated from said electrodes such that said membrane interferes with a fringe field between said electrodes, said membrane comprising at least one aperture (132). A method of manufacturing such an IC is also disclosed.

摘要翻译： 公开了一种集成电路（100），包括承载多个电路元件的半导体衬底（110）; 和包括在所述半导体衬底上的空腔（140）的压力传感器，所述空腔包括彼此横向分离的一对电极（120,122）; 以及在所述电极之间和空间上分离的柔性膜（130），使得所述膜干扰所述电极之间的边缘场，所述膜包括至少一个孔（132）。 还公开了制造这种IC的方法。

公开(公告)号：US10060817B2

公开(公告)日：2018-08-28

申请号：US15258988

申请日：2016-09-07

申请人： ams International AG

发明人： Axel Nackaerts ,  Willem Frederik Adrianus Besling ,  Klaus Reimann

IPC分类号： H01L29/84 ,  G01L9/00 ,  H01L21/28 ,  B81C1/00 ,  B81B7/00

CPC分类号： G01L9/0073 ,  B81B7/008 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01L9/0042 ,  H01L21/28 ,  H01L29/84

摘要： Disclosed is an integrated circuit, comprising a semiconductor substrate carrying a plurality of circuit elements; and a pressure sensor including a cavity on said semiconductor substrate, said cavity comprising a pair of electrodes laterally separated from each other; and a flexible membrane over and spatially separated from said electrodes such that said membrane interferes with a fringe field between said electrodes, said membrane comprising at least one aperture. A method of manufacturing such an IC is also disclosed.

公开(公告)号：US09481570B2

公开(公告)日：2016-11-01

申请号：US15050418

申请日：2016-02-22

申请人： ams International AG

发明人： Axel Nackaerts ,  Willem Frederik Adrianus Besling ,  Klaus Reimann

IPC分类号： H01L29/84 ,  H01L21/00 ,  H01L21/20 ,  B81C1/00 ,  G01L9/00

CPC分类号： G01L9/0073 ,  B81B7/008 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01L9/0042 ,  H01L21/28 ,  H01L29/84

摘要： Disclosed is an integrated circuit, comprising a semiconductor substrate carrying a plurality of circuit elements; and a pressure sensor including a cavity on said semiconductor substrate, said cavity comprising a pair of electrodes laterally separated from each other; and a flexible membrane over and spatially separated from said electrodes such that said membrane interferes with a fringe field between said electrodes, said membrane comprising at least one aperture. A method of manufacturing such an IC is also disclosed.

摘要翻译： 公开了一种集成电路，包括承载多个电路元件的半导体衬底; 以及包括在所述半导体衬底上的空腔的压力传感器，所述空腔包括彼此横向分离的一对电极; 以及在所述电极之间和空间上分离的柔性膜，使得所述膜干扰所述电极之间的边缘场，所述膜包括至少一个孔。 还公开了制造这种IC的方法。