公开(公告)号：US20230102780A1

公开(公告)日：2023-03-30

申请号：US17798855

申请日：2021-02-09

Applicant: ams-OSRAM International GmbH

Inventor： Berthold HAHN ,  Matthias GOLDBACH ,  Georg BOGNER

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: An optoelectronic device includes a glass carrier, at least one light-scattering layer applied to the glass carrier, and at least one surface-emitting component in a chip size package with an emission surface and a surface facing away from the emission surface having a first and a second contact pad. The emission surface is arranged on the at least one light-scattering layer by way of an adhesive. At least one contact line contacts the second contact pad of the at least one surface-emitting component and extends along a side surface of the at least one surface-emitting component adjacent to the second contact pad in a direction of the glass carrier. A light-shaping structure is arranged on a surface of the glass carrier facing away from the surface-emitting component.