公开(公告)号：US20250158354A1

公开(公告)日：2025-05-15

申请号：US18833053

申请日：2023-01-27

Applicant: ams-OSRAM International GmbH

Inventor： Elmar BAUR ,  Thomas KIPPES ,  Jan MARFELD ,  Joerg Erich SORG

IPC: H01S5/024 ,  H01S5/02315 ,  H01S5/042

Abstract: The invention relates to a laser package comprising a laser device configured to emit laser radiation through at least one laser facet on a front side surface of the laser device; an electrically conductive heat sink; and a contact layer between the laser device and the electrically conductive heat sink comprising a nanowire structure formed of an electrically conductive material. The contact layer comprises at least one first region and at least one second region, and the at least one first region has a higher material density of the electrically conductive material than the at least one second region. In addition, the at least one first region is arranged adjacent to the at least one laser facet.

公开(公告)号：US20250141179A1

公开(公告)日：2025-05-01

申请号：US18837239

申请日：2022-12-07

Applicant: ams-OSRAM International GmbH

Inventor： Elmar BAUR ,  Jan SEIDENFADEN ,  Thomas KIPPES

IPC: H01S5/0235 ,  H01S5/0225 ,  H01S5/028

Abstract: The invention relates to a laser component including a semiconductor laser chip having a laser facet with an active zone, and an optical element which is mounted after the semiconductor laser chip on the laser facet, wherein the semiconductor laser chip and the optical element are connected to each other by a welding connection that is free from welding additives.