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公开(公告)号：US20240275127A1
公开(公告)日：2024-08-15
申请号：US18568308
申请日：2022-06-09
发明人： Jörg Erich SORG , Erik HEINEMANN , André SOMERS , Thomas KIPPES , Sebastian SCHLEGL , Matthias HEIDEMANN
IPC分类号： H01S5/042 , H01S5/02315 , H01S5/22
CPC分类号： H01S5/04257 , H01S5/02315 , H01S5/22
摘要： A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side having connection pads configured for electrical linking of the emitter regions. The connection pads are p-contacts or n-contacts, with, in a plan view, all connection pads (which are configured either as p-contacts or as n-contacts overlapping with at least two of the emitter regions in each case and each of these connection pads being configured for electrical linking of only one of the emitter regions. Moreover, a component is specified, in particular comprising at least one such semiconductor chip.
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公开(公告)号：US20240260186A1
公开(公告)日：2024-08-01
申请号：US18561274
申请日：2022-05-17
发明人： Thomas KIPPES , Joerg Erich SORG
CPC分类号： H05K1/111 , H05K3/0061 , H05K3/341 , H05K2201/10121 , H05K2203/1173
摘要： The invention relates to an optoelectronic assembly with an optoelectronic component with two or more connecting contacts for feeding supply and/or control signals. A housing with a two-dimensional structured underside has two or more solder pads which are each surrounded by a non-wettable region, wherein the solder pads are guided through the underside of the housing and are connected to the plurality of connecting contacts. Furthermore, the underside of the housing comprises two or more solder surfaces which are each surrounded by a non-wettable region. The two or more solder pads and the solder surfaces are thereby substantially uniformly distributed over the underside of the housing.
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