公开(公告)号：US20240275127A1

公开(公告)日：2024-08-15

申请号：US18568308

申请日：2022-06-09

申请人： ams-OSRAM International GmbH

发明人： Jörg Erich SORG ,  Erik HEINEMANN ,  André SOMERS ,  Thomas KIPPES ,  Sebastian SCHLEGL ,  Matthias HEIDEMANN

IPC分类号： H01S5/042 ,  H01S5/02315 ,  H01S5/22

CPC分类号： H01S5/04257 ,  H01S5/02315 ,  H01S5/22

摘要： A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side having connection pads configured for electrical linking of the emitter regions. The connection pads are p-contacts or n-contacts, with, in a plan view, all connection pads (which are configured either as p-contacts or as n-contacts overlapping with at least two of the emitter regions in each case and each of these connection pads being configured for electrical linking of only one of the emitter regions. Moreover, a component is specified, in particular comprising at least one such semiconductor chip.