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公开(公告)号：US20240275127A1
公开(公告)日：2024-08-15
申请号：US18568308
申请日：2022-06-09
发明人： Jörg Erich SORG , Erik HEINEMANN , André SOMERS , Thomas KIPPES , Sebastian SCHLEGL , Matthias HEIDEMANN
IPC分类号： H01S5/042 , H01S5/02315 , H01S5/22
CPC分类号： H01S5/04257 , H01S5/02315 , H01S5/22
摘要： A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side having connection pads configured for electrical linking of the emitter regions. The connection pads are p-contacts or n-contacts, with, in a plan view, all connection pads (which are configured either as p-contacts or as n-contacts overlapping with at least two of the emitter regions in each case and each of these connection pads being configured for electrical linking of only one of the emitter regions. Moreover, a component is specified, in particular comprising at least one such semiconductor chip.
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公开(公告)号：US11955768B2
公开(公告)日：2024-04-09
申请号：US18183506
申请日：2023-03-14
申请人： NICHIA CORPORATION
发明人： Kiyoshi Enomoto
IPC分类号： H01S5/02257 , H01S5/02216 , H01S5/02255 , H01S5/02315 , H01S5/02345 , H01S5/40
CPC分类号： H01S5/02257 , H01S5/02216 , H01S5/02255 , H01S5/02315 , H01S5/02345 , H01S5/4031 , H01S5/4093
摘要： A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.
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公开(公告)号：US11955403B2
公开(公告)日：2024-04-09
申请号：US17206275
申请日：2021-03-19
发明人： Yasuyuki Kimura , Takumi Ikeda
IPC分类号： H01L23/373 , H01L23/31 , H01L23/367 , H01L23/38 , H01L33/48 , H01L33/64 , H01S5/0231 , H01S5/02315
CPC分类号： H01L23/373 , H01L23/31 , H01L23/367 , H01L23/38 , H01L33/483 , H01L33/641 , H01S5/0231 , H01S5/02315
摘要： A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.
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公开(公告)号：US20240071788A1
公开(公告)日：2024-02-29
申请号：US18270610
申请日：2021-12-30
申请人： Viatron Co., Ltd.
发明人： Hyoung June Kim , Byung Kuk Kim , Wang Jun Park , Jin Hong Lee , Nam Chun Lee
IPC分类号： H01L21/67 , H01S5/02315 , H01S5/024 , H05B3/00 , H05B3/03
CPC分类号： H01L21/67115 , H01S5/02315 , H01S5/02423 , H05B3/0047 , H05B3/03 , H05B2203/025
摘要： The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.
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5.发明公开公开(公告)号：US20240006841A1
公开(公告)日：2024-01-04
申请号：US18255124
申请日：2021-11-29
发明人： Jörg Erich SORG
IPC分类号： H01S5/02315 , H01S5/0237 , H01S5/22 , H01S5/042
CPC分类号： H01S5/02315 , H01S5/0237 , H01S5/22 , H01S5/04256
摘要： The invention relates to a radiation-emitting laser component including:—an edge-emitting laser diode which is designed to generate electromagnetic laser radiation, and—a substrate, on which the edge-emitting laser diode is arranged, wherein—the edge-emitting laser diode has a contact layer,—the substrate has a substrate web, and—the contact layer is connected to the substrate web by means of a solder layer in a mechanically stable manner. The invention also relates to a method for producing a radiation-emitting laser component.
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公开(公告)号：US20230361096A1
公开(公告)日：2023-11-09
申请号：US18068252
申请日：2022-12-19
发明人： Wei SHI , Kevin WANG , Michael MILLER , Steve CHUENG , Mikhail DOLGANOV , Lijun ZHU
IPC分类号： H01L25/16 , H01S5/183 , H01S5/02208 , H01S5/02253 , H01S5/02315 , H01S5/0239 , H01S5/026
CPC分类号： H01L25/167 , H01L25/165 , H01S5/18388 , H01S5/02208 , H01S5/02253 , H01S5/02315 , H01S5/0239 , H01S5/0261 , H01S5/02257
摘要： An optical package may include a fan-out-wafer-level-packaging (FOWLP) sub-package including a redistribution layer (RDL) on a molded component including an electrical chip. The optical package may include an optical chip over the FOWLP sub-package. The optical chip may be electrically connected to the RDL. An area of a surface of the RDL may be larger than an area of a surface of the optical chip. The optical package may include a package housing over the optical chip such that light to be received or transmitted by the optical chip may is to pass through the package housing.
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公开(公告)号：US11764540B2
公开(公告)日：2023-09-19
申请号：US17620729
申请日：2020-06-30
发明人： Ronny Costi , Gilad Reut Gelbart
IPC分类号： H01S5/02315 , H01S5/0237 , H01S5/02345 , H01S5/02 , H01S5/024 , H05K1/02 , H05K1/11 , H05K3/42
CPC分类号： H01S5/02315 , H01S5/0216 , H01S5/0237 , H01S5/02345 , H01S5/02469 , H01S5/02476 , H05K1/0206 , H05K1/0209 , H05K1/113 , H05K1/118 , H05K3/422 , H05K2201/09445 , H05K2201/09509 , H05K2203/073
摘要： A method is disclosed for mounting and cooling a circuit component having a plurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive material having and electrically insulating regions with a circuit board arranged between the circuit component and the substrate. The circuit board, which carries conductive traces that terminate in contact pads, is secured to the substrate with at least some of the contact pads on the circuit board disposed on the side of the board facing the substrate, some of which being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate.
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公开(公告)号：US20230223738A1
公开(公告)日：2023-07-13
申请号：US18001007
申请日：2020-12-08
发明人： Seiji NAKANO , Norio OKADA
IPC分类号： H01S5/0239 , H01S5/02253 , H01S5/0231 , H01S5/02315 , H01S5/00
CPC分类号： H01S5/0239 , H01S5/02253 , H01S5/0231 , H01S5/02315 , H01S5/0085
摘要： A lead pin (2a,2b) penetrates a metal stem (1). A support block (3) is mounted on the metal stem (1). A dielectric substrate (4) is mounted on a side surface of the support block (3). A signal line (5a,5b) is formed on the dielectric substrate (4). One end of the signal line (5a,5b) is connected to the lead pin (2a,2b). A semiconductor optical modulation device (6) is mounted on the dielectric substrate (4). A conductive wire (8a,8b) connects the other end of the signal line (5a,5b) and the semiconductor optical modulation device (6). The semiconductor optical modulation device (6) includes a plurality of optical modulators (6b,6c) separated from each other.
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公开(公告)号：US20230223737A1
公开(公告)日：2023-07-13
申请号：US18185423
申请日：2023-03-17
发明人： Kouji OOMORI
IPC分类号： H01S5/0233 , H01S5/042 , H01S5/024
CPC分类号： H01S5/0233 , H01S5/04254 , H01S5/02469 , H01S5/02315
摘要： First block (10) and second block (20) are placed on top of each other with insulation sheet (45) interposed therebetween. First adherend surface (12) and second adherend surface (22) are provided on a facing surface of first block (10) and a facing surface of second block (20), respectively. Adhesive (50) is applied to first adherend surface (12) and second adherend surface (22). First block (10) and second block (20) are bonded to each other with adhesive (50).
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公开(公告)号：US20230154818A1
公开(公告)日：2023-05-18
申请号：US18053457
申请日：2022-11-08
发明人： Katsuya NAKAZAWA
IPC分类号： H01L23/367 , H01L23/373 , H01L23/492 , H01S5/02315
CPC分类号： H01L23/367 , H01L23/3736 , H01L23/4922 , H01S5/02315
摘要： A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.
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