METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRONIC COMPONENTS

    公开(公告)号:US20240258764A1

    公开(公告)日:2024-08-01

    申请号:US18561240

    申请日:2022-05-23

    Abstract: In an embodiment a method includes providing at least one semiconductor wafer, which has a semiconductor layer sequence and a plurality of single diode elements arranged next to and connected to one another, generating thermally induced predetermined breaking locations in the semiconductor layer sequence between the single diode elements using first laser radiation, arranging the semiconductor wafer on a carrier, and connecting the semiconductor wafer to the carrier, the single diode elements being at least partially separated from one another at the thermally induced predetermined breaking locations, wherein thermally induced predetermined breaking locations are generated in the carrier using second laser radiation so that the carrier has a plurality of carrier elements connected to one another, and wherein the carrier elements are separated from one another at the predetermined breaking locations by a connecting process.

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