公开(公告)号：US20240145615A1

公开(公告)日：2024-05-02

申请号：US18278221

申请日：2022-02-22

Applicant: ams-OSRAM International GmbH

Inventor： Tim BOESCKE ,  Maximilian ASSIG ,  Thomas SCHWARZ ,  Andreas WALDSCHIK

IPC: H01L31/173 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216

CPC classification number: H01L31/173 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02164

Abstract: A sensor device includes a carrier having a via for guiding an electrical contact from a bottom surface to a top surface of the carrier. The device also includes an integrated circuit on the carrier, a sensor element, an optoelectronic component on the top surface of the carrier, and a first electrically conductive contact element on the via an electrically connected thereto. The device further includes a substantially opaque encapsulation material enclosing the sensor element, the optoelectronic component, and the first electrically conductive contact element such that a surface of the sensor element and of the optoelectronic component opposite the carrier is uncovered by the encapsulation material. The device additionally includes a first conductor track on the encapsulation material electrically connecting the first electrically conductive contact element and the integrated circuit, and a second conductor track on the encapsulation material electrically connecting the integrated circuit with the optoelectronic component.