OPTOELECTRONIC DEVICE
    1.
    发明申请

    公开(公告)号:US20240387767A1

    公开(公告)日:2024-11-21

    申请号:US18694144

    申请日:2022-08-17

    Abstract: An optoelectronic device is specified having a transmitter which is designed to emit electromagnetic radiation and to be operated at an input voltage, a support for the transmitter, said support having a top surface and a bottom surface, a first receiver which is designed to receive at least part of the electromagnetic radiation and to supply at least part of an output voltage, wherein the transmitter comprises at least one surface emitter, the at least one surface emitter of the transmitter is mounted on the top surface of the support and radiates at least part of the electromagnetic radiation through the support, the first receiver (3) comprises at least one photodiode, and the first receiver is arranged on the bottom surface of the support.

    SENSOR DEVICE
    3.
    发明公开
    SENSOR DEVICE 审中-公开

    公开(公告)号:US20240145615A1

    公开(公告)日:2024-05-02

    申请号:US18278221

    申请日:2022-02-22

    CPC classification number: H01L31/173 H01L31/02005 H01L31/0203 H01L31/02164

    Abstract: A sensor device includes a carrier having a via for guiding an electrical contact from a bottom surface to a top surface of the carrier. The device also includes an integrated circuit on the carrier, a sensor element, an optoelectronic component on the top surface of the carrier, and a first electrically conductive contact element on the via an electrically connected thereto. The device further includes a substantially opaque encapsulation material enclosing the sensor element, the optoelectronic component, and the first electrically conductive contact element such that a surface of the sensor element and of the optoelectronic component opposite the carrier is uncovered by the encapsulation material. The device additionally includes a first conductor track on the encapsulation material electrically connecting the first electrically conductive contact element and the integrated circuit, and a second conductor track on the encapsulation material electrically connecting the integrated circuit with the optoelectronic component.

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