-
公开(公告)号：US20240361352A1
公开(公告)日：2024-10-31
申请号：US18644107
申请日：2024-04-24
发明人： Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
CPC分类号： G01R1/0466 , G01R31/2863
摘要： A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.
-
公开(公告)号：US20240364050A1
公开(公告)日：2024-10-31
申请号：US18645432
申请日：2024-04-25
发明人： Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
IPC分类号： H01R13/629 , H01R12/72 , H01R13/04
CPC分类号： H01R13/629 , H01R12/727 , H01R13/04
摘要： A test connector tests the electrical characteristics of a semiconductor device, the test connector including a housing; a plurality of wafers having a plurality of coupling parts arranged at regular intervals on one side and stacked standing upright on the housing; a guide part having a width smaller than that of the plurality of coupling parts and arranged on one surface of the plurality of coupling parts; connector pins provided on both sides of the guide part, wherein the guide part includes a first introduction portion and a second introduction portion inclined in the center direction on both sides of an end thereof and the positions of the first introduction portion and the second introduction portion are different.
-
公开(公告)号：US20240159794A1
公开(公告)日：2024-05-16
申请号：US18218029
申请日：2023-07-04
发明人： Jin Kook JUN , Chan Ho Lee , Jae Hyun SEO
CPC分类号： G01R1/0466 , G01R31/2886
摘要： A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.
-
公开(公告)号：US20230314472A1
公开(公告)日：2023-10-05
申请号：US18130431
申请日：2023-04-04
发明人： Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
CPC分类号： G01R1/0466 , G01R31/2863
摘要： A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
