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公开(公告)号:US20240322497A1
公开(公告)日:2024-09-26
申请号:US18261686
申请日:2022-01-11
发明人: Byoung Nam Kim , Kyoung Il Kang , Joung Min Park , Sung Cheol Cho , Jin Kook Jun , Sung Gyu Park , Jong Wook Ham
IPC分类号: H01R13/6585 , H01R12/75
CPC分类号: H01R13/6585 , H01R12/75
摘要: A connector assembly according to the present invention comprises a receptacle connector and a plug connector vertically coupled to the receptacle connector, the plug connector including: a signal pin having one side in electrical contact with a signal line of a cable and the other side in elastic contact with a clip pin of the receptacle connector; a shield can formed to enclose the signal pin such that the other side of the signal pin is exposed downwards and to be electrically spaced apart from the signal pin; a first insulating member coupled to the signal pin to insulate between the signal pin and the shield can; and a plug shell which has an open lower portion and encloses an upper surface and a side surface of the shield can to expose the other side of the signal pin downwards, the receptacle connector including: a clip pin which has a lower portion in contact with a signal pad of a circuit board and an upper portion in elastic contact with the other side of the signal pin; a receptacle base which is formed to be installed on the circuit board and provides a space in which the clip pin is accommodated; and a second insulating member to which the clip pin is coupled and which encloses the side surfaces of the clip pin to insulate between the clip pin and the receptacle base.
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公开(公告)号:US20240264201A1
公开(公告)日:2024-08-08
申请号:US18435029
申请日:2024-02-07
发明人: Jin Kook JUN , Sang Hoon CHA
IPC分类号: G01R1/067
CPC分类号: G01R1/06722
摘要: A pogo pin whose elastic force can be adjusted according to a contacting direction is disclosed. According to an aspect of the present invention, provided is a pogo pin with adjustable elastic force, including: a housing; plunger pins mounted on ends of the housing to directly contact a measurement object; and a spring installed inside the housing to provide elastic force so that the plunger pin contacts the measurement object, wherein a local fixing part protruding inward is formed on one side of the housing so that a first position of the spring can be pressed and fixed.
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公开(公告)号:US20240194509A1
公开(公告)日:2024-06-13
申请号:US18583621
申请日:2024-02-21
发明人: Jin Kook JUN , Sung Gye PARK , Soung Hun CHOI
IPC分类号: H01L21/677 , H01F7/02
CPC分类号: H01L21/67721 , H01F7/0252
摘要: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
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公开(公告)号:US20240159794A1
公开(公告)日:2024-05-16
申请号:US18218029
申请日:2023-07-04
发明人: Jin Kook JUN , Chan Ho Lee , Jae Hyun SEO
CPC分类号: G01R1/0466 , G01R31/2886
摘要: A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.
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公开(公告)号:US20180188290A1
公开(公告)日:2018-07-05
申请号:US15741213
申请日:2016-07-04
发明人: Sung Gye PARK , Jin Kook JUN
CPC分类号: G01R3/00 , G01R1/0433 , G01R31/2863 , G01R31/2896 , H05K1/0268 , H05K1/028 , H05K1/111 , H05K3/103 , H05K3/28 , H05K3/285 , H05K3/3484 , H05K3/4007 , H05K3/4015 , H05K2201/0154 , H05K2201/0162 , H05K2201/09827 , H05K2201/10234 , H05K2201/10265 , H05K2201/10287 , H05K2201/10757 , H05K2201/10795 , H05K2201/10856 , H05K2203/041 , H05K2203/1327 , H05K2203/166
摘要: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.
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公开(公告)号:US20240364050A1
公开(公告)日:2024-10-31
申请号:US18645432
申请日:2024-04-25
发明人: Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
IPC分类号: H01R13/629 , H01R12/72 , H01R13/04
CPC分类号: H01R13/629 , H01R12/727 , H01R13/04
摘要: A test connector tests the electrical characteristics of a semiconductor device, the test connector including a housing; a plurality of wafers having a plurality of coupling parts arranged at regular intervals on one side and stacked standing upright on the housing; a guide part having a width smaller than that of the plurality of coupling parts and arranged on one surface of the plurality of coupling parts; connector pins provided on both sides of the guide part, wherein the guide part includes a first introduction portion and a second introduction portion inclined in the center direction on both sides of an end thereof and the positions of the first introduction portion and the second introduction portion are different.
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公开(公告)号:US12088053B2
公开(公告)日:2024-09-10
申请号:US17719506
申请日:2022-04-13
发明人: Byoung Nam Kim , Kyoung Il Kang , Jin Woo Lee , Jin Kook Jun , Sung Gyu Park , Hyun Duk Kim , Jong Wook Ham , Sang Woo Han
IPC分类号: H01R9/05 , H01R13/17 , H01R13/502
CPC分类号: H01R9/05 , H01R13/17 , H01R13/502
摘要: Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.
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公开(公告)号:US20210233789A1
公开(公告)日:2021-07-29
申请号:US17154253
申请日:2021-01-21
发明人: Jin Kook JUN , Sung Gye PARK , Soung Hun CHOI
IPC分类号: H01L21/677 , H01F7/02
摘要: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
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公开(公告)号:US20210190822A1
公开(公告)日:2021-06-24
申请号:US17193449
申请日:2021-03-05
发明人: Jin Kook JUN , Sang Hoon CHA , Chang Mo JEONG
IPC分类号: G01R1/067
摘要: A three-layer micro electro mechanical system (MEMS) spring pin includes a lower-layer spring pin in which a lower-layer wave is disposed between and connected to a lower-layer top plunger and a lower-layer bottom plunger, an upper-layer spring pin in which an upper-layer wave is disposed between and connected to an upper-layer top plunger and an upper-layer bottom plunger, a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger, and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the above-described structure, effects are expected in which bending is prevented, a stroke is stabilized due to the multi-layer spring, and contact characteristics are enhanced due to the multi-layer plunger.
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公开(公告)号:US20240361352A1
公开(公告)日:2024-10-31
申请号:US18644107
申请日:2024-04-24
发明人: Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
CPC分类号: G01R1/0466 , G01R31/2863
摘要: A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.
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