PLASMA TREATMENT FOR MULTILAYER ADHESIVE BONDING ELEMENT

    公开(公告)号:US20180112107A1

    公开(公告)日:2018-04-26

    申请号:US15783527

    申请日:2017-10-13

    Applicant: TESA SE

    Abstract: Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).

    METHOD FOR BONDING A COVER MATERIAL TO A SHAPED ARTICLE

    公开(公告)号:US20170173858A1

    公开(公告)日:2017-06-22

    申请号:US15363528

    申请日:2016-11-29

    Applicant: TESA SE

    Abstract: Method for bonding a sheetlike cover material to a shaped article, using an adhesive film comprising at least one layer of a heat-activatedly bondable adhesive, where the adhesive film is disposed, over the full area or a partial area, between the cover material and the shaped article, the heat-activatedly bondable adhesive as yet not adhering to the shaped article, wherein the cover material is pulled onto the shaped article under tension, so that the layer of the heat-activatedly bondable adhesive contacts the shaped article, and the activation of the heat-activatedly bondable adhesive is brought about by means of the pressure resulting exclusively from the tension, and optionally of heat introduced by means of external energy supply, whereby the heat-activatedly bondable adhesive adheres to the shaped article and a durable connection of the cover material to the shaped article is produced.

Patent Agency Ranking