摘要:
A card comprising an electronic element (2) and a coil (42) having its ends directly coupled to the electronic element are encased in a binding material (10). A positioning structure (46) for the electronic element is located in a layer (38) formed by the binding material.
摘要:
One object of the invention concerns a card comprising an electronic element (2) and a coil (42), the ends of which are directly coupled to the electronic element, such latter and the coil being encased in a binding material (10). Another object of the invention concerns a card comprising an electronic element (2) encased in a binding material (10) and a positioning structure (46) for the electronic element, such structure being located in a layer (38) formed by the binding material. The present invention also concerns a method of manufacture for cards according to the invention.