公开(公告)号：US20100258638A1

公开(公告)日：2010-10-14

申请号：US12498768

申请日：2009-07-07

申请人： Philippe Guillaud ,  Cyril Lalo ,  Francois Droz

发明人： Philippe Guillaud ,  Cyril Lalo ,  Francois Droz

IPC分类号： G06K19/06

CPC分类号： G06K19/07345

摘要： The invention concerns an electronic card including means for transmitting a signal to a user of said electronic card, an electronic unit, an electric energy source, a switch that can be actuated by a user of the electronic card and an application introduced into said electronic unit. The card further includes means for detecting actuation of said switch, arranged so as to determine whether said actuation ends within a first time interval from the start of actuation (t0), the end of said first time interval occurring after transmission (t1) of a signal perceptible to the card user, or for determining whether said switch actuation ends within a second time interval (T2max) from the start of transmission (t1) of said user perceptible signal, said application being actuated or the actuation thereof validated when said detection means have detected the end (t2) of said switch actuation within said first interval or said second time interval.

摘要翻译： 本发明涉及电子卡，其包括用于向所述电子卡的用户发送信号的装置，电子单元，电能源，可由电子卡的用户启动的开关和引入到所述电子单元中的应用 。 卡还包括用于检测所述开关的致动的装置，其布置成确定所述致动是否在从启动开始（t0）开始的第一时间间隔内结束，所述第一时间间隔的结束发生在传输（t1）之后 或者用于在从所述用户可感知信号的发送开始（t1）开始的第二时间间隔（T2max）内确定所述开关致动是否结束，所述应用被激活或者当所述检测装置 已经在所述第一间隔或所述第二时间间隔内检测到所述开关致动的结束（t2）。

公开(公告)号：US06206291B1

公开(公告)日：2001-03-27

申请号：US08836475

申请日：1997-07-08

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： G06K1902

CPC分类号： G06K19/07779 ,  G06K19/077 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07781 ,  H01L2924/0002 ,  H01L2924/00

摘要： A card (1) including a lower layer (2) and a layer (4) of solidified binder (6) in which various elements are incorporated, in particular a coil (12) electrically coupled to an electronic unit (8). The coil (12) exhibits a lower planar surface (30), the inner face (20) of the lower layer (2) exhibiting a relief (18) defining sunken valleys traversing said inner face (20).

摘要翻译： 一种包括下层（2）和固定有粘合剂（6）的层（4）的卡（1），其中结合有各种元件，特别是电耦合到电子单元（8）的线圈（12）。 线圈（12）具有下平坦表面（30），下层（2）的内表面（20）表现出浮雕（18），其形成穿过所述内表面（20）的凹陷谷。

公开(公告)号：US5399847A

公开(公告)日：1995-03-21

申请号：US59664

申请日：1993-05-12

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： B42D15/10 ,  G06K19/067 ,  G06K19/07 ,  G06K19/077 ,  H01L21/48 ,  H01L23/498 ,  G06K19/02 ,  G06K19/00 ,  G06K19/06

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/07781 ,  H01L21/4857 ,  H01L2224/48091 ,  H01L23/49855 ,  H01L2924/01068 ,  Y10T156/108

摘要： A card comprising an electronic element (2) and a coil (42) having its ends directly coupled to the electronic element are encased in a binding material (10). A positioning structure (46) for the electronic element is located in a layer (38) formed by the binding material.

摘要翻译： 包括电子元件（2）和其端部直接联接到电子元件的线圈（42）的卡被封装在绑定材料（10）中。 用于电子元件的定位结构（46）位于由结合材料形成的层（38）中。

公开(公告)号：US20060172458A1

公开(公告)日：2006-08-03

申请号：US11342911

申请日：2006-01-30

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： H01L21/50 ,  H01L21/48

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/0775 ,  H01L24/19 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/5313 ,  H01L2924/00

摘要： The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip. placement of the electronic assembly consisting of the chip and the track segment at a predetermined position on the substrate, embedding of the chip and of the track segment into the substrate. A placement device used in the process and a portable object including an electronic assembly placed according to the process are also objects of the present invention.

摘要翻译： 所公开的方法的目的是确保在来自具有小尺寸的芯片的电子组件的制造水平以及这样的组件在绝缘基板上的放置水平方面的最大精度。 该目的通过在称为基板的支撑件上的放置过程来实现，所述支撑件由至少一个电子组件构成，该电子组件包括芯片，该芯片包括在其一个面上的至少一个电触点，所述触点连接到导电轨道的一段，并且所述 通过一种放置装置来进行放置，该放置装置将所述组件保持并定位在衬底上，包括以下步骤：形成具有预定轮廓的导电轨道段，将轨道段转移到放置装置上， 所述放置装置以使得所述轨道段被放置在所述芯片的至少一个触点上的方式承载所述轨道段。 将由芯片和轨道段组成的电子组件放置在基板上的预定位置，将芯片和轨道段嵌入基板中。 在该方法中使用的放置装置和包括根据该方法放置的电子组件的便携式对象也是本发明的目的。

公开(公告)号：US20050085005A1

公开(公告)日：2005-04-21

申请号：US10497822

申请日：2002-12-10

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： G06K19/077 ,  B23K20/02 ,  H01L21/44

CPC分类号： B23K20/02 ,  B23K2101/40

摘要： The invention concerns a method for making highly cost-effective electronic modules. More particularly, said method is characterized by steps requiring simplified equipment enabling to manufacture rapidly a large amount of modules. The invention also aims at producing a reliable electronic module at a very low production cost. This is achieved by using a method for making an electronic module comprising an assembly of an insulating sheet (1) provided in the form of a tray for holding electronic components and including cells, at least an electronic component (3) placed in said cells (2), and a second insulating sheet. The method is characterized by the following steps: setting on a working surface a first insulating sheet formed by the cellular tray, said cells containing each at least an electronic component, superimposing the second insulating sheet on the first so as to close the cells containing the electronic component, cutting out the modules along an outline including at least a cell of the first insulating sheet.

摘要翻译： 本发明涉及一种制造高性价比电子模块的方法。 更具体地，所述方法的特征在于需要简化的设备使得能够快速制造大量模块的步骤。 本发明还旨在以非常低的生产成本生产可靠的电子模块。 这通过使用用于制造电子模块的方法来实现，该电子模块包括以托盘形式设置的用于保持电子部件并包括电池的绝缘片（1）的组件，至少包括放置在所述电池中的电子部件（3） 2）和第二绝缘片。 该方法的特征在于以下步骤：在工作表面上设置由蜂窝托盘形成的第一绝缘片，所述单元至少包含一个电子部件，将第二绝缘片重叠在第一绝缘片上，以封闭包含 电子部件，沿着包括至少第一绝缘片的单元的轮廓切割模块。

公开(公告)号：US5895235A

公开(公告)日：1999-04-20

申请号：US930571

申请日：1997-10-07

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： G01V3/00 ,  G01V15/00 ,  H04B1/59 ,  H05K5/00 ,  H01Q1/40 ,  H01L23/31

CPC分类号： H05K5/0095 ,  G01V15/00 ,  Y10T428/139

摘要： A device, notably a transponder, comprising an electronic arrangement and a coating formed by an envelope defining a pocket and by a solidified binding in which is embedded the electronic arrangement. The envelope presents an opening having served for the introduction of the electronic arrangement and the binding during the manufacture of the device. The external surface of the device in the region of the opening is formed by the solidified binding. For the manufacture of the device such has described hereabove, it is envisaged to use a reservoir acting to fill the pocket by the binding and to recover a surplus of provided binding, this surplus of binding and the reservoir being separated from the device after the binding has at least partially solidified.

摘要翻译： PCT No.PCT / CH96 / 00110 Sec。 371日期1997年10月7日第 102（e）日期1997年10月7日PCT 1996年3月25日PCT公布。 第WO96 / 32829号公报 日期1996年10月17日一种特别是应答器的装置，包括电子装置和由限定袋的封套形成的涂层，以及嵌入电子装置的固化装订。 信封提供了在设备制造期间引入电子装置和装订的开口。 在开口区域中的装置的外表面由凝固的结合形成。 对于如上所述的装置的制造，设想使用用于通过结合填充袋的储存器并且回收剩余的所提供的装订物，这种过剩的装订和储存器在装订之后与装置分离 至少部分凝固。

公开(公告)号：US20110003436A1

公开(公告)日：2011-01-06

申请号：US12871074

申请日：2010-08-30

申请人： Francois DROZ

发明人： Francois DROZ

IPC分类号： H01L21/50

CPC分类号： G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/31 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165

摘要： The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a substrate, of at least one electronic assembly comprising a chip having at least one electric contact on one of its faces, said contact being intended to be electrically connected to a conductive track segment. The electronic assembly is built on a holding device which seizes and holds at least one conductive track segment previously formed and a chip. A placement device places this electronic assembly thus built at a predetermined position relative to the substrate and embeds or inserts said electronic assembly into the substrate.

摘要翻译： 所公开的方法的目的是确保在来自具有小尺寸的芯片的电子组件的制造水平以及这样的组件在绝缘基板上的放置水平方面的最大精度。 该目的通过在衬底上的放置过程来实现，至少一个电子组件包括在其一个面上具有至少一个电接触的芯片，所述触点旨在电连接到导电轨道段。 电子组件构建在保持装置上，该保持装置抓住并保持预先形成的至少一个导电轨道段和芯片。 放置装置将该电子组件放置在相对于基板的预定位置处，并将所述电子组件嵌入或插入到基板中。

公开(公告)号：US5741392A

公开(公告)日：1998-04-21

申请号：US333349

申请日：1994-11-02

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： B42D15/10 ,  G06K19/067 ,  G06K19/07 ,  G06K19/077 ,  H01L21/48 ,  H01L23/498 ,  B32B3/10 ,  B32B31/06 ,  G11B5/80

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/07781 ,  H01L21/4857 ,  H01L2224/48091 ,  H01L23/49855 ,  H01L2924/01068 ,  Y10T156/108

摘要： One object of the invention concerns a card comprising an electronic element (2) and a coil (42), the ends of which are directly coupled to the electronic element, such latter and the coil being encased in a binding material (10). Another object of the invention concerns a card comprising an electronic element (2) encased in a binding material (10) and a positioning structure (46) for the electronic element, such structure being located in a layer (38) formed by the binding material. The present invention also concerns a method of manufacture for cards according to the invention.

摘要翻译： 本发明的一个目的是涉及一种包括电子元件（2）和线圈（42）的卡，其端部直接联接到电子元件，如后者，线圈被封装在绑定材料（10）中。 本发明的另一个目的是涉及一种卡，其包括封装在装订材料（10）中的电子元件（2）和用于电子元件的定位结构（46），该结构位于由结合材料形成的层（38）中 。 本发明还涉及根据本发明的卡的制造方法。

公开(公告)号：US4650077A

公开(公告)日：1987-03-17

申请号：US808770

申请日：1985-12-13

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： A47F7/02 ,  B65D5/52

CPC分类号： A47F7/022

摘要： This display case includes a base on which may be arranged a tray of elastic material sufficiently rigid to define, by means of ribs, cells for the storage of the articles to be displayed. When the tray is within the base and the ribs upwardly disposed the display case is set up for transporting the articles. Following inverting of the tray, display elements provided with fastening means in the form of the tongue may be fastened to the tray by insertion of the tongue into a slot which each rib defines on the opposite surface of the tray. Under these conditions the display case is set up for showing the articles. The tray display elements which are readily moved may be stored in a compartment forseen to this purpose. According to a variant the tray may be independent and provided with stiffening elements associated with at least two opposed edges thereof.

摘要翻译： 该显示器壳体包括基部，其上可以布置有足够刚性的弹性材料盘，借助于肋来限定用于存储要显示的物品的单元。 当托盘在基座内并且向上布置肋时，设置展示箱用于运输物品。 在翻转托盘之后，设置有舌状形式的紧固装置的显示元件可以通过将舌插入槽中而紧固到托盘，每个肋限定在托盘的相对表面上。 在这些条件下，显示案例设置为显示文章。 容易移动的托盘显示元件可以存储在用于此目的的隔室中。 根据一种变型，托盘可以是独立的并且设置有与其至少两个相对的边缘相关联的加强元件。

公开(公告)号：US08218332B2

公开(公告)日：2012-07-10

申请号：US12871100

申请日：2010-08-30

申请人： Francois Droz

发明人： Francois Droz

IPC分类号： H05K1/18 ,  H05K13/04

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/0775 ,  H01L24/19 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/5313 ,  H01L2924/00

摘要： The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip. placement of the electronic assembly consisting of the chip and the track segment at a predetermined position on the substrate, embedding of the chip and of the track segment into the substrate. A placement device used in the process and a portable object including an electronic assembly placed according to the process are also objects of the present invention.

摘要翻译： 所公开的方法的目的是确保在来自具有小尺寸的芯片的电子组件的制造水平以及这样的组件在绝缘基板上的放置水平方面的最大精度。 该目的通过在称为基板的支撑件上的放置过程来实现，所述支撑件由至少一个电子组件构成，该电子组件包括芯片，该芯片包括在其一个面上的至少一个电触点，所述触点连接到导电轨道的一段，并且所述 通过一种放置装置来进行放置，该放置装置将所述组件保持并定位在衬底上，包括以下步骤：形成具有预定轮廓的导电轨道段，将轨道段转移到放置装置上， 所述放置装置以使得所述轨道段被放置在所述芯片的至少一个触点上的方式承载所述轨道段。 将由芯片和轨道段组成的电子组件放置在基板上的预定位置，将芯片和轨道段嵌入基板中。 在该方法中使用的放置装置和包括根据该方法放置的电子组件的便携式对象也是本发明的目的。