Telescoping slide assembly
    1.
    发明授权
    Telescoping slide assembly 失效
    伸缩滑轨总成

    公开(公告)号:US06938967B2

    公开(公告)日:2005-09-06

    申请号:US10318850

    申请日:2002-12-12

    CPC分类号: H05K7/1421 H05K7/1489

    摘要: A telescoping slide assembly includes interconnected mounting, intermediate and stationary slide elements movable relative to one another to extend and retract the mounting and intermediate slide elements relative to the stationary slide element between fully extended and retracted positions. The intermediate slide element includes a rib formed therein. A mounting slide lock is disposed substantially within the rib for operative engagement with the mounting slide element to secure the mounting slide element in a fully extended position such that selective release of the mounting slide lock permits the mounting slide element to move to the fully retracted position and to disconnect from the intermediate slide element.

    摘要翻译: 伸缩滑动组件包括相对于彼此可移动的相互连接的安装,中间和固定滑动元件,以在完全伸出和缩回位置之间相对于静止滑动元件延伸和缩回安装件和中间滑动元件。 中间滑动元件包括形成在其中的肋。 安装滑动锁基本上设置在肋内,用于与安装滑动元件操作地接合以将安装滑动元件固定在完全伸出的位置,使得安装滑动锁的选择性释放允许安装滑动元件移动到完全缩回位置 并且与中间滑动元件断开连接。

    Optical sensing chip packaging structure

    公开(公告)号:US10811399B1

    公开(公告)日:2020-10-20

    申请号:US16366749

    申请日:2019-03-27

    发明人: Cherng-Chiao Wu

    摘要: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member and a transparent cover plate. The substrate has a recess; the optical sensing member is positioned in the recess, and is electrically connected to the substrate. The light emitting member is positioned in the recess, and is electrically connected to the substrate or the optical sensing member. The transparent cover plate is positioned on the substrate, and covers the optical sensing member and the light emitting member.

    Dual sided printed circuit board test system
    4.
    发明授权
    Dual sided printed circuit board test system 失效
    双面印刷电路板测试系统

    公开(公告)号:US5124633A

    公开(公告)日:1992-06-23

    申请号:US639821

    申请日:1991-01-10

    CPC分类号: G01R31/2805 H05K1/0268

    摘要: A system for reducing the number of points to be tested on a dual sided printed circuit board. The circuit board includes a top and a bottom surface and a plurality of network traces extending across both sides of the printed circuit board. Each network trace includes end points. The system provides for identifying the end points of a network trace extending on both sides of the printed circuit board. The mid-point along the network trace which is common to both sides of the printed circuit board is identified. Structure is provided for independently testing each side of the printed circuit board between one end point and the mid-point on the top surface of the printed circuit board and between the mid-point and the second end point on the bottom surface of the printed circuit board.

    摘要翻译: 一种用于减少双面印刷电路板上要测试点数的系统。 电路板包括顶部和底部表面以及跨过印刷电路板的两侧延伸的多个网络迹线。 每个网络跟踪包括终点。 该系统提供识别在印刷电路板两侧延伸的网络迹线的端点。 识别印刷电路板两侧通用的沿着网络迹线的中点。 提供结构用于独立地测试印刷电路板的一端和印刷电路板的顶表面上的中点之间以及印刷电路底表面的中点和第二端点之间的每一侧 板。

    OPTICAL SENSING CHIP PACKAGING STRUCTURE
    5.
    发明申请

    公开(公告)号:US20200381574A1

    公开(公告)日:2020-12-03

    申请号:US16570288

    申请日:2019-09-13

    发明人: CHERNG-CHIAO WU

    摘要: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member, a transparent glue layer and a transparent cover plate, wherein the optical sensing member is positioned on the substrate; the light emitting member is positioned on the optical sensing member, and the light emitting member includes a light emitting surface; the transparent glue layer is positioned on the light emitting member, and contacts and covers the light emitting surface; the transparent cover plate is positioned on the transparent glue layer.

    OPTICAL SENSING CHIP PACKAGING STRUCTURE
    6.
    发明申请

    公开(公告)号:US20200312827A1

    公开(公告)日:2020-10-01

    申请号:US16366749

    申请日:2019-03-27

    发明人: CHERNG-CHIAO WU

    摘要: An optical sensing chip packaging structure includes a substrate, an optical sensing member, a light emitting member and a transparent cover plate. The substrate has a recess; the optical sensing member is positioned in the recess, and is electrically connected to the substrate. The light emitting member is positioned in the recess, and is electrically connected to the substrate or the optical sensing member. The transparent cover plate is positioned on the substrate, and covers the optical sensing member and the light emitting member.

    IMAGE CHIP PACKAGE STRUCTURE AND THE METHOD OF MAKING THE SAME
    7.
    发明申请
    IMAGE CHIP PACKAGE STRUCTURE AND THE METHOD OF MAKING THE SAME 审中-公开
    图像芯片包装结构及其制作方法

    公开(公告)号:US20070272846A1

    公开(公告)日:2007-11-29

    申请号:US11836020

    申请日:2007-08-08

    申请人: Cheng-Chiao WU

    发明人: Cheng-Chiao WU

    IPC分类号: H01J5/02 H01J40/14

    摘要: An image chip package structure includes a carrier member, an image sensing die, a protective shield and a plurality of wires. The image sensing die has a side connected to the carrier and an opposite side with an image sensing region and a plurality of die bonding pads around the image sensing region. The protective shield has a connecting portion and a top shield portion. The connecting portion is connected to the image sensing die between the image sensing region and the die bonding pads to isolate the image sensing region and the die bonding pads and to surround the image sensing region. The top shield portion is connected to the connecting portion and above the image sensing region. The wires electrically connect the die bonding pads of the image sensing die and the carrier member.

    摘要翻译: 图像芯片封装结构包括载体构件,图像感测裸片,保护屏蔽和多根导线。 图像感测裸片具有连接到载体的一侧和与图像感测区域相对的一侧以及围绕图像感测区域的多个芯片接合焊盘。 保护罩具有连接部和顶部遮蔽部。 连接部分连接到图像感测区域和芯片接合焊盘之间的图像感测裸片,以隔离图像感测区域和芯片接合焊盘并且围绕图像感测区域。 顶部屏蔽部分连接到连接部分和图像感测区域上方。 导线将图像感测芯片的芯片接合焊盘和载体构件电连接。

    TELESCOPING SLIDE RAIL WITH LATCHING AND ALIGNMENT MECHANISMS
    9.
    发明申请
    TELESCOPING SLIDE RAIL WITH LATCHING AND ALIGNMENT MECHANISMS 失效
    具有锁定和对准机构的拉伸滑轨

    公开(公告)号:US20060284531A1

    公开(公告)日:2006-12-21

    申请号:US11467045

    申请日:2006-08-24

    申请人: William Dubon

    发明人: William Dubon

    IPC分类号: A47B88/00 A47B95/00

    CPC分类号: A47B88/49

    摘要: A telescoping slide rail assembly including interconnected mounting, intermediate and stationary slide rails movable relative to one another to extend and retract the mounting and intermediate slide rails relative to the stationary slide rail between fully extended and retracted positions. The intermediate slide rail includes a latching mechanism for interconnecting the intermediate and stationary slide rails in the fully extended position and the mounting slide rail includes an alignment device to maintain orientation between the mounting slide rail and the intermediate slide rail.

    摘要翻译: 一种伸缩式滑轨组件,其包括可相对于彼此移动的相互连接的安装,中间和固定滑轨,以在完全伸出和缩回位置之间相对于固定滑轨延伸和缩回安装件和中间滑轨。 中间滑轨包括用于将中间和固定滑轨互连在完全伸出位置的闩锁机构,并且安装滑轨包括对准装置,以保持安装滑轨和中间滑轨之间的定向。

    Telescoping slide rail with latching and alignment mechanisms
    10.
    发明授权
    Telescoping slide rail with latching and alignment mechanisms 失效
    伸缩滑轨带锁定和对准机构

    公开(公告)号:US07210752B2

    公开(公告)日:2007-05-01

    申请号:US11467045

    申请日:2006-08-24

    申请人: William Dubon

    发明人: William Dubon

    IPC分类号: A47B88/00

    CPC分类号: A47B88/49

    摘要: A telescoping slide rail assembly including interconnected mounting, intermediate and stationary slide rails movable relative to one another to extend and retract the mounting and intermediate slide rails relative to the stationary slide rail between fully extended and retracted positions. The intermediate slide rail includes a latching mechanism for interconnecting the intermediate and stationary slide rails in the fully extended position and the mounting slide rail includes an alignment device to maintain orientation between the mounting slide rail and the intermediate slide rail.

    摘要翻译: 一种伸缩式滑轨组件,其包括可相对于彼此移动的相互连接的安装,中间和固定滑轨,以在完全伸出和缩回位置之间相对于固定滑轨延伸和缩回安装件和中间滑轨。 中间滑轨包括用于将中间和固定滑轨互连在完全伸出位置的闩锁机构,并且安装滑轨包括对准装置,以保持安装滑轨和中间滑轨之间的定向。