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公开(公告)号：US09779247B2
公开(公告)日：2017-10-03
申请号：US14725387
申请日：2015-05-29
发明人： Michael R. Grimes , Richard Soja
CPC分类号： G06F21/575 , G06F9/4401 , G06F21/34 , G06F21/71 , G06F2221/033
摘要： A hardware security module (HSM) transitions a first signal from a first state to a second state and transitions a second signal from a first state to a second state when a request to change boot code is received. In response to receipt of a boot request, the HSM, when the first signal is in the first state and the second signal is in the first state: does not execute the hash function; and maintains the second signal in the first state. An actuator control module, in response to the receipt of the boot request: executes the boot code when the second signal is in the first state; and does not execute the boot code when the second signal is in the second state.
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2.发明申请COUPLING LAYER COMPOSITION FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD OF FORMING THE COUPLING LAYER, AND APPARATUS FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE 审中-公开用于半导体器件的耦合层组合物，半导体器件，形成耦合层的方法以及用于制造半导体器件的装置公开(公告)号：US20100200995A1
公开(公告)日：2010-08-12
申请号：US12665070
申请日：2007-07-09
IPC分类号： H01L23/535 , B05C13/00 , B05D3/06
CPC分类号： H01L21/76832 , H01L21/02063 , H01L21/02123 , H01L21/02343 , H01L21/3105 , H01L21/31058 , H01L21/67155 , H01L21/7682 , H01L21/76829 , H01L21/76841
摘要： Molecules of a coupling layer composition in a semiconductor device are bidimensionally polymerized in order to provide enhanced moisture blocking effect, particularly when the coupling layer is formed on a porous layer, such as a porous dielectric layer. The deposition of the coupling layer on the underlying structure and/or the cross-polymerization of the coupling layer composition and/or a final metallization can be photo-activated, especially, but not only, using an ultraviolet light.
摘要翻译： 半导体器件中的耦合层组合物的分子被二维聚合以提供增强的防潮效果，特别是当多孔层如多孔电介质层上形成偶合层时。 耦合层沉积在下面的结构上和/或耦合层组合物的交联聚合和/或最后的金属化可以是光激活的，特别是但不仅仅是使用紫外光。
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