DEFOCUSED OPTIC FOR MULTI - CHIP LED
    1.
    发明申请
    DEFOCUSED OPTIC FOR MULTI - CHIP LED 有权
    多芯片LED的偏光

    公开(公告)号:US20130200407A1

    公开(公告)日:2013-08-08

    申请号:US13642010

    申请日:2011-04-22

    申请人: Eric Roth

    发明人: Eric Roth

    IPC分类号: F21V7/09 H01L33/60

    摘要: A defocused optic (110, 210) for mixing of light output from a multichip LED (101, 201). The defocused optic (110, 210) includes an outer reflector having a concave inner surface (122, 26, 222, 226) with a varied profile. The outer reflector surrounds an interior reflector (140, 240) having a convex surface (142, 242). The convex surface (142, 242) of the interior reflector (140, 240) is positioned to generally face a multichip LED (101, 201) and may optionally have a varied profile. Appropriate selection of the design parameters of the profiles of the concave inner surface(122, 126, 222, 226), the profile(s) of the convex surface (142, 242), and the rotational angular range over which said profiles are present enables appropriate mixing of the light output from a given multi-chip LED (101, 201).

    摘要翻译: 一种用于混合从多芯片LED(101,201)输出的光的散焦光学元件(110,210)。 散焦光学元件(110,210)包括具有变化轮廓的凹形内表面(122,26,222,226)的外部反射器。 外部反射器包围具有凸形表面(142,242)的内部反射器(140,240)。 内部反射器(140,240)的凸表面(142,242)定位成大致面对多芯片LED(101,201),并且可以可选地具有变化的轮廓。 对凹面内表面(122,126,222,226)的轮廓,凸面(142,242)的轮廓以及所述轮廓存在的旋转角度范围的设计参数的适当选择 使得能够适当地混合来自给定的多芯片LED(101,201)的光输出。

    ORGANIC LIGHT EMITTING DEVICE
    2.
    发明申请
    ORGANIC LIGHT EMITTING DEVICE 有权
    有机发光装置

    公开(公告)号:US20130037787A1

    公开(公告)日:2013-02-14

    申请号:US13642000

    申请日:2011-04-21

    IPC分类号: H01L51/50 H01L51/40

    摘要: The invention relates to an organic light-emitting device (OLED) comprising at least: a first electrode (102); a second electrode (105); an organic light emissive layer (104) arranged between said first electrode and said second electrode; and an organic charge transport layer (103) arranged between said first electrode and said emissive layer, wherein i) the charge transport layer is patterned or provided with a periodic surface structure on a surface of the charge transport layer facing the emissive layer, and/or ii) an alignment layer (406) which allows for charge transport to the emissive layer is provided between said charge transport layer and said emissive layer, which alignment layer promotes alignment of the optical dipoles of molecules of said light emissive layer towards a common preferred direction of the molecular axes. The use of the patterned or structured charge transport layer and/or the alignment layer provides improved light out coupling from the OLED layer stack, i.e. increased external quantum efficiency.

    摘要翻译: 本发明涉及至少包括:第一电极(102)的有机发光器件(OLED); 第二电极(105); 布置在所述第一电极和所述第二电极之间的有机发光层(104); 以及布置在所述第一电极和所述发射层之间的有机电荷传输层(103),其中i)所述电荷传输层在面向发光层的电荷输送层的表面上被图案化或设置有周期性表面结构,和/ 或ii)在所述电荷传输层和所述发射层之间提供允许电荷传输到发射层的取向层(406),所述取向层促进所述发光层的分子的光偶极子朝共同的优选方向 分子轴方向。 图案化或结构化电荷传输层和/或取向层的使用提供了从OLED层堆叠提供的改进的光输出耦合,即提高的外部量子效率。

    ELECTRONIC DEVICE HAVING A PLASTIC SUBSTRATE
    3.
    发明申请
    ELECTRONIC DEVICE HAVING A PLASTIC SUBSTRATE 审中-公开
    具有塑料基板的电子设备

    公开(公告)号:US20100196683A1

    公开(公告)日:2010-08-05

    申请号:US12446477

    申请日:2007-10-22

    摘要: A method of manufacturing a thin-film electronic device comprises applying a plastic coating to a rigid carrier substrate (12) using a wet casting process, the plastic coating forming a plastic substrate (22). The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane. The anisotropy of the thermal expansion in the plastic substrate of the invention enables the expansion of the substrate during the thermal lift-off process to be in the perpendicular direction. This has been found to aid the lift-off process and also protect the components mounted on the upper surface of the plastic substrate.

    摘要翻译: 制造薄膜电子器件的方法包括使用湿法铸造工艺将塑料涂层施加到刚性载体衬底(12)上,塑料涂层形成塑料衬底(22)。 塑料材料的垂直于基板平面的第一方向上的热膨胀系数大于平行于基板平面的第二方向。 在塑料基板上形成薄膜电子元件,并且通过加热方法将刚性载体基板从塑料基板释放,该加热工艺优选地在垂直于基板平面的方向上膨胀塑料基板。 本发明的塑料基板中的热膨胀的各向异性使得在热剥离过程中的基板能够在垂直方向上膨胀。 已经发现这有助于剥离过程并且还保护安装在塑料基板的上表面上的部件。