公开(公告)号：US20080025808A1

公开(公告)日：2008-01-31

申请号：US11828233

申请日：2007-07-25

申请人： Gregory Hyatt ,  Nitin Chaphalkar

发明人： Gregory Hyatt ,  Nitin Chaphalkar

IPC分类号： B23C1/18 ,  G06F19/00

CPC分类号： G05B19/40938 ,  B23B3/24 ,  B23C3/04 ,  G05B19/416 ,  G05B2219/49092 ,  G05B2219/49361 ,  Y02P90/265 ,  Y10T409/300896

摘要： A milling tool and a workpiece each may be rotated at a rotational velocity of at least 25 m/min in a compound machining operation. Disclosed are a computer numerically controlled machine, a method for operation of a computer numerically controlled machine, a computer program product, and a method for determining compound machining parameters. In some embodiments, a processing parameter for compound machining is selected and other processing parameters are algorithmically determined based thereon.

摘要翻译： 在复合加工操作中，铣刀和工件各自可以以至少25m / min的旋转速度旋转。 公开了一种计算机数控机器，计算机数控机器的操作方法，计算机程序产品和用于确定复合加工参数的方法。 在一些实施例中，选择用于复合加工的处理参数，并且基于其它算法确定其他处理参数。

公开(公告)号：US20160279750A1

公开(公告)日：2016-09-29

申请号：US15073054

申请日：2016-03-17

申请人： ROLLS-ROYCE plc

发明人： Dragos Aurelian AXINTE ,  Xin DONG ,  James KELL

IPC分类号： B23Q1/48 ,  G05B19/19 ,  B25H1/00

CPC分类号： B23Q1/48 ,  B23Q1/5462 ,  B23Q9/0007 ,  B23Q9/0014 ,  B25H1/0042 ,  B25J9/0057 ,  B62D57/032 ,  G05B19/19 ,  G05B2219/49361

摘要： A machine tool comprising: a first body; a first leg, a second leg, and a third leg coupled to the first body via first joints and configured to support at least the first body; a second body including a tool holder; a fourth leg, a fifth leg, and a sixth leg coupled to the second body via second joints and configured to support at least the second body; and a first actuator coupled to the first body and to the second body, the first actuator being configured to cause rotational motion between the first body and the second body to enable a change in walking direction of the machine tool and/or to enable a change in machining stiffness and a change in work volume of the machine tool.

摘要翻译： 一种机床，包括：第一主体; 第一腿，第二腿和第三腿，经由第一关节联接到第一体，并且构造成至少支撑第一体; 包括工具架的第二主体; 第四腿，第五腿和第六腿，经由第二接头联接到第二体，并且构造成至少支撑第二体; 以及耦合到所述第一主体和所述第二主体的第一致动器，所述第一致动器构造成使得所述第一主体和所述第二主体之间的旋转运动能够使所述机床的行进方向改变和/或使得能够改变 在加工刚度和机床工作量的变化。

公开(公告)号：US5498196A

公开(公告)日：1996-03-12

申请号：US245458

申请日：1994-05-18

申请人： Chris E. Karlsrud ,  Anthony G. Van Woerkom ,  Shigeru Odagiri ,  Isao Nagahashi

发明人： Chris E. Karlsrud ,  Anthony G. Van Woerkom ,  Shigeru Odagiri ,  Isao Nagahashi

IPC分类号： B24B37/08 ,  B24B37/34 ,  B24B49/16 ,  B24B51/00 ,  G05B19/418 ,  H01L21/304 ,  H01L21/677 ,  H01L21/683 ,  B24B37/04 ,  B24B7/22

CPC分类号： H01L21/6838 ,  B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  H01L21/67745 ,  H01L21/67751 ,  G05B2219/37399 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  Y02P90/087

摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

公开(公告)号：US20120096999A1

公开(公告)日：2012-04-26

申请号：US13290901

申请日：2011-11-07

申请人： Gregory A. Hyatt ,  Nitin Chaphalkar

发明人： Gregory A. Hyatt ,  Nitin Chaphalkar

IPC分类号： B23B1/00 ,  G05B19/18

CPC分类号： G05B19/40938 ,  B23B3/22 ,  B23C2220/48 ,  B23Q27/00 ,  G05B2219/49092 ,  G05B2219/49361 ,  Y02P90/265 ,  Y10T29/5109 ,  Y10T82/10 ,  Y10T82/16131 ,  Y10T409/303808 ,  Y10T409/305656

摘要： A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.

摘要翻译： 加工工件的方法可以包括连续旋转工件，连续旋转具有至少一个切割表面的工具，并且相对于工件定位工具，使得至少一个切割表面在第一离散位置处与工件接合 工件周边。 该方法还可以包括继续旋转工件和工具，使得至少一个切割表面接合在工件的周边处的第二离散位置，并且相对于工件表面速度VW控制工具表面速度VT，使得 第一和第二离散位置是不连续的。 该工具可以在工件上进行多次迭代过程以接合随后的离散位置，其中第一离散位置，第二离散位置和多个后续离散位置可以形成连续围绕工件延伸的加工表面。

公开(公告)号：USRE37622E1

公开(公告)日：2002-04-02

申请号：US08792936

申请日：1997-01-24

申请人： Chris E. Karlsrud ,  Anthony G. Van Woerkom ,  Shigeru Odagiri ,  Isao Nagahashi

发明人： Chris E. Karlsrud ,  Anthony G. Van Woerkom ,  Shigeru Odagiri ,  Isao Nagahashi

IPC分类号： B24B3704

CPC分类号： H01L21/6838 ,  B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  G05B2219/37399 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  H01L21/67745 ,  H01L21/67751 ,  Y02P90/087

摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

摘要翻译： 晶片抛光装置包括具有多个晶片载体的晶片抛光组件，用于基本上同时抛光多个晶片抵靠旋转的抛光表面。 待研磨的多个晶片通过分度台的晶片保持装置基本上同时装载到多个晶片载体中。 类似地，多个晶片载体基本上同时卸载到索引表的晶片保持装置中。 晶片载体被单独计算机控制以精确抛光，并且不同的抛光要求可以通过不同的晶片载体同时满足。

公开(公告)号：US20170153626A1

公开(公告)日：2017-06-01

申请号：US15363194

申请日：2016-11-29

申请人： FANUC CORPORATION

发明人： Yuuki Oonishi

IPC分类号： G05B19/4069 ,  G05B19/414 ,  G06T11/20

CPC分类号： G05B19/4069 ,  G05B19/414 ,  G05B2219/43174 ,  G05B2219/49361 ,  G06T11/206

摘要： A cam data display device is designed to perform waveform display of a motion of an electronic cam and is provided with a cam-shape data storage unit configured to store cam-shape data in which a phase of a camshaft is associated with a position of a slave axis, a camshaft rotational speed acquisition unit configured to acquire a rotational speed of the camshaft, and a waveform generation unit configured to generate the waveform display indicative of the relationship between time and the motion of the slave axis, based on the cam-shape data and the rotational speed of the camshaft.

公开(公告)号：US09575485B2

公开(公告)日：2017-02-21

申请号：US13290901

申请日：2011-11-07

申请人： Gregory A. Hyatt ,  Nitin Chaphalkar

发明人： Gregory A. Hyatt ,  Nitin Chaphalkar

IPC分类号： B23C3/00 ,  B23B3/22 ,  B23Q27/00 ,  G05B19/4093

CPC分类号： G05B19/40938 ,  B23B3/22 ,  B23C2220/48 ,  B23Q27/00 ,  G05B2219/49092 ,  G05B2219/49361 ,  Y02P90/265 ,  Y10T29/5109 ,  Y10T82/10 ,  Y10T82/16131 ,  Y10T409/303808 ,  Y10T409/305656

摘要： A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.

摘要翻译： 加工工件的方法可以包括连续旋转工件，连续旋转具有至少一个切割表面的工具，并且相对于工件定位工具，使得至少一个切割表面在第一离散位置处与工件接合 工件周边。 该方法还可以包括继续旋转工件和工具，使得至少一个切割表面接合在工件的周边处的第二离散位置，并且相对于工件表面速度VW控制工具表面速度VT，使得 第一和第二离散位置是不连续的。 该工具可以在工件上进行多次迭代过程以接合随后的离散位置，其中第一离散位置，第二离散位置和多个后续离散位置可以形成连续围绕工件延伸的加工表面。

公开(公告)号：US06999844B2

公开(公告)日：2006-02-14

申请号：US10662300

申请日：2003-09-16

申请人： Takahiko Endo

发明人： Takahiko Endo

IPC分类号： G05B19/18

CPC分类号： G05B19/414 ,  G05B2219/43174 ,  G05B2219/49361 ,  Y02P90/265

摘要： A numerical controller for performing an machining operation by controlling relative position of a workpiece and a tool in synchronism with a rotational position of a rotational axis to which the workpiece or the tool is attached, without causing time delay of position control of the tool relative to the workpiece in varying a rotational velocity of the rotational axis. A rotational position θi(i=0, 1, . . . ) of a workpiece on the rotational axis, a position (Xi, Zi) of the tool relative to the workpiece when the workpiece is at the rotational position θi, and the rotational velocity Vi of the workpiece from the rotational position θi to the rotational position θi+1 are set in advance. Time Ti required for rotating the workpiece from the rotational position θi to the rotational position θi+1 at the rotational velocity Vi is obtained. Velocities Vxi and Vzi of the workpiece are obtained so that the position of the workpiece reaches the next set position (Xi+1, Zi+1) in the time Ti. Servomotors for the spindle, the X-axis and the Z-axis are driven at the set velocity or the calculated velocities to provide relative motions to the workpiece and the tool for the machining operation.

摘要翻译： 一种用于通过控制工件和工具的相对位置与工件或工具所附着的旋转轴线的旋转位置同步地进行加工操作的数值控制器，而不会造成工具相对于工具的位置控制的时间延迟 工件改变旋转轴的旋转速度。 在旋转轴上的工件的旋转位置θi（i = 0,1，...），一个位置（X，i，Z， 当工件处于旋转位置θ1时，工件相对于工件的旋转速度V SUB> /从工件的旋转位置θ 预先设定到旋转位置θ1+ 1 + 1 。 将工件从旋转位置θ1旋转到旋转位置θ1+ 1 +所需的时间T 以旋转速度V _{i 。 获得工件的速度Vx＆lt; i＆gt;和V z＆lt; i＆lt; / i＆gt;和/或工件的位置到达下一设定位置（X 1 i + 1， 在时间T i i中，Z i + 1 + 1）。 主轴，X轴和Z轴的伺服电机以设定速度或计算速度驱动，为工件和加工工具提供相对运动。}

公开(公告)号：US20040059460A1

公开(公告)日：2004-03-25

申请号：US10662300

申请日：2003-09-16

申请人： FANUC LTD.

发明人： Takahiko Endo

IPC分类号： G06F019/00

CPC分类号： G05B19/414 ,  G05B2219/43174 ,  G05B2219/49361 ,  Y02P90/265

摘要： A numerical controller for performing an machining operation by controlling relative position of a workpiece and a tool in synchronism with a rotational position of a rotational axis to which the workpiece or the tool is attached, without causing time delay of position control of the tool relative to the workpiece in varying a rotational velocity of the rotational axis. A rotational position nulli(inull0, 1, . . . ) of a workpiece on the rotational axis, a position (Xi, Zi) of the tool relative to the workpiece when the workpiece is at the rotational position nulli, and the rotational velocity Vi of the workpiece from the rotational position nulli to the rotational position nullinull1 are set in advance. Time Ti required for rotating the workpiece from the rotational position nulli to the rotational position nullinull1 at the rotational velocity Vi is obtained. Velocities Vxi and Vzi of the workpiece are obtained so that the position of the workpiece reaches the next set position (Xinull1, Zinull1) in the time Ti. Servomotors for the spindle, the X-axis and the Z-axis are driven at the set velocity or the calculated velocities to provide relative motions to the workpiece and the tool for the machining operation.

摘要翻译： 一种用于通过控制工件和工具的相对位置与工件或工具所附着的旋转轴线的旋转位置同步地进行加工操作的数值控制器，而不会造成工具相对于工具的位置控制的时间延迟 工件改变旋转轴的旋转速度。 工件在旋转轴线上的旋转位置（i = 0,1，...），当工件处于旋转位置时工具相对于工件的位置（Xi，Zi），旋转位置 预先设定工件的从转动位置到转动位置t + 1的速度Vi。 获得了以旋转速度Vi将工件从旋转位置转到旋转位置t 1 + 1所需的时间Ti。 获得工件的速度Vxi和Vzi，使得工件的位置在时间Ti中到达下一个设定位置（Xi + 1，Zi + 1）。 主轴，X轴和Z轴的伺服电机以设定速度或计算速度驱动，为工件和加工工具提供相对运动。

公开(公告)号：US6146241A

公开(公告)日：2000-11-14

申请号：US967968

申请日：1997-11-12

申请人： Michael G. Lee ,  Solomon I. Beilin

发明人： Michael G. Lee ,  Solomon I. Beilin

IPC分类号： B24B37/04 ,  B24B49/00

CPC分类号： B24B37/04 ,  B24B37/042 ,  B24B49/00 ,  G05B2219/45232 ,  G05B2219/49361

摘要： Methods and apparatuses for evenly polishing the entire polishing surface of a sample are described. One polishing apparatus of the present invention comprises: a platen having an upper surface upon which the sample surface is to be polished; a sample holder disposed opposite to the platen's upper surface, at least one of the platen and the sample holder being rotated about a first axis to effect polishing; a positioning means for changing the distance between the sample holder and the platen in response to a control signal; and a controller providing said control signal to the positioning means to control the operation of the positioning means during a polishing cycle, wherein the controller causes the positioning means to change the distance intermittently during the polishing cycle. One method according to the present invention comprises: dispensing slurry upon a polishing pad; polishing the sample against the polishing pad; and intermittently changing the distance between the sample and the polishing pad during the polishing step.

摘要翻译： 描述了用于均匀研磨样品的整个抛光表面的方法和装置。 本发明的一个抛光装置包括：具有上表面的压板，样品表面将在其上被抛光; 样品架，其与所述压板的上表面相对设置，所述压板和所述样品架中的至少一个围绕第一轴线旋转以进行抛光; 定位装置，用于响应于控制信号改变样品架和压板之间的距离; 以及控制器，其向所述定位装置提供所述控制信号，以在抛光循环期间控制所述定位装置的操作，其中所述控制器使得所述定位装置在所述抛光循环期间间歇地改变所述距离。 根据本发明的一种方法包括：将浆料分配在抛光垫上; 将样品抛光到抛光垫上; 并且在抛光步骤期间间歇地改变样品和抛光垫之间的距离。