公开(公告)号：US20140367846A1

公开(公告)日：2014-12-18

申请号：US14221198

申请日：2014-03-20

Applicant: Mitsubishi Electric Corporation

Inventor： Shinya NAKAGAWA ,  Tomofumi TANAKA

IPC: H01L23/34

CPC classification number: H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K2201/10742 ,  H05K2201/1075 ,  H05K2201/10787 ,  H01L2924/00

Abstract: A power semiconductor device includes a plurality of power chips sealed in a package to control power and an IC sealed in the package to control each of the power chips. The IC is disposed at the center part of the package in the plan view. The plurality of power chips are disposed so as to surround the IC in the plan view.

Abstract translation: 功率半导体器件包括密封在封装中以控制功率的多个功率芯片和密封在封装中的IC以控制每个功率芯片。 IC在平面图中设置在包装的中心部分。 多个功率芯片被布置为在平面图中围绕IC。

公开(公告)号：US20240334592A1

公开(公告)日：2024-10-03

申请号：US18735237

申请日：2024-06-06

Applicant: SHENZHEN SIPTORY TECHNOLOGY CO., LTD

Inventor： Dongdong Shao

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K1/0266 ,  H05K1/11 ,  H05K3/303 ,  H05K2201/10742 ,  H05K2203/166

Abstract: The present invention provides a BGA element self-alignment structure and an alignment method, including a printed circuit board with a first alignment structure matching with the BGA ball, and a second alignment structure on two sides of the substrate and above the printed circuit board. The BGA element is precisely aligned on the printed circuit board, which improves the mounting processing efficiency, guarantees the mounting yield of the BGA element on the printed circuit board, reduces the rework and scraping costs caused by poor BGA mounting.