公开(公告)号：US20140367846A1

公开(公告)日：2014-12-18

申请号：US14221198

申请日：2014-03-20

Applicant: Mitsubishi Electric Corporation

Inventor： Shinya NAKAGAWA ,  Tomofumi TANAKA

IPC: H01L23/34

CPC classification number: H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K2201/10742 ,  H05K2201/1075 ,  H05K2201/10787 ,  H01L2924/00

Abstract: A power semiconductor device includes a plurality of power chips sealed in a package to control power and an IC sealed in the package to control each of the power chips. The IC is disposed at the center part of the package in the plan view. The plurality of power chips are disposed so as to surround the IC in the plan view.

Abstract translation: 功率半导体器件包括密封在封装中以控制功率的多个功率芯片和密封在封装中的IC以控制每个功率芯片。 IC在平面图中设置在包装的中心部分。 多个功率芯片被布置为在平面图中围绕IC。

公开(公告)号：US20170318684A1

公开(公告)日：2017-11-02

申请号：US15652337

申请日：2017-07-18

Applicant: OLYMPUS CORPORATION

Inventor： Jumpei YONEYAMA

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K3/40 ,  H05K1/11 ,  H05K3/3405 ,  H05K3/368 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/1075 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10931

Abstract: A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

公开(公告)号：US20180270979A1

公开(公告)日：2018-09-20

申请号：US15762451

申请日：2016-08-08

Applicant: Siemens Aktiengesellschaft

Inventor： Thomas Bigl ,  ALEXANDER HENSLER ,  STEPHAN NEUGEBAUER ,  STEFAN PFEFFERLEIN

IPC: H05K7/14 ,  H05K1/18 ,  H02M7/00 ,  H01G2/08 ,  H01G2/10

CPC classification number: H05K7/1427 ,  H01G2/08 ,  H01G2/10 ,  H01G4/28 ,  H01G4/32 ,  H01G4/40 ,  H01G9/151 ,  H01G9/28 ,  H02M5/458 ,  H02M7/003 ,  H05K1/181 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/1075

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).