公开(公告)号：US09936589B2

公开(公告)日：2018-04-03

申请号：US15055859

申请日：2016-02-29

Applicant: Presidio Components. Inc.

Inventor： Hung Van Trinh

IPC: B23K31/02 ,  H05K3/34 ,  H01G2/06 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US09831575B2

公开(公告)日：2017-11-28

申请号：US15409689

申请日：2017-01-19

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox

IPC: H05K1/11 ,  H01R12/70 ,  H01R4/02

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US09728869B2

公开(公告)日：2017-08-08

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/00 ,  H01R12/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US08902603B2

公开(公告)日：2014-12-02

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US08884167B2

公开(公告)日：2014-11-11

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

Inventor： Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion in a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹部表面，并且所述突出部分在所述印刷电路板的厚度方向上的长度大于所述印刷电路板的厚度。

公开(公告)号：US20110299250A1

公开(公告)日：2011-12-08

申请号：US13152419

申请日：2011-06-03

Applicant: Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K7/20 ,  H05K3/10

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

Abstract translation: 布线基板11A包括高散热基板21，其具有高导热层，其中前表面和后表面中的至少一个是用于各种部件的安装表面21a; 连接端子31，其从高散热基板21延伸并且在垂直于高散热基板21的表面的方向上弯曲; 以及一体地安装在连接端子31上的散热片部35。

公开(公告)号：US08004856B2

公开(公告)日：2011-08-23

申请号：US12711200

申请日：2010-02-23

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/14

CPC classification number: A41D27/085 ,  A43B1/0036 ,  H05K3/325 ,  H05K2201/10393 ,  H05K2201/10787 ,  H05K2203/0173

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US07946861B2

公开(公告)日：2011-05-24

申请号：US12449283

申请日：2007-02-02

Applicant: Reinhard Sander

Inventor： Reinhard Sander

IPC: H01R12/00

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10871

Abstract: The invention relates to contact pins for providing an electrical connection between electronic devices. In one aspect the pin is adapted to be inserted into a hole of a circuit carrier and the pin comprises at least three portions; namely a contact termination portion, an electrical contact portion and a mechanical fastening portion. The mechanical fastening portion preferably allows a fastening of the contact pin without any soldering.

Abstract translation: 本发明涉及用于在电子设备之间提供电连接的接触针。 在一个方面，所述销适于插入电路载体的孔中，并且所述销包括至少三个部分; 即接触终端部分，电接触部分和机械紧固部分。 机械紧固部分优选地允许接触针的紧固而没有任何焊接。

公开(公告)号：US20110068460A1

公开(公告)日：2011-03-24

申请号：US12888174

申请日：2010-09-22

Applicant: Felix SCHINNER ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

Inventor： Felix SCHINNER ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

IPC: H01L23/10

CPC classification number: H05K3/3442 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/202 ,  H05K2201/10636 ,  H05K2201/10787 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract translation: 本发明涉及具有半导体元件，特别是半导体芯片的电子部件，以及至少一个SMD元件，具有支撑平台的芯片载体和连接引线。 由此通过芯片连接电连接到连接引线的键指的半导体部件安装在支撑平台上，并且SMD部件通过布置在其上的接触表面将支撑平台连接到连接引线，壳体包围半导体 组件，SMD组件，并且至少部分地是芯片载体。 在SMD部件的区域中的支撑平台和连接引线被成型以形成阻挡层，使得自由流动的材料从连接到芯片载体的SMD部件的接触表面流到支撑平台上， 阻止连接引线。