公开(公告)号：US5945258A

公开(公告)日：1999-08-31

申请号：US655759

申请日：1996-05-30

申请人： Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Katsuji Shibata ,  Akishi Nakaso

发明人： Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Katsuji Shibata ,  Akishi Nakaso

IPC分类号： H05K1/03 ,  C08J7/12 ,  H05K3/00 ,  H05K3/46 ,  H01L21/306 ,  B44C1/22 ,  B23F1/18

CPC分类号： H05K3/4655 ,  C08J7/12 ,  H05K3/002 ,  C08J2363/00 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K2203/0783 ,  H05K3/4652 ,  Y10S428/901

摘要： A process for producing a multilayer printed circuit board produced characterized by using a special thermosetting epoxy resin composition comprising (a) an epoxy resin, (b) a crosslinking agent and (c) a polyfunctional epoxy resin, for forming a thermosetting copper-clad adhesive resin sheet, which cover an interlayer circuit plate, followed by etching of cured adhesive resin for forming holes for interstitial via holes (IVH) having a small diameter using a special etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, is suitable for mass production of multilayer printed circuit boards having IVH excellent in connection reliability and electrical properties.

摘要翻译： 一种制造多层印刷电路板的方法，其特征在于使用特殊的热固性环氧树脂组合物，该组合物包含（a）环氧树脂，（b）交联剂和（c）多官能环氧树脂，用于形成热固性铜包覆粘合剂 树脂片，其覆盖层间电路板，然后使用特殊的蚀刻溶液蚀刻用于形成具有小直径的间隙通孔（IVH）的固化的粘合树脂，所述特殊蚀刻溶液包含（A）作为溶剂的胺，（B） 碱金属化合物和（C）醇作为溶剂，适合于批量生产具有优异连接可靠性和电性能的IVH的多层印刷电路板。