公开(公告)号：US08449712B2

公开(公告)日：2013-05-28

申请号：US12300546

申请日：2007-06-22

申请人： Yoshimasa Inamoto ,  Hachiro Nakatsuji ,  Kazuhiro Inoue ,  Hiroyuki Tsuji

发明人： Yoshimasa Inamoto ,  Hachiro Nakatsuji ,  Kazuhiro Inoue ,  Hiroyuki Tsuji

IPC分类号： H05H1/24 ,  B23K35/38 ,  B23K20/10 ,  B23K11/0006 ,  B23K35/383 ,  B23K11/00

CPC分类号： H05H1/24 ,  B23K11/0006 ,  B23K20/10 ,  B23K35/38 ,  B23K35/383 ,  H01L24/75 ,  H01L24/81 ,  H01L2221/68313 ,  H01L2224/75 ,  H01L2224/75302 ,  H01L2224/75743 ,  H01L2224/81009 ,  H01L2224/81013 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/095

摘要： An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

摘要翻译： 根据本发明的电极接合方法包括：等离子体清洗步骤，用用于清洗的大气压等离子体照射诸如半导体器件的部分中的至少任一个的待清洁电极表面; 在大气压等离子体照射之前，用第一惰性气体覆盖待清洗电极表面及其附近的惰性气体气氛保持步骤，甚至在此之后保持该状态; 以及在惰性气体保持步骤结束之前将部件的电极和电极接合在基板上的接合步骤。 电极表面由此进行等离子体清洁，而不会损坏要与基板接合的部件，并且在粘合电极的同时保持清洁状态以提供高粘合力和高可靠性的电极接合状态。