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公开(公告)号：US4743465A
公开(公告)日：1988-05-10
申请号：US817856
申请日：1986-02-12
申请人： Keiji Saeki , Shinichi Kudo , Hachiro Nakatsuji
发明人： Keiji Saeki , Shinichi Kudo , Hachiro Nakatsuji
CPC分类号： H05K3/1241 , H01L21/705 , H05K2203/0126
摘要： A method and apparatus for drawing a thick film circuit on a substrate by discharging a paste from a tank with a discharge hole. A waste drawing is performed by extruding the paste from the tank on a waste drawing section at a predetermined interval of non-drawing duration, thereby preventing paste clogging at the discharge hole and resulting in increase on workability and productivity.
摘要翻译： PCT No.PCT / JP85 / 00198 Sec。 371日期1986年2月12日 102（e）日期1986年2月12日PCT 1985年4月15日PCT。一种通过从具有排出孔的罐排出糊料而在基板上绘制厚膜电路的方法和装置。 通过以预定的非拉伸持续时间从罐中将废料从罐中挤出到废料抽出部上，从而防止浆料在排出孔堵塞并导致加工性和生产率的提高。
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公开(公告)号：US20090145546A1
公开(公告)日：2009-06-11
申请号：US12300546
申请日：2007-06-22
IPC分类号： B32B37/00
CPC分类号： H05H1/24 , B23K11/0006 , B23K20/10 , B23K35/38 , B23K35/383 , H01L24/75 , H01L24/81 , H01L2221/68313 , H01L2224/75 , H01L2224/75302 , H01L2224/75743 , H01L2224/81009 , H01L2224/81013 , H01L2224/81054 , H01L2224/81075 , H01L2224/81203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H05K3/3489 , H05K2203/0195 , H05K2203/082 , H05K2203/086 , H05K2203/095
摘要： An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
摘要翻译： 根据本发明的电极接合方法包括：等离子体清洗步骤，用用于清洗的大气压等离子体照射诸如半导体器件的部分中的至少任一个的待清洁电极表面; 在大气压等离子体照射之前，用第一惰性气体覆盖待清洗电极表面及其附近的惰性气体气氛保持步骤，甚至在此之后保持该状态; 以及在惰性气体保持步骤结束之前将部件的电极和电极接合在基板上的接合步骤。 电极表面由此进行等离子体清洁，而不会损坏要与基板接合的部件，并且在粘合电极的同时保持清洁状态以提供高粘合力和高可靠性的电极接合状态。
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公开(公告)号：US08449712B2
公开(公告)日：2013-05-28
申请号：US12300546
申请日：2007-06-22
IPC分类号： H05H1/24 , B23K35/38 , B23K20/10 , B23K11/0006 , B23K35/383 , B23K11/00
CPC分类号： H05H1/24 , B23K11/0006 , B23K20/10 , B23K35/38 , B23K35/383 , H01L24/75 , H01L24/81 , H01L2221/68313 , H01L2224/75 , H01L2224/75302 , H01L2224/75743 , H01L2224/81009 , H01L2224/81013 , H01L2224/81054 , H01L2224/81075 , H01L2224/81203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H05K3/3489 , H05K2203/0195 , H05K2203/082 , H05K2203/086 , H05K2203/095
摘要： An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
摘要翻译： 根据本发明的电极接合方法包括：等离子体清洗步骤，用用于清洗的大气压等离子体照射诸如半导体器件的部分中的至少任一个的待清洁电极表面; 在大气压等离子体照射之前，用第一惰性气体覆盖待清洗电极表面及其附近的惰性气体气氛保持步骤，甚至在此之后保持该状态; 以及在惰性气体保持步骤结束之前将部件的电极和电极接合在基板上的接合步骤。 电极表面由此进行等离子体清洁，而不会损坏要与基板接合的部件，并且在粘合电极的同时保持清洁状态以提供高粘合力和高可靠性的电极接合状态。
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公开(公告)号：US07896200B2
公开(公告)日：2011-03-01
申请号：US11573043
申请日：2006-06-08
申请人： Hachiro Nakatsuji , Akira Iizuka , Akira Kabeshita
发明人： Hachiro Nakatsuji , Akira Iizuka , Akira Kabeshita
IPC分类号： B05B15/06
CPC分类号： B05C5/0216 , B05C11/10 , B05C17/015
摘要： It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.
摘要翻译： 本发明的目的是提供一种在具有大容量的容器的处理中具有高可操作性的液体物质供给装置。 用于供应保留在垂直细长容器30中的液体物质的液体物质供给装置具有这样的结构，其中用于保持容器的底部部分通过设置在保持器主体16的顶侧上的插入孔插入 通过铰链部分19枢转在基座支架14上，以支撑容器支架15，使得它可以采取直立姿态或倾斜姿势，并且容器保持器15通过保持器固定机构20以直立姿态固定在其中。 结果，容器保持器15能够在容器更换操作时以倾斜状态安装和拆卸保持器本体16，这使得即使在处理具有 伟大的高度尺寸。
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公开(公告)号：US20090008398A1
公开(公告)日：2009-01-08
申请号：US11573043
申请日：2006-06-08
申请人： Hachiro Nakatsuji , Akira Iizuka , Akira Kabeshita
发明人： Hachiro Nakatsuji , Akira Iizuka , Akira Kabeshita
CPC分类号： B05C5/0216 , B05C11/10 , B05C17/015
摘要： It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.
摘要翻译： 本发明的目的是提供一种在具有大容量的容器的处理中具有高可操作性的液体物质供给装置。 用于供应保留在垂直细长容器30中的液体物质的液体物质供给装置具有这样的结构，其中用于保持容器的底部部分通过设置在保持器主体16的顶侧上的插入孔插入 通过铰链部分19枢转在基座支架14上，以支撑容器支架15，使得它可以采取直立姿态或倾斜姿势，并且容器保持器15通过保持器固定机构20以直立姿态固定在其中。 结果，容器保持器15能够在容器更换操作时以倾斜状态安装和拆卸保持器本体16，这使得即使在处理具有 伟大的高度尺寸。
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