公开(公告)号：US09397072B2

公开(公告)日：2016-07-19

申请号：US14929326

申请日：2015-10-31

申请人： Renesas Electronics Corporation

发明人： Nobuyasu Muto

IPC分类号： H01L23/02 ,  H01L23/52 ,  H01L23/48 ,  H01L25/065 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L25/0652 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/04 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/04042 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/75743 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/4554

摘要： Chip cracking that occurs when a dicing step using a blade is carried out to acquire semiconductor chips with the reduced thickness of a semiconductor wafer is suppressed. When the semiconductor wafer is cut at the dicing step for the semiconductor wafer, a blade is advanced as follows: in dicing in a first direction (Y-direction in FIG. 12) along a first straight line, the blade is advanced from a first point to a second point. The first point is positioned in a first portion and the second point is opposed to the first point with a second straight line running through the center point of the semiconductor wafer in between.

公开(公告)号：US20160126218A1

公开(公告)日：2016-05-05

申请号：US14710070

申请日：2015-05-12

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Yoichiro KURITA

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L24/97 ,  H01L21/02076 ,  H01L21/67132 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/7555 ,  H01L2224/756 ,  H01L2224/75743 ,  H01L2224/759 ,  H01L2224/83104 ,  H01L2224/832 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/05442 ,  H01L2924/10253 ,  H01L2924/1032

摘要： According to one embodiment, there is provided a bonding method of a semiconductor chip. The bonding method includes arranging an activated front surface of a semiconductor chip and an activated front surface of a substrate so as to face each other with a back surface of the semiconductor chip attached to a sheet. The bonding method includes pushing the back surface of the semiconductor chip through the sheet to closely attach the activated front surface of the semiconductor chip and the activated front surface of the substrate. The bonding method includes stripping the sheet from the back surface of the semiconductor chip while maintaining a state in which the activated front surface of the semiconductor chip is closely attached to the activated front surface of the substrate.

摘要翻译： 根据一个实施例，提供了半导体芯片的接合方法。 接合方法包括将半导体芯片的激活前表面和基板的激活前表面布置成使得与附接到片材的半导体芯片的背面彼此面对。 接合方法包括通过片材推动半导体芯片的后表面以紧密地附着半导体芯片的激活的前表面和激活的基板的前表面。 接合方法包括从半导体芯片的背面剥离片材，同时保持半导体芯片的活化前表面紧密附着于基板的活化前表面的状态。

公开(公告)号：US09177936B2

公开(公告)日：2015-11-03

申请号：US14150972

申请日：2014-01-09

申请人： Renesas Electronics Corporation

发明人： Nobuyasu Muto

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/04 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/04042 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/75743 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/4554

摘要： Chip cracking that occurs when a dicing step using a blade is carried out to acquire semiconductor chips with the reduced thickness of a semiconductor wafer is suppressed. When the semiconductor wafer is cut at the dicing step for the semiconductor wafer, a blade is advanced as follows: in dicing in a first direction (Y-direction in FIG. 12) along a first straight line, the blade is advanced from a first point to a second point. The first point is positioned in a first portion and the second point is opposed to the first point with a second straight line running through the center point of the semiconductor wafer in between.

摘要翻译： 进行使用叶片的切割步骤进行以获得半导体晶片的厚度减小的半导体芯片时发生的切屑破裂。 当在半导体晶片的切割步骤中切割半导体晶片时，刀片如下进行：沿着第一直线在第一方向（图12中的Y方向）的切割中，刀片从第一直线 指向第二点。 第一点位于第一部分中，第二点与第一点相对，第二点与穿过其间的半导体晶片的中心点的第二直线相对。

公开(公告)号：US20150228624A1

公开(公告)日：2015-08-13

申请号：US14567056

申请日：2014-12-11

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Shota MIKI

IPC分类号： H01L25/065 ,  H01L23/18 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/367 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75743 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/157 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10977

摘要： A semiconductor device includes a wiring substrate, a first semiconductor chip flip-chip connected to the wiring substrate, a first underfill resin filled between the wiring substrate and the first semiconductor chip, the first underfill resin including a pedestal portion arranged in a periphery of the first semiconductor chip, a second semiconductor chip flip-chip connected to the first semiconductor chip, and being larger in area than the first semiconductor chip, and a second underfill resin filled between the first semiconductor chip and the second semiconductor chip, the second underfill resin covering an upper face of the pedestal portion of the first underfill resin and a side face of the second semiconductor chip.

摘要翻译： 半导体器件包括布线基板，连接到布线基板的第一半导体芯片倒装芯片，填充在布线基板和第一半导体芯片之间的第一底部填充树脂，第一底部填充树脂包括布置在布线基板的周边的基座部分 第一半导体芯片，连接到第一半导体芯片的第二半导体芯片倒装芯片，并且面积大于第一半导体芯片，以及填充在第一半导体芯片和第二半导体芯片之间的第二底部填充树脂，第二底部填充树脂 覆盖第一底部填充树脂的基座部分的上表面和第二半导体芯片的侧面。

公开(公告)号：US08769810B2

公开(公告)日：2014-07-08

申请号：US12699958

申请日：2010-02-04

申请人： Toru Nishino ,  Kazuyuki Ikura

发明人： Toru Nishino ,  Kazuyuki Ikura

IPC分类号： H05K3/30 ,  H05K13/00 ,  H05K13/04 ,  H05K13/08 ,  H01L21/70 ,  H01L21/82 ,  H01L23/00 ,  H01L25/00

CPC分类号： H05K13/0015 ,  H01L21/70 ,  H01L21/82 ,  H01L24/75 ,  H01L24/81 ,  H01L24/82 ,  H01L24/85 ,  H01L25/50 ,  H01L27/14601 ,  H01L31/18 ,  H01L2224/16 ,  H01L2224/279 ,  H01L2224/43 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H05K13/0413 ,  H05K13/0452 ,  H05K13/0478 ,  H05K13/08 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/53174 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

摘要翻译： 将第一安装部件和第二安装部件安装到基板的部件安装方法包括：拍摄第二安装部件的构造的图像并执行图像识别，基于所述第一安装部件的结果将所述第一安装部件安装到所述板上 对第二安装部件的构造进行图像识别，以及基于安装到板的第一安装部件的图像识别的结果将第二安装部件安装到基板。

公开(公告)号：US08748229B2

公开(公告)日：2014-06-10

申请号：US13593139

申请日：2012-08-23

申请人： Takao Nishimura ,  Takayuki Norimatsu

发明人： Takao Nishimura ,  Takayuki Norimatsu

IPC分类号： H01L21/00

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/75744 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/90 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665

摘要： A semiconductor device includes a supporting board, a first semiconductor element mounted on a main surface of the supporting board; and an electronic component provided between the supporting board and the first semiconductor element; wherein the supporting board includes a concave part formed in a direction separated from the first semiconductor element; and at least a part of the electronic component is accommodated in the concave part.

摘要翻译： 半导体器件包括支撑板，安装在支撑板的主表面上的第一半导体元件; 以及设置在所述支撑板和所述第一半导体元件之间的电子部件; 其中所述支撑板包括沿与所述第一半导体元件分离的方向形成的凹部; 并且所述电子部件的至少一部分容纳在所述凹部中。

公开(公告)号：US20130005086A1

公开(公告)日：2013-01-03

申请号：US13611222

申请日：2012-09-12

申请人： NOBUYASU MUTO

发明人： NOBUYASU MUTO

IPC分类号： H01L21/50

CPC分类号： H01L25/0652 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/04 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/04042 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/75743 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/4554

摘要： Chip cracking that occurs when a dicing step using a blade is carried out to acquire semiconductor chips with the reduced thickness of a semiconductor wafer is suppressed. When the semiconductor wafer is cut at the dicing step for the semiconductor wafer, a blade is advanced as follows: in dicing in a first direction (Y-direction in FIG. 12) along a first straight line, the blade is advanced from a first point to a second point. The first point is positioned in a first portion and the second point is opposed to the first point with a second straight line running through the center point of the semiconductor wafer in between.

摘要翻译： 进行使用叶片的切割步骤进行以获得半导体晶片的厚度减小的半导体芯片时发生的切屑破裂。 当在半导体晶片的切割步骤中切割半导体晶片时，刀片如下进行：沿着第一直线在第一方向（图12中的Y方向）的切割中，刀片从第一直线 指向第二点。 第一点位于第一部分中，第二点与第一点相对，第二点与穿过其间的半导体晶片的中心点的第二直线相对。

公开(公告)号：US08230590B2

公开(公告)日：2012-07-31

申请号：US11968971

申请日：2008-01-03

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H05K3/30 ,  H05K13/04 ,  H01L24/02

CPC分类号： H05K3/305 ,  H01L21/561 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2731 ,  H01L2224/27901 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29019 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30141 ,  H01L2224/30177 ,  H01L2224/32055 ,  H01L2224/32056 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/3313 ,  H01L2224/3314 ,  H01L2224/33177 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75743 ,  H01L2224/75841 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0695 ,  H01L2224/0401

摘要： A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

摘要翻译： 电子部件的安装方法包括在布线基板上的多个电子部件安装部的各个上设置粘合剂的工序; 以及通过粘合剂将电子部件中的一个固定在多个电子部件安装部的每一个上的步骤。 当粘合剂设置在多个电子部件安装部件中的每一个上时，设置在安装第N个电子部件的安装部分上的粘合剂的体积重心沿更靠近安装部分的方向移动， 设置与第N电子部件要安装的安装部相邻且相邻的（N负1以上）电子部件。

公开(公告)号：US08136238B2

公开(公告)日：2012-03-20

申请号：US12364756

申请日：2009-02-03

申请人： Michiyoshi Takano

发明人： Michiyoshi Takano

IPC分类号： H05K3/30

CPC分类号： H01L24/81 ,  H01L21/4842 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By pushing up on a tape substrate by a bonding stage, and applying suction to the tape substrate through a suction groove, boundary portions of a semiconductor chip mounting region are drawn into the suction groove, and curved sections are formed in the tape substrate at locations corresponding to edge sections of a semiconductor chip and inclined sections disposed in outer circumference sections of the curved sections are formed in the tape substrate.

摘要翻译： 提供了一种控制突起电极的高度并增加半导体芯片的边缘部分和带基片的引线端之间的间隙的方法。 通过在接合台上推上带状基板，通过吸引槽对带基板进行吸引，将半导体芯片安装区域的边界部分吸引到吸引槽内，在带基板的位置形成弯曲部 对应于半导体芯片的边缘部分和设置在弯曲部分的外周部分中的倾斜部分形成在带基板中。

公开(公告)号：US08087163B2

公开(公告)日：2012-01-03

申请号：US12092806

申请日：2006-11-17

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： H05K3/34

CPC分类号： B23K1/0056 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16105 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75253 ,  H01L2224/75743 ,  H01L2224/75822 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required in the connecting areas is achieved by exposing the back of the component to laser energy, a mechanical connecting contact (23) is formed between opposing connecting surfaces (17, 18) of the component and the carrier substrate, and at least one electrically conducting connecting contact (22) is formed between terminal faces (13, 15) of the carrier substrate and of the component arranged at an angle to one another by t least partially melting solder material, whereby the assembly unit manufactured by this method has at least one contact arrangement.

摘要翻译： 本发明涉及一种用于制造微电子部件（11）和载体基板（12）之间的接触装置（10）和通过该方法制造的组装单元（24）的方法，由此在连接区域中所需的热能是 通过将部件的背面暴露于激光能量来实现，在部件和载体基板的相对的连接表面（17,18）之间形成机械连接接触件（23），并且至少一个导电连接接头（22）是 通过至少部分地熔化焊料材料而形成在载体基板的端子面（13,15）和通过至少部分熔融焊料材料彼此成角度配置的部件之间，由此通过该方法制造的组装单元具有至少一个接触装置。