公开(公告)号：US20040171336A1

公开(公告)日：2004-09-02

申请号：US10793263

申请日：2004-03-04

申请人： SEIKO INSTRUMENTS INC.

发明人： Kazuhiko Arai ,  Kouji Minami

IPC分类号： B24B007/00 ,  B24B029/00

CPC分类号： B24B37/042 ,  B24B19/226 ,  B24B37/00 ,  B24B41/06 ,  B24B49/16 ,  G02B6/25 ,  G02B6/3863 ,  Y10T83/4531

摘要： An end face polishing apparatus with improved polishing precision regardless of the length of ferrules when end faces of the ferrules are polished is provided. In an end face polishing apparatus polishing a rod-shaped member mounted at a polishing fixture by pressing the rod-shaped member against a lapping member on a lapping machine provided on a surface plate that is supported at the main body of the apparatus to rotate and rock, there are a plurality of rod-shaped guide members provided at the polishing fixture radially outwardly projecting and a tubular member capable of supporting the polishing fixture through the guide members on the surface plate. In this way, the guide member sat the polishing fixture and the tubular member abut against each other so that the movement of the polishing fixture in the pressing direction is restricted.

摘要翻译： 提供了当套圈的端面被抛光时，与套管的长度无关地提高抛光精度的端面抛光装置。 在端面抛光装置中，通过将杆状构件压靠在设置在所述装置的主体上的表面板上的研磨机上将研磨构件压靠在研磨装置上来研磨安装在研磨固定装置上的杆状构件的旋转， 在抛光装置上有多个设置在径向向外突出的杆状引导构件和能够通过表面板上的引导构件支撑抛光固定件的管状构件。 以这种方式，引导构件坐在抛光夹具上，并且管状构件彼此抵靠，使得抛光夹具在按压方向上的移动受到限制。

公开(公告)号：US20040142646A1

公开(公告)日：2004-07-22

申请号：US10754997

申请日：2004-01-10

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Hung Chih Chen ,  John M. White ,  Shijian Li ,  Fred C. Redeker ,  Ramin Emami

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30 ,  B24B37/12 ,  B24B37/32 ,  B24B41/007

摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

公开(公告)号：US20040053567A1

公开(公告)日：2004-03-18

申请号：US10246944

申请日：2002-09-18

发明人： Gary O. Henderson

IPC分类号： B24B001/00 ,  B24B029/00

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D18/00

摘要： End effectors, apparatuses including end effectors for conditioning planarizing pads, and methods for manufacturing end effectors with contact elements to condition planarizing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector includes a member having a first surface and a plurality of generally uniformly shaped contact elements attached to the first surface. The uniformly shaped contact elements project generally transversely from the first surface. In a further aspect of this embodiment, the uniformly shaped contact elements can be conical, frusto-conical, cylindrical, or other suitable configurations. The contact elements can also have a wear-resistant, carbon-like-diamond, silicon, and/or silicon carbide layer. Furthermore, the contact elements can have generally rounded tips.

摘要翻译： 这里公开了包括用于调节平面化焊盘的末端执行器的终端执行器，以及用于制造具有接触元件的末端执行器来调节用于抛光微器件工件中的平坦化焊盘的方法。 在一个实施例中，末端执行器包括具有附接到第一表面的第一表面和多个大致均匀形状的接触元件的构件。 均匀形状的接触元件大致横向于从第一表面突出。 在该实施例的另一方面，均匀成形的接触元件可以是圆锥形，截头圆锥形，圆柱形或其它合适的构型。 接触元件还可以具有耐磨，碳 - 金刚石，硅和/或碳化硅层。 此外，接触元件可以具有大致圆形的尖端。

公开(公告)号：US20030194948A1

公开(公告)日：2003-10-16

申请号：US10408228

申请日：2003-04-08

发明人： Frederic Metral

IPC分类号： B24B001/00 ,  B24B007/19 ,  B24C001/00 ,  B24B007/30 ,  B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30 ,  B24B57/02

摘要： The invention provides a chemical-mechanical polishing machine for polishing a wafer of a material, the machine comprising a rotary polishing turntable, a polishing head comprising a non-rotary portion and a rotary portion, and means for delivering an abrasive to the surface of the polishing turntable. The machine is remarkable in the means for distributing the abrasive comprise a hollow abrasive delivery ring fitted with abrasive feed means, with a plurality of abrasive delivery orifices distributed over its bottom face, and fixing means enabling it to be secured to the non-rotary portion of the polishing head, the ring being disposed around the rotary portion in a plane that is substantially parallel to the plane of the polishing turntable, but that is spaced apart therefrom. The invention is applicable to polishing wafers of semiconductor material.

摘要翻译： 本发明提供了一种用于抛光材料晶片的化学机械抛光机，该机器包括旋转抛光转盘，包括非旋转部分和旋转部分的抛光头，以及用于将磨料输送到表面的装置 抛光转盘。 该机器在用于分配磨料的装置中是显着的，其包括装配有磨料进料装置的中空磨料输送环，多个磨料输送孔​​分布在其底面上，以及固定装置，使其能够固定到非旋转部分 抛光头的环绕旋转部分设置在基本上平行于抛光转台平面的平面中，但是与其间隔开。 本发明适用于抛光半导体材料的晶片。

公开(公告)号：US20020195058A1

公开(公告)日：2002-12-26

申请号：US09983126

申请日：2001-10-23

发明人： Hong-Rok Choi

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： H01L21/68735 ,  H01L21/67109 ,  H01L21/6875

摘要： An apparatus for holding a wafer for use in a process chamber for fabricating a semiconductor device, wherein there is provided a chuck for placing the wafer thereon and disposed to be movable in an up and down direction, a graphite disposed on the chuck and having at least one hole formed near an edge thereof, and a supporter for supporting the wafer to a given height having one end inserted in the hole. The graphite has sufficient conductivity to provide a temperature condition for carrying out a given process. The apparatus being capable of uniformly forming a deposition layer on a rear surface as well as a front surface of the wafer since the given process is carried out in a state wherein the wafer is supported to the given height.

摘要翻译： 一种用于保持用于制造半导体器件的处理室中的晶片的设备，其中设置有用于将晶片放置在其上并设置成可沿上下方向移动的卡盘，设置在卡盘上的石墨， 在其边缘附近形成至少一个孔，以及用于将晶片支撑到具有插入孔中的一端的给定高度的支撑件。 石墨具有足够的导电性以提供用于进行给定工艺的温度条件。 该装置能够在晶片的后表面和前表面上均匀地形成沉积层，因为在晶片被支撑到给定高度的状态下进行给定的处理。

公开(公告)号：US20020177395A1

公开(公告)日：2002-11-28

申请号：US10153317

申请日：2002-05-22

申请人： Samsung Electronics Co., Ltd.

发明人： Myoung-Sik Han ,  Chang-Ki Hong

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30

摘要： Disclosed is a polishing head of a chemical and mechanical polishing apparatus uniformly polishing a wafer. The polishing head has a body defining at least one air passage therein through which air is introduced into and exhausted from the polishing head. The body is movable upward and downward. An air pressure distributing member is mounted to a lower portion of the body for distributing a pressure of the air supplied through the air passage. A membrane is mounted to enclose a lower surface of the air pressure distributing member so as to be expanded and shrunk by the pressure of the air supplied through the air pressure distributing member. A surface of the air pressure distributing member makes contact with a back surface of a wafer. An air pressure compensating member makes uniformly the pressure that is applied to central and edge portions of the wafer which makes contact with the membrane. Since the air pressure compensating member applies to the edge portion of the wafer, the air pressure is compensated so that the uniform air pressure is applied to the wafer. Thus, the wafer is uniformly polished.

摘要翻译： 公开了一种化学和机械抛光装置的抛光头，其均匀抛光晶片。 抛光头具有限定至少一个空气通道的主体，空气通过该主体被引入和从抛光头排出。 身体上下移动。 气压分配构件安装到主体的下部，用于分配通过空气通道供应的空气的压力。 安装膜以封闭空气压力分配构件的下表面，以便通过通过空气压力分配构件供应的空气的压力而膨胀和收缩。 空气压力分配构件的表面与晶片的背面接触。 空气压力补偿部件均匀地施加施加到与膜接触的晶片的中心部分和边缘部分的压力。 由于空气压力补偿构件施加到晶片的边缘部分，所以补偿空气压力，使得均匀的空气压力被施加到晶片。 因此，晶片被均匀抛光。

公开(公告)号：US20020173255A1

公开(公告)日：2002-11-21

申请号：US10117892

申请日：2002-04-05

发明人： Norman Shendon ,  Michael T. Sherwood ,  Harry Lee

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.

摘要翻译： 化学机械头包括保持环，以在抛光期间将基底保持在安装表面下方。 保持环具有底部表面的下部，用于在抛光期间与抛光垫接触并由第一材料（例如塑料）制成，以及由第二不同材料（例如金属）制成的上部。

公开(公告)号：US20020098785A1

公开(公告)日：2002-07-25

申请号：US09927280

申请日：2001-08-09

发明人： Trung Tri Doan ,  Scott E. Moore

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/11 ,  B24B37/14 ,  B24D9/085 ,  B25B11/005

摘要： A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion. In another embodiment, a signal can be applied to the platen to draw the polishing pad toward the platen via electrostatic or electromagnetic forces. In still another embodiment, the polishing pad can be attached to a pad support and conditioned on a separate jig.

摘要翻译： 一种用于将平坦化介质（例如抛光垫）可释放地附接到化学机械平面化机器的压板的方法和装置。 在一个实施例中，该装置可包括联接到真空源的压板上表面中的若干孔。 当通过压板中的孔抽取真空时，抛光垫被紧紧地压靠在压板上，并且因此在平坦化期间当半导体衬底与抛光垫接合时可能不太可能起皱。 当真空释放时，抛光垫可以容易地与压板分离。 该装置还可以包括液体捕集器以将液体与由真空源通过孔抽出的流体分离，并且还可以包括可释放的止动件，以防止抛光垫与压板分离，如果真空源在压板为 在运动。 在另一个实施例中，可以将信号施加到压板上，以通过静电或电磁力将抛光垫朝向压板。 在另一个实施例中，抛光垫可以附接到垫支撑件并且在单独的夹具上进行调节。

公开(公告)号：US20040137832A1

公开(公告)日：2004-07-15

申请号：US10739193

申请日：2003-12-19

发明人： Jin-Ok Moon

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30

摘要： An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.

摘要翻译： 化学和机械抛光晶片的装置包括膜支撑体和膜。 膜具有被分割成多个区域的压力部分和从多个区域之间的边界延伸的分隔部分。 膜的分隔部被固定在能够在形成于膜支撑体上的引导槽中上下移动的滑块上。

公开(公告)号：US20040053566A1

公开(公告)日：2004-03-18

申请号：US10619745

申请日：2003-07-15

申请人： Applied Materials, Inc.

发明人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Sidney Huey ,  Fred C. Redeker

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/16

摘要： A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

摘要翻译： 提供了具有一个以上抛光站的化学机械抛光系统。 抛光站包括安装到压板上表面的压板和衬垫。 将压板的上表面图案化以限定凸起区域和凹陷区域。 凸起区域为衬垫提供刚性的安装表面，并且凹陷区域在衬垫与衬底接触时向衬垫提供期望程度的柔性和顺应性。