Abstract:
A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
Abstract:
A plurality of spaced apart supports are designed to closely support a work piece immediately adjacent the edge being worked, ground or polished. Adjacent shear forced are also eliminated by the use of a polymeric interconnections used to both generally contribute to the spacing and to transmit the vacuum in a distributed manner among the individual support units. The top and bottom surfaces of the supports are dressably machineable in place on the working table to insure that all are brought to exactly the same height to insure even support, and utilize a hardened rubber, or any other suitable machinable material which will not enable the work piece to displace significantly downwardly upon the application of vacuum. The tops and bottoms, as a group, are selectively operable. The ability to periodically dress both ends of the interconnected supports gives the user the power to continually insure that each interconnected support set is within a more exacting vertical tolerance. Further, the machineable ends can be removed and replaced.
Abstract:
A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.
Abstract:
A substrate holder is described which has a movable plate elastically mounted inside a main body. With the substrate holder, a polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate. In a first (downward) mode the movable plate stays in mechanical contact with the substrate whereas in a second (upward) mode an air cushion is generated in a chamber between the movable plate and the substrate for pressurizing the substrate onto the polishing pad.
Abstract:
A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.