Polishing head of chemical mechanical polishing apparatus and polishing method using the same
    1.
    发明申请
    Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
    化学机械抛光装置的抛光头和使用其的抛光方法

    公开(公告)号:US20030008604A1

    公开(公告)日:2003-01-09

    申请号:US10107612

    申请日:2002-03-27

    CPC classification number: B24B37/30 B24B41/061

    Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

    Abstract translation: 化学机械抛光(CMP)装置包括由载体和膜构成的抛光头,并且位于支撑部件的抛光垫上。 抛光头具有安装在载体的内部中心的支撑件,位于载体和支撑件之间的卡环,以及用于沿垂直方向上下移动夹紧环的装置。 支撑件与膜一起形成密封空间,夹紧环将真空中的晶片夹紧。

    Flexible dressable edge support
    2.
    发明申请
    Flexible dressable edge support 有权
    灵活可修边缘支撑

    公开(公告)号:US20040082270A1

    公开(公告)日:2004-04-29

    申请号:US10280623

    申请日:2002-10-25

    Inventor: John Blick

    CPC classification number: B24B41/068

    Abstract: A plurality of spaced apart supports are designed to closely support a work piece immediately adjacent the edge being worked, ground or polished. Adjacent shear forced are also eliminated by the use of a polymeric interconnections used to both generally contribute to the spacing and to transmit the vacuum in a distributed manner among the individual support units. The top and bottom surfaces of the supports are dressably machineable in place on the working table to insure that all are brought to exactly the same height to insure even support, and utilize a hardened rubber, or any other suitable machinable material which will not enable the work piece to displace significantly downwardly upon the application of vacuum. The tops and bottoms, as a group, are selectively operable. The ability to periodically dress both ends of the interconnected supports gives the user the power to continually insure that each interconnected support set is within a more exacting vertical tolerance. Further, the machineable ends can be removed and replaced.

    Abstract translation: 多个间隔开的支撑件被设计成紧密地支撑紧邻正被加工,研磨或抛光的边缘的工件。 相邻的剪切强制也通过使用聚合物互连来消除,所述聚合物互连通常有助于间隔并且以分布的方式在各个支撑单元之间传递真空。 支撑件的顶部和底部表面可以适当地可加工到工作台上的位置,以确保所有的壳体都达到完全相同的高度以确保均匀的支撑,并且使用硬化橡胶或任何其他合适的可加工材料,这些材料将不能使 工件在施加真空时显着向下移位。 顶部和底部,作为一组,可选择性地可操作。 周期性地连接互连支撑的两端的能力使得用户能够不断地确保每个相互联系的支撑组在更加严格的垂直公差之内。 此外,可移除和更换可机加工端。

    Supporting device for a plurality of adapter chucks
    3.
    发明申请
    Supporting device for a plurality of adapter chucks 失效
    用于多个适配器卡盘的支撑装置

    公开(公告)号:US20020052177A1

    公开(公告)日:2002-05-02

    申请号:US09984579

    申请日:2001-10-30

    CPC classification number: B24B41/061 B24B13/005

    Abstract: A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of the spindle shaft and having a seating for an adapter chuck, and a flexible vacuum/gas line provided between the seating and the spindle shaft. The arm is adjustable as to its angle of inclination relative to an axis of the spindle shaft.

    Abstract translation: 用于多个用于光学部件的精密研磨或抛光的适配器卡盘的支撑装置包括具有用于供应气体和真空中的一个的中心孔的主轴,由主轴转动的头部可调节地支撑的至少一个臂,以及 具有用于适配器卡盘的座,以及设置在座椅和主轴之间的柔性真空/气体线。 臂相对于主轴的轴线可以调整其倾斜角度。

    Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate
    4.
    发明申请
    Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate 有权
    用于化学机械抛光的半导体衬底保持器,其包含可移动板

    公开(公告)号:US20020177394A1

    公开(公告)日:2002-11-28

    申请号:US10156482

    申请日:2002-05-28

    CPC classification number: B24B37/30 B24B41/06

    Abstract: A substrate holder is described which has a movable plate elastically mounted inside a main body. With the substrate holder, a polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate. In a first (downward) mode the movable plate stays in mechanical contact with the substrate whereas in a second (upward) mode an air cushion is generated in a chamber between the movable plate and the substrate for pressurizing the substrate onto the polishing pad.

    Abstract translation: 描述了具有弹性地安装在主体内的可动板的衬底保持器。 利用基板保持器,可以在对应于可移动板的两个不同垂直端位置的两个基本操作模式中执行抛光操作。 在第一(向下)模式中,可移动板与基板保持机械接触,而在第二(向上)模式中,在可移动板和基板之间的室中产生气垫,以将基板加压到抛光垫上。

    Substrate polishing apparatus
    5.
    发明申请
    Substrate polishing apparatus 失效
    基材抛光装置

    公开(公告)号:US20020132569A1

    公开(公告)日:2002-09-19

    申请号:US10087502

    申请日:2002-02-28

    Inventor: Robert D. Tolles

    CPC classification number: A61N1/362 A61N1/3956 B24B37/24

    Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.

    Abstract translation: 用于化学机械抛光的抛光材料具有纤维网和将纤维保持在网中的粘合剂材料。 粘合剂材料在纤维之间聚合以在网状物的纤维之间的空隙中留下孔。 纤维和粘合剂材料为抛光材料提供脆性质地。 纤维可以是纤维素,粘合剂材料可以是酚醛树脂。

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