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公开(公告)号：US06705934B1
公开(公告)日：2004-03-16
申请号：US09763361
申请日：2001-02-21
申请人： Kuniyasu Shiro , Kazuhiko Hashisaka , Tetsuo Oka
发明人： Kuniyasu Shiro , Kazuhiko Hashisaka , Tetsuo Oka
IPC分类号： B24D328
摘要： The present invention relates to a polishing pad which is characterized in that it is of micro rubber A-type hardness at least 80°, has closed cells of average cell diameter no more than 1000 &mgr;m, is of density in the range 0.4 to 1.1 and contains polyurethane and polymer produced from a vinyl compound. When planarizing local unevenness on a semiconductor substrate with the polishing pad relating to the present invention, the polishing rate is high, the global step height is low, dishing does not readily occur at the metallic interconnects, clogging and permanent set of the surface layer region do not readily occur and the polishing rate is stable.
摘要翻译： 抛光垫技术领域本发明涉及一种抛光垫，其特征在于，其具有至少80°的微橡胶A型硬度，具有不大于1000μm的平均泡孔直径的密闭孔，其密度在0.4至1.1的范围内， 含有由乙烯基化合物制备的聚氨酯和聚合物。 当使用本发明的抛光垫对半导体衬底上的局部不均匀性进行平面化时，抛光速率高，全局步长低，金属互连不易发生凹陷，表面层区域的堵塞和永久变形 不易发生，抛光速度稳定。
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公开(公告)号：US06743086B2
公开(公告)日：2004-06-01
申请号：US09928157
申请日：2001-08-10
申请人： Eric W. Nelson , James F. Pitzen
发明人： Eric W. Nelson , James F. Pitzen
IPC分类号： B24D328
CPC分类号： B24B55/102 , B24D7/02
摘要： A universal abrasive article adapted to mount on a mounting surface of a sanding machine having a plurality of dust extraction holes that define an open area. The abrasive article includes a plurality of discrete apertures that are sized and positioned so as to expose a majority of the open area of the dust extraction holes independent of the angular orientation of the abrasive article when the abrasive article is in registration with the mounting surface. The discrete apertures may include elongated, arcuate slots that may be symmetrically positioned about a center point of the abrasive article. In one embodiment, the discrete apertures may include seven arcuate slots. These embodiments also include sufficient abrasive material to provide adequate sanding cut rate and structural integrity during use and removal.
摘要翻译： 一种通用研磨制品，其适于安装在具有限定开放区域的多个除尘孔的砂光机的安装表面上。 磨料制品包括多个离散的孔，其大小和定位以便当研磨制品与安装表面对准时，与磨料制品的角度定向无关，露出大部分除尘孔的敞开区域。 分立的孔可以包括细长的弧形槽，其可以围绕磨料制品的中心点对称地定位。 在一个实施例中，分立孔可以包括七个弧形槽。 这些实施例还包括足够的研磨材料，以在使用和移除期间提供足够的砂磨切割速率和结构完整性。
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公开(公告)号：US06514302B2
公开(公告)日：2003-02-04
申请号：US09855950
申请日：2001-05-15
IPC分类号： B24D328
CPC分类号： B24D3/28 , B24D5/02 , B24D7/02 , B24D18/0009
摘要： Granular molding materials for fabricating abrasive articles, such as, for example, grinding wheels, are produced by mixing heated abrasive grains with a resin blend including two phenol-novolac resins. Preferably, the resin blend is added to the abrasive grains in the mixer apparatus of the invention, which can be a bowl type mixer. The mixer can be preheated by directing a heated gas, such as air, across the mixer. The granular molding material can also include a curing agent, fillers and other materials generally employed in fabricating abrasive articles.
摘要翻译： 用于制造磨料制品的颗粒成型材料，例如砂轮，是通过将加热的磨料颗粒与包括两种苯酚酚醛清漆树脂的树脂共混物混合来制备的。 优选地，将树脂共混物加入到本发明的混合装置中的磨料颗粒中，其可以是碗型混合器。 可以通过将诸如空气的加热气体引导到混合器来预热混合器。 颗粒状成型材料还可以包括固化剂，填料和通常用于制造磨料制品的其它材料。
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4.发明授权Abrasive grinding tools with hydrated and nonhalogenated inorganic grinding aids 失效磨料研磨工具，具有水合和非卤代无机助磨剂公开(公告)号：US06251149B1
公开(公告)日：2001-06-26
申请号：US09075294
申请日：1998-05-08
申请人： Gerald W. Meyer , Paul E. Johnson
发明人： Gerald W. Meyer , Paul E. Johnson
IPC分类号： B24D328
摘要： A bonded-abrasive tool includes a matrix of an organic bond, abrasive grains dispersed in the organic bond and a grinding aid in the form of either an inorganic nonhalogenated filler or a hydrated filler. The inorganic nonhalogenated filler can react with free radicals released from the organic bond during grinding. The hydrated filler endothermically releases water. A coated-abrasive tool includes a flexible substrate, abrasive grains bonded to the flexible substrate, and an organic bond containing a grinding aid including an inorganic nonhalogenated filler or a hydrated filler coated on the substrate.
摘要翻译： 粘合研磨工具包括有机结合基体，分散在有机键中的磨料颗粒和无机非卤化填料或水合填料形式的研磨助剂。 无机非卤化填料可以在研磨过程中与有机键释放的自由基反应。 水合填料吸热释放水。 涂覆研磨工具包括柔性基底，结合到柔性基底的磨料颗粒和含有研磨助剂的有机粘合剂，所述研磨助剂包括涂覆在基底上的无机非卤化填料或水合填料。
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5.发明授权Polishing pad having an advantageous micro-texture and methods relating thereto 有权抛光垫具有有利的微观结构和与之有关的方法公开(公告)号：US06679769B2
公开(公告)日：2004-01-20
申请号：US09775972
申请日：2001-02-02
IPC分类号： B24D328
摘要： This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.
摘要翻译： 本发明涉及抛光垫和一种使抛光垫表面易于加工的方法，从而有助于抛光垫表面的永久性改变以产生有利的微观纹理。 有利的微观结构在统计学上是统一的，并且提供了具有改进的突破预处理时间的抛光垫。 本发明的抛光垫适用于在集成电路制造中通常遇到的诸如玻璃，电介质/金属复合物和含有铜，硅，二氧化硅，铂和钨的基板的抛光/平面化。
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公开(公告)号：US06672952B1
公开(公告)日：2004-01-06
申请号：US09219711
申请日：1998-12-23
IPC分类号： B24D328
CPC分类号： B32B27/12 , B24D3/002 , B24D3/28 , B24D11/02 , B32B7/08 , B32B25/10 , B32B2307/582 , B32B2319/00 , B32B2398/20 , B32B2475/00
摘要： A tearable abrasive article is provided which includes a backing comprising a polymer film having a scrim partially embedded therein and an abrasive coating comprising a plurality of abrasive articles and a binder bonded to at least one side of the backing.
摘要翻译： 提供了一种可撕裂的磨料制品，其包括背衬，其包括具有部分地嵌入其中的稀松布的聚合物膜和包含多个磨料制品的磨料涂层和粘合到背衬的至少一侧的粘合剂。
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7.发明授权Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof 失效抛光垫和化学机械抛光浆料改性剂的原位输送方法及其应用公开(公告)号：US06575823B1
公开(公告)日：2003-06-10
申请号：US10077709
申请日：2002-03-04
申请人： Yaw S. Obeng , Edward M. Yokley
发明人： Yaw S. Obeng , Edward M. Yokley
IPC分类号： B24D328
摘要： The present invention is directed, in general, to polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to polishing pads containing a precursor slurry modifier. In the presence of a polishing slurry during chemical mechanical polishing, the precursor is released to the polishing slurry to form a slurry modifier thereby improving polishing.
摘要翻译： 本发明一般涉及用于半导体晶片和集成电路的化学机械抛光的抛光垫。 更具体地，本发明涉及包含前体浆料改性剂的抛光垫。 在化学机械抛光期间在抛光浆料存在下，将前体释放到抛光浆料中以形成浆料改性剂，从而改善抛光。
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