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公开(公告)号:US06311399B1
公开(公告)日:2001-11-06
申请号:US09412665
申请日:1999-10-05
申请人: Ronald S. Steelman , John R. David
发明人: Ronald S. Steelman , John R. David
IPC分类号: B26F124
CPC分类号: B26F1/24 , B26F1/32 , B29C63/0078
摘要: Tools and methods for releasing air entrapped between sheeting material and a substrate around a rivet are disclosed. The tools include movable pins biased outwardly by a resilient member. As a result, the pins can retract when encountering a discontinuity on an otherwise planar surface, such as a rivet, while still allowing for perforation of the sheeting around the rivet.
摘要翻译: 公开了用于释放夹在片材与铆钉之间的衬底之间的空气的工具和方法。 这些工具包括通过弹性构件向外偏压的活动销。 结果,当在诸如铆钉的其它平坦表面上遇到不连续性时,销可以缩回,同时仍允许围绕铆钉的片材穿孔。
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公开(公告)号:US06451240B1
公开(公告)日:2002-09-17
申请号:US09579798
申请日:2000-05-26
IPC分类号: B26F124
CPC分类号: B29C51/082 , A61M37/00 , A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B26F1/24 , B29C33/0033 , B29C33/42 , B29C37/0053 , B29C45/2628 , B29C51/00 , B29C2059/023 , B29L2031/7544 , B29L2031/756 , B81B2201/055 , B81C1/00111 , B81C2201/036
摘要: A microneedle array is manufactured using a mold preparation procedure that begins by placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles.
摘要翻译: 使用模具制备程序制造微针阵列,其通过在PMMA材料层上放置光学掩模开始,将PMMA材料暴露于x射线,然后使用光致抗蚀剂工艺显影。 然后将剩余的PMMA材料用金属电镀。 一旦金属达到适当的厚度,就将其分离成为用于微压制程序的金属模具,其中金属模具被压在加热的塑料材料层上。 一旦将模具按压到适当的距离,塑料材料被冷却直到固化,然后将模具分离,从而留下一组微针。
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公开(公告)号:US06629483B2
公开(公告)日:2003-10-07
申请号:US10117055
申请日:2002-04-08
申请人: Shin Iwao
发明人: Shin Iwao
IPC分类号: B26F124
CPC分类号: B09B3/0058 , Y10T83/0237 , Y10T83/8785 , Y10T83/9314 , Y10T83/9423
摘要: A hole-forming device includes a base member having a hole-forming projection facing a bottom of a can. The hole-forming projection is formed on an upper surface of the base member. The base member is slidable upward to the upper part of a case by pushing a pressing member. The hole-forming projection is normally held in the case for safety.
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公开(公告)号:US06520363B1
公开(公告)日:2003-02-18
申请号:US09943455
申请日:2001-08-30
申请人: Joseph Sullivan
发明人: Joseph Sullivan
IPC分类号: B26F124
CPC分类号: H01R13/447 , Y10S33/10
摘要: An electrical receptacle shield in the form of a thin sheet metal stamping for temporarily covering the front opening of a utility receptacle. The receptacle has free front edges that define a front profile having an inner perimeter. The shield has an outer peripheral section in an anterior plane, an inner section in a posterior plane, and an intermediate section that slopes between the inner section and the peripheral section. The peripheral and intermediate sections have a plurality of gaps with a plurality of catches extend outwardly through the gaps. The catches extend outwardly to the inner perimeter of the front edges. The shield is pressed into the receptacle opening, held in position by the catches, and pried out when no longer needed.
摘要翻译: 一种用于临时覆盖公用插座的前开口的薄金属板冲压形式的电插座屏蔽。 容器具有限定具有内周边的前轮廓的自由前缘。 屏蔽体具有在前平面内的外周部分,后平面中的内部部分和在内部部分和周边部分之间倾斜的中间部分。 周边部分和中间部分具有多个间隙,多个捕获部分通过间隙向外延伸。 卡扣向外延伸到前边缘的内周边。 屏蔽被压入插座开口,通过卡扣保持在适当的位置,并在不再需要时被撬出。
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公开(公告)号:US06412384B1
公开(公告)日:2002-07-02
申请号:US09531675
申请日:2000-03-20
申请人: Shin Iwao
发明人: Shin Iwao
IPC分类号: B26F124
CPC分类号: B09B3/0058 , Y10T83/0237 , Y10T83/8785 , Y10T83/9314 , Y10T83/9423
摘要: A hole-forming device includes a base member having a hole-forming projection facing a bottom of a can. The hole-forming projection is formed on an upper surface of the base member. The base member is slidable upward to the upper part of a case by pushing a pressing member. The hole-forming projection is normally held in the case for safety.
摘要翻译: 孔形成装置包括具有面向罐的底部的孔形成突起的基部构件。 孔形成突起形成在基底构件的上表面上。 基座部件通过按压按压部件向上方滑动到壳体的上部。 为了安全起见,孔形突起通常保持在壳体中。
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