OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS
    9.
    发明申请
    OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS 有权
    超平面麦克风制造工艺

    公开(公告)号:US20100280458A1

    公开(公告)日:2010-11-04

    申请号:US12808334

    申请日:2008-10-17

    IPC分类号: A61M5/00 B23P17/04

    摘要: Out-of-plane microneedle manufacturing process comprising the simultaneous creation of a network of microneedles and the creation of a polygonal shaped hat (2) above each microneedle (1) under formation, said process comprising the following steps: providing bridges (3) between the hats (3), maintaining the bridges (3) during the remaining microneedle manufacturing steps, removing the bridges (3), together with the hats (2), when the microneedles (1) are formed.

    摘要翻译: 面外微型制造工艺包括同时创建微针网络并在形成每个微针(1)上方形成多边形帽(2),所述方法包括以下步骤:提供桥 (3),在剩余的微针制造步骤期间保持桥(3),当形成微针(1)时,与帽子(2)一起移除桥(3)。

    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING
    10.
    发明申请
    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING 审中-公开
    生产采用单面加工的微结构结构的方法

    公开(公告)号:US20100224590A1

    公开(公告)日:2010-09-09

    申请号:US12160444

    申请日:2008-05-20

    IPC分类号: B81C1/00

    摘要: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length of the through-bore is formed by a dry etching process performed from the front side of the wafer. Most preferably, upright surfaces of the microneedle structure and the through bore of the structure are formed by dry etching performed via a single mask with differing depths obtained by harnessing aspect ratio limitations of the dry etching process.

    摘要翻译: 用于形成中空微针结构的方法包括处理晶片的前侧以形成从基底突出的至少一个微针和穿过微针并穿过基底的厚度的通孔。 通孔的整个长度通过从晶片的前侧进行的干蚀刻工艺形成。 最优选地,微针结构的直立表面和结构的通孔通过经由通过利用干蚀刻工艺的纵横比限制而获得的不同深度的单个掩模执行的干蚀刻形成。