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公开(公告)号:US06397832B1
公开(公告)日:2002-06-04
申请号:US09706715
申请日:2000-11-07
申请人: Naotake Shuto
发明人: Naotake Shuto
IPC分类号: B28D500
CPC分类号: A44C17/001 , B28D5/00
摘要: Disclosed are a new diamond cutting method and a diamond shape or proportion giving an increased brightness and different brilliant colors to the cut jewel. A piece of diamond having a crown or bezel and a pavilion converging up and down from its girdle is prepared; the table of the crown is cut into a regular polygon having straight sides of an integer multiple of three; star facets, upper-main facets and paired upper-girdle facets are formed on the oblique annular surface between the polygonal table and the girdle; and lower-girdle facets and lower-main facets are cut on the pavilion. The height of the diamond piece is approximately 64% of the diameter of the girdle; the height of the crown is approximately 15.7%; the height of the pavilion is approximately 48.3%; and the largest width of the girdle is approximately 1.2 to 1.4%. The angle formed between the ridge of the crown and the ridge of the pavilion is approximately 77 degrees.
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公开(公告)号:US06591827B2
公开(公告)日:2003-07-15
申请号:US09891095
申请日:2001-06-25
申请人: Roy Fuchs
发明人: Roy Fuchs
IPC分类号: B28D500
CPC分类号: A44C17/001
摘要: A method for preparing a diamond having a six-pointed-star shaped girdle comprising: (1) providing a round diamond; and (2) grooving six equally spaced, equally-sized triangularly-shaped 120° angled grooves in the girdle of the round diamond. Also disclosed is a grooving machine comprising a dop, wherein the dop may be rotated between six equally-spaced stops.
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公开(公告)号:US06460258B1
公开(公告)日:2002-10-08
申请号:US09623097
申请日:2000-08-28
申请人: Gyo Shimotoyodome
发明人: Gyo Shimotoyodome
IPC分类号: B28D500
CPC分类号: B44B3/061 , B28D1/225 , B44B3/063 , C03B33/027 , C03B33/10 , Y10T83/0348 , Y10T225/321
摘要: A scribe body (A) includes an abutment member (30) and a vibration generating member (40) for applying vibrations to the abutment member (30). The scribe body (A) is connected to a support portion (6) of a slide mechanism (3) through a vibration damping member (7). Two pairs of vibration damping members (7) are vertically spacedly arranged. The vibration damping members (7) of each pair are arranged on the left and right sides of the scribe body (A). By relatively moving the abutment member (30), which is pressed against a surface of a workpiece by its own weight of the scribe body (A), along the surface of the workpiece while applying vibration, which are generated by the vibration generating member (40), to the abutment member (30), a scribe line is formed in the surface of the workpiece. Vibration of the scribe (A) is damped by the vibration damping member (7).
摘要翻译: 划线体(A)包括用于向抵接构件(30)施加振动的抵接构件(30)和振动产生构件(40)。 划线体(A)通过减震构件(7)连接到滑动机构(3)的支撑部分(6)。 两对缓冲构件(7)垂直间隔布置。 每对的减震构件(7)布置在划线体(A)的左侧和右侧。 通过相对移动通过其自重的划线体(A)压在工件的表面上的邻接构件(30)沿着工件的表面,同时施加由振动产生构件产生的振动( 如图40所示,在邻接构件(30)上,在工件的表面形成刻划线。 划痕(A)的振动被减振构件(7)阻尼。
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公开(公告)号:US06284661B1
公开(公告)日:2001-09-04
申请号:US08833125
申请日:1997-04-04
申请人: Takashi Yokoyama , Kazuma Yamamoto , Masato Yamamoto , Takahiro Mishima , Go Matsuda , Shigeki Itou
发明人: Takashi Yokoyama , Kazuma Yamamoto , Masato Yamamoto , Takahiro Mishima , Go Matsuda , Shigeki Itou
IPC分类号: B28D500
CPC分类号: C30B33/00 , Y10T83/2109
摘要: A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness can be realized on the cut wafers.
摘要翻译: 一种用于通过在真空中将结晶锭的流或蚀刻气体流引导而从晶体晶片切割晶片的方法和装置。 切割废料可以大大减少,工作环境也可以保持清洁。 此外,可以在切割的晶片上实现优异的表面平滑度。
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公开(公告)号:US06244262B1
公开(公告)日:2001-06-12
申请号:US09473289
申请日:1999-12-28
申请人: Robert A. Keck
发明人: Robert A. Keck
IPC分类号: B28D500
摘要: A method of forming a decorative shape from a concrete block by cutting the block into a predetermined shaped piece, polishing all flat surfaces and then applying a coating of clear material to the surface of said piece.
摘要翻译: 一种通过将块切割成预定的成形件从混凝土块形成装饰形状的方法,抛光所有平坦表面,然后将透明材料涂层施加到所述件的表面。
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