摘要:
In a glass plate working apparatus 1, a carrying-in position 3, a scribing position 4, a removing position 5, a grinding position 6, and a discharging position 7 are arranged at equal intervals linearly along a transporting direction, and a transporting device 8 for transporting glass plates 2 is additionally provided.
摘要:
A glass plate cutting machine 1 includes a cutter wheel 4 for forming a cut line 3 on a glass plate 2; a moving means 5 for moving the cutter wheel 4 along a cut line 3a which has been preset and is to be formed on the glass plate 2; a resiliently pressing device 6 for resiliently pressing the cutter wheel 4 against the glass plate 2; and a control unit 7 for controlling the resiliently pressing device 6 so as to alternately change over the intensity of a resiliently pressing force of that cutter wheel 4 with respect to the glass plate 2 in the movement of the cutter wheel 4 by the moving means 5.
摘要:
A tool changing device for a cutting head of a machine for cutting flat glass sheets, comprising, so that they can slide in a parallel arrangement with elements for sliding on a bridge that supports a cutting head, a carriage for supporting the cutting head, with a motor for translational motion on the bridge, a tool supporting slider, which is normally coupled, by way of reversible fixing elements, to the head supporting carriage during the work of the cutting head and which can be uncoupled, for tool changing operations, in order to allow the movement of the carriage with respect to the slider, which is stationary, to select a tool to be used.
摘要:
Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.
摘要:
A scribing line forming mechanism according to the present invention includes: a scribing line forming means (207) being structured so as to form a scribing line on a substrate by contacting the substrate; and a supporting means for supporting the scribing line forming means such that the scribing line forming means is turnable about a first turning axis (204), the supporting means being structured so as to be turnable about a second turning axis (202), the second turning axis being different from the first turning axis, wherein the axial center of the first turning axis and the axial center of the second turning axis are approximately in parallel, and the axial center of the second turning axis is distant by a predetermined interval from a portion where the substrate and the scribing line forming means contact each other.
摘要:
A method for loading and cutting glass sheets on a cutting table, that includes the steps of: providing, with a scoring head, scoring lines on a first sheet of glass positioned on the cutting table; extracting, during the scoring step, sucker-fitted pick-up arms from below the first sheet being worked; tilting the pick-up arms so as to place the suckers on a second sheet to be picked up, which is arranged substantially vertically adjacent the scoring table; picking up the second sheet, starting to tilt it toward the cutting table during the scoring of the first sheet; moving the scored first sheet away from the cutting table; positioning the scoring head beyond a sheet supporting region, on an opposite side with respect to a pick-up region; and positioning the second sheet on the cutting table.
摘要:
A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).