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公开(公告)号:US6086956A
公开(公告)日:2000-07-11
申请号:US232968
申请日:1999-01-19
申请人: John Fakler , Michael Rush , Scott Campbell
发明人: John Fakler , Michael Rush , Scott Campbell
CPC分类号: C07F5/022 , C07F5/006 , C23C22/63 , C23C22/83 , H05K3/385 , H05K2203/0315 , H05K2203/1157
摘要: A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.
摘要翻译: 公开了一种用于将铜氧化物层还原成金属铜以便于将树脂粘合到金属铜上的组合物。 该组合物是含有环硼烷化合物的水性还原溶液。 这种环状甲硼烷化合物的实例包括具有氮或硫作为成环成员的那些,例如吗啉硼烷,哌啶硼烷,吡啶硼烷,哌嗪硼烷,2,6-吡啶硼烷,4-甲基吗啉硼烷, 氧硫杂环己烷,以及N,N-二乙基苯胺硼烷。