摘要:
A pulley alignment tool for checking the centerline alignment between a driving pulley and a driven pulley which are connected by a V-belt includes a targeting laser which is constructed and arranged to generate a beam of light which will be directed from a location adjacent the driving pulley to a location on the surface of the driven pulley. The targeting laser is mounted in a holder and the holder is constructed and arranged for attachment into the groove of the driving pulley. As a preliminary step, the V-belt which initially connects the driving pulley and driven pulley is removed, thereby making the driving pulley groove accessible for mounting the holder. An elastic cord is used to encircle the driving pulley and is connected to opposite ends of the holder in order to maintain the holder in a fixed position on the surface of the driving pulley. The targeting laser is used to check the centerline alignment between the driving and driven pulleys. The uppermost edge of the driven pulley is used as one check point and the lowermost edge of the driven pulley is used a second check point. Cooperating support bracketry is used as the means to make adjustments in the position of the driven pulley. All of the required components for the pulley alignment tool are provided as part of a tool alignment kit.
摘要:
A tool for use by a machinist in testing the accuracy of a workpiece has an edge to be abutted against the workpiece to be tested and an encased light source connected by a plurality of passages extending within the member to conduct light emitted from the source to an array of apertures spaced at intervals in a bevel of the edge. The array of apertures directs the light at the workpiece on one side of the edge so that defects in accuracy are illuminated to the machinist viewing the workpiece from the other side of the edge. Preferably, a plurality of fiber optic cords extend in the passages from the light source to the apertures.
摘要:
An optical measurement method and system are presented for imaging two target structures in two parallel layers, respectively, of a sample, to enable determination of a registration between the two target structures along two mutually perpendicular axes of the layer. The sample is illuminated with incident radiation to produce a radiation response of the sample. The radiation response is collected by an objective lens arrangement, and the collected radiation response is split into two spatially separated radiation components. The split radiation components are directed towards at least one imaging plane along different optical channels characterized by optical paths of different lengths, respectively. The two split radiation components are detected in said at least one imaging plane, and two image parts are thereby acquired, each image part containing images of the two target structures. This enables determination of the relative distance between the two target structures.
摘要:
A line transfer instrument and method for aligning a pipe laser's laser beam are disclosed wherein the instrument includes a base, a self-leveling scope rotatably mounted to the base so that it is capable of looking downward and slightly backward, a horizontal dove-tail slide for horizontally translating the base perpendicular to the line of sight, and a spotting laser for illuminating the pipe laser so that the scope can be centered more easily on it. The method includes positioning the scope over the pipe laser using the spotting laser and slide to illuminate the center of the pipe laser and center the scope over the pipe laser.
摘要:
A laser apparatus which has a laser resonator 2 for emitting a laser beam 8, an optical fiber 23, on which the laser beam 8 transmitted from the laser resonator 2 through a beam transmission optical path is made incident, for transmitting the laser beam 8 to a workpiece, a measurement and adjustment jig 44 for measuring laser beam output of an annular pattern occurring in the periphery of a beam pattern of the laser beam 8 emitted from the optical fiber 23, and a fiber incidence section 22 for adjusting incidence of the laser beam 8 on the optical fiber 23 based on output from the measurement and adjustment jig 44.
摘要:
An axle alignment system includes a transmitter, reflectors, and an indicator area. The transmitter transmits signals, preferably laser beams, to each reflector. Signals received by the reflectors attached to the end of the axles are reflected at a predetermined angle and direction to be viewed on an indicator area. The indicator area receives the redirected signals from each reflector and provides a visual illustration of the relationship between the suspension axle and another suspension part such as the suspension subframe siderails. Accordingly, the angularity of the axles relative to the siderails may be adjusted such that each of the reflected signals are displayed simultaneously on a reference marker. Once the reflected signals are aligned with respect to the reference marker, the axles are assured to be in accurate alignment.
摘要:
A arrangement for determining the alignment of marked axes (22, 28, 36, 38, 48, 50) of a first (20, 30, 40) and a second body (26, 32, 42) relative to one another, which is provided with a first and a second measurement device (10, 12) which can be attached to the first body or to the second body in a fixed spatial relation to the respective marked axis, the first measurement device (10) having a first source (L2) for delivering a light beam and a second (D1) and a third optoelectronic sensor (D3), and the second measurement device (12) having a second (L1) and a third source (L3) for a light beam and a first optoelectronic sensor (D2), the optoelectronic sensors being made such that they can determine the impact point of a light beam on the sensor, and the first light source being assigned to the first sensor and the second and the third light source being assigned to the second and third sensor.
摘要:
An alignment mark comprising a first test zone and a second test zone for measuring the relative position between different layers of a semiconductor device. The alignment mark is used to determine the overlay error between layers of a semiconductor wafer while minimizing measurement inaccuracies caused by semiconductor manufacturing processes. The first test zone includes two sections, one in which test structures are formed on one layer and a second in which test structures are formed on a second layer. Each of these test structures is composed of smaller sub-structures. The second test zone includes two similar sections that are also composed of smaller sub-structures. The first and second test zones are configured so that the section of each test zone formed one layer is adjacent to the section of the other test zone that is formed on the other layer. By forming each of the periodic structures with smaller sized sub-structures, a more accurate measurement of any alignment error may be obtained. Another aspect of the present invention pertains to a method of utilizing the alignment mark so that an overlay measurement may be obtained.
摘要:
A mark comprising at least one set of calibration periodic structures and at least two sets of test periodic structures, both types of which are positioned along an axis. The mark is used to measure the relative position between two layers of a device. Each set of test periodic structures has its periodic structures formed within first and second sections. The periodic structures of the first and second sections are each formed on one of the two layers of the device, respectively. The first and second sections of each test set is positioned proximate to the second and first sections of the next test set, respectively. This mark allows two beams which scan the mark to travel over both a test section formed on one layer of the device and a test section formed on the other of the two layers. Scanning multiple test sets provides multiple registration error values which are then averaged to obtain an average registration error value. Another aspect of the present invention is directed towards a method for measuring the relative position between two layers of a device. The method begins by providing a mark as described above. A beam is scanned in a first path across the mark. A beam is then scanned in a second path across the mark. Signals are generated with respect to the portion of each beam which reflects off the surface of the device so that the registration error between the two layers may be calculated.