Abstract:
An integrated circuit self-testing system that includes an integrated circuit connected to a circuit board. The integrated circuit includes an output. A connector is attached to the circuit board. A conductive trace of the circuit board electrically connects the output of the integrated circuit to the connector. The conductive trace includes a first section extending between the output of the integrated circuit and the connector of the circuit board, and a second section extending beyond the connector. The integrated circuit includes a pulse generator, that generates a pulsed voltage potential at the output. The integrated circuit further includes a pulse transient detector that detects transients in the voltage potential of the output due to a reflected pulse voltage potential received at the output, thereby indicating whether the connector is properly connected to the conductive trace.
Abstract:
Accordingly, the invention relates to a process and a device for measuring the attenuation of a line where the measurement process according to the invention makes it possible to measure the attenuation of a line at a given frequency F and includes at least the steps wherein the emission of an electric signal at one end of the electric line, provides a signal that includes a spectral amplitude A1 at the frequency F; the measurement of the signal reflected by the other end of the line, at the end of the line from where the signal was emitted; the determination of the amplitude A2 of the spectral component at the frequency F of the reflected signal; the determination of the attenuation of the line from the ratio of the amplitude A2 to the amplitude A1 where it applies in particular to the rating of asymmetric digital subscriber lines.
Abstract:
In a system and method for testing and displaying the abnormalities, includes opens, shorts, bridged-taps and wet sections, of a copper pair line for xDSL service use, the abnormalities are amplified and normalized so as to be displayed within a predetermined observation range. The normalization steps include piecewise gaining and biasing the reflected pulse of various gains to create a first normalized reflected trace which match the reflected traces within a predetermined observation range and thereby constitute a total smooth curve; and amplifying the first normalized reflected trace according to a function of time to create a second normalized reflected trace so as to eliminate an exponential gain decay curve of a no-fault copper pair line with the same predetermined characteristic parameters from the first normalized reflected trace to thereby obtain a second normalized reflected trace showing any amplified abnormalities.
Abstract:
Test structure circuitry and apparatus, circuit boards, and testing systems are described, as well as methods to form such apparatus and circuit boards. The test structure apparatus is used for launching high frequency signals from a test instrument, such as a Time Domain Reflectometer (TDR), into circuitry under test, and includes a pair of launching conductors and a ground pad formed on the first surface of a substrate, or dielectric layer. A ground plane layer, formed on the second surface of the dielectric layer, is connected to the ground pad, which is typically formed so as to substantially surround some portion of the launching conductors. The test structure provides a matching impedance between the TDR probe tip, for example, and the circuit board or components under test.
Abstract:
A method for analyzing cable faults includes dividing a waveform into a plurality of segments. The waveform is representative of a reflected signal created by applying a stimulus signal to a cable, and the slope at any point on each respective segment of the waveform falls within a respective specified range. The method further includes determining a longest segment from the plurality of segments, and identifying a predicted location of the fault based, at least in part, on the location of the longest segment.
Abstract:
Wiring defects are located by detecting a reflected signal that is developed when an arc occurs through the defect to a nearby ground. The time between the generation of the signal and the return of the reflected signal provides an indication of the distance of the arc (and therefore the defect) from the signal source. To ensure arcing, a signal is repeated at gradually increasing voltages while the wire being tested and a nearby ground are immersed in a conductive medium. In order to ensure that the arcing occurs at an identifiable time, the signal whose reflection is to be detected is always made to reach the highest potential yet seen by the system.
Abstract:
A method for performing time domain reflectometry contemporaneously with recurrent transmissions, such as idle transmissions, on a computer network, such as a 100 BASE T protocol network is disclosed. This method comprises detecting the recurrent transmissions and then storing representations of those transmissions. A probe signal, such as a TDR signal, is then generated onto the computer network during the recurrent transmissions. A response of the network to the probe signal combined with the recurrent transmissions is then detected. The signal transmission characteristics of the network are then analyzable based on the response to the probe signal using the stored representations of the recurrent transmissions, using deconvolution, for example.
Abstract:
A method and system for determining the make-up of a subscriber loop having sending pulses onto a loop and acquiring data based on received echo signals. Determining from the received echoes each discontinuity on the loop and, based on each discontinuity, determining a channel transfer function for each loop section preceding the discontinuity. The transfer function is then used to synthesize an inverse filter. The inverse filter and acquired data are convolved for all the loop sections preceding the discontinuity. The method may be further improved by modeling real and spurious echoes and subtracting these echoes from the echoes generated in the loop.
Abstract:
To monitor an electrode lead composed of two lines in a bipolar HVDCT system, a balanced-to-ground pulse formed from an unbalanced-to-ground pulse in push/pull mode is fed into the lines and an actual echo curve is recorded from the echo signals and compared to a dynamic target echo curve, a fault signal being generated when a tolerance band placed around the echo difference curve is exceeded. In this way, a monitoring method is achieved which is nearly independent of the sharply fluctuating ground conductance, which has a higher range with simultaneously lower dispersion of the echo, which radiates less electromagnetic energy and which requires no additional decoupling elements.
Abstract:
An in-situ method for measuring the endpoint of a resist recess etch process for DRAM trench cell capacitors to determine the buried plate depth on a semiconductor wafer thereof, including: placing an IR device on the etch chamber; illuminating the surface of a semiconductor wafer during etching to a resist recess depth with IR radiation from the IR device; detecting reflection spectra from the illuminated surface of the semiconductor wafer with an IR detector; performing a frequency analysis of the reflection spectra and providing a corresponding plurality of wave numbers in response thereto; and utilizing calculating device coupled to the IR detector to calculate the resist recess depth at the illuminated portion of the wafer from the plurality of wave numbers corresponding to the reflection spectra.