公开(公告)号：US07449359B2

公开(公告)日：2008-11-11

申请号：US11319570

申请日：2005-12-29

申请人： Dong Hee Seo ,  Chee Hong Choi

发明人： Dong Hee Seo ,  Chee Hong Choi

IPC分类号： H00L21/00

CPC分类号： H01L27/14689 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14643 ,  H01L27/14685

摘要： A fabricating method of a CMOS image sensor is disclosed, by which a light condensing effect is enhanced by providing an inner microlens to a semiconductor substrate. The CMOS image sensor includes a plurality of photodiodes on a semiconductor substrate, a plurality of inner microlenses on a plurality of the photodiodes, an insulating interlayer on a plurality of the inner microlenses, a plurality of metal lines within the insulating interlayer, a device protecting layer on the insulating interlayer, and a plurality of microlenses on the device protecting layer.

摘要翻译： 公开了一种CMOS图像传感器的制造方法，通过向半导体衬底提供内部微透镜来增强聚光效果。 CMOS图像传感器包括在半导体衬底上的多个光电二极管，多个光电二极管上的多个内部微透镜，多个内部微透镜上的绝缘中间层，绝缘夹层内的多个金属线，保护层 绝缘中间层上的层，以及器件保护层上的多个微透镜。

公开(公告)号：US07514283B2

公开(公告)日：2009-04-07

申请号：US10392528

申请日：2003-03-20

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： H00L21/00 ,  H00L21/76 ,  C23F1/00

CPC分类号： B81C1/00293 ,  B81C2203/0136

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及一种制造或制造具有在受控或预定的机械阻尼环境中操作的机械结构的MEMS的技术。 在这方面，本发明在MEMS的最终包装和/或完成之前将机械结构封装在腔室内。 包含和/或容纳机械结构的腔室内的环境提供预定的，期望的和/或选择的机械阻尼。 控制，选择和/或设计机械结构要操作的封装流体的参数（例如，气体压力）以提供期望的和/或预定的操作环境。