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公开(公告)号:US08598691B2
公开(公告)日:2013-12-03
申请号:US13228757
申请日:2011-09-09
申请人: Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
发明人: Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
IPC分类号: H01L23/695 , H01L29/40
CPC分类号: H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2224/13014 , H01L2224/13147 , H01L2224/141 , H01L2224/14136 , H01L2224/14145 , H01L2224/14156 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2924/00012 , H01L2924/00014
摘要: Semiconductor devices and methods of manufacturing and packaging thereof are disclosed. In one embodiment, a semiconductor device includes an integrated circuit and a plurality of copper pillars coupled to a surface of the integrated circuit. The plurality of copper pillars has an elongated shape. At least 50% of the plurality of copper pillars is arranged in a substantially centripetal orientation.
摘要翻译: 公开了半导体器件及其制造和封装方法。 在一个实施例中,半导体器件包括集成电路和耦合到集成电路的表面的多个铜柱。 多个铜柱具有细长的形状。 多个铜柱的至少50%被布置成基本上向心的取向。