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公开(公告)号：US20130062741A1
公开(公告)日：2013-03-14
申请号：US13228757
申请日：2011-09-09
申请人： Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
发明人： Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
IPC分类号： H01L23/495 , H01L21/60 , H01L21/98 , H01L23/488
CPC分类号： H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2224/13014 , H01L2224/13147 , H01L2224/141 , H01L2224/14136 , H01L2224/14145 , H01L2224/14156 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2924/00012 , H01L2924/00014
摘要： Semiconductor devices and methods of manufacturing and packaging thereof are disclosed. In one embodiment, a semiconductor device includes an integrated circuit and a plurality of copper pillars coupled to a surface of the integrated circuit. The plurality of copper pillars has an elongated shape. At least 50% of the plurality of copper pillars is arranged in a substantially centripetal orientation.
摘要翻译： 公开了半导体器件及其制造和封装方法。 在一个实施例中，半导体器件包括集成电路和耦合到集成电路的表面的多个铜柱。 多个铜柱具有细长的形状。 多个铜柱中的至少50％以大致向心的方向排列。
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公开(公告)号：US08598691B2
公开(公告)日：2013-12-03
申请号：US13228757
申请日：2011-09-09
申请人： Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
发明人： Sheng-Yu Wu , Tin-Hao Kuo , Chen-Shien Chen , Ming-Da Cheng
IPC分类号： H01L23/695 , H01L29/40
CPC分类号： H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2224/13014 , H01L2224/13147 , H01L2224/141 , H01L2224/14136 , H01L2224/14145 , H01L2224/14156 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2924/00012 , H01L2924/00014
摘要： Semiconductor devices and methods of manufacturing and packaging thereof are disclosed. In one embodiment, a semiconductor device includes an integrated circuit and a plurality of copper pillars coupled to a surface of the integrated circuit. The plurality of copper pillars has an elongated shape. At least 50% of the plurality of copper pillars is arranged in a substantially centripetal orientation.
摘要翻译： 公开了半导体器件及其制造和封装方法。 在一个实施例中，半导体器件包括集成电路和耦合到集成电路的表面的多个铜柱。 多个铜柱具有细长的形状。 多个铜柱的至少50％被布置成基本上向心的取向。
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公开(公告)号：US08623756B2
公开(公告)日：2014-01-07
申请号：US13167257
申请日：2011-06-23
申请人： Chita Chuang , Sheng-Yu Wu , Tin-Hao Kuo , Pei-Chun Tsai , Ming-Da Cheng , Chen-Shien Chen
发明人： Chita Chuang , Sheng-Yu Wu , Tin-Hao Kuo , Pei-Chun Tsai , Ming-Da Cheng , Chen-Shien Chen
IPC分类号： H01L21/283
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11002 , H01L2224/1146 , H01L2224/11849 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13171 , H01L2224/13172 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/742 , H01L2224/81193 , H01L2224/81815 , H01L2224/94 , H01L2224/11 , H01L2924/00014 , H01L2924/00012 , H01L2224/81
摘要： A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump.
摘要翻译： 公开了一种用于形成导电连接的系统和方法。 一个实施例包括在半导体衬底的触点上形成导电材料。 然后半导体衬底是反射器，使得导电材料在半导体衬底下方，并且导电材料被回流以形成导电凸块。 使用重力进行回流，以便为导电凸块形成更均匀的形状。
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公开(公告)号：US20120329264A1
公开(公告)日：2012-12-27
申请号：US13167257
申请日：2011-06-23
申请人： Chita Chuang , Sheng-Yu Wu , Tin-Hao Kuo , Pei-Chun Tsai , Ming-Da Cheng , Chen-Shien Chen
发明人： Chita Chuang , Sheng-Yu Wu , Tin-Hao Kuo , Pei-Chun Tsai , Ming-Da Cheng , Chen-Shien Chen
IPC分类号： H01L21/283
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11002 , H01L2224/1146 , H01L2224/11849 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13171 , H01L2224/13172 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/742 , H01L2224/81193 , H01L2224/81815 , H01L2224/94 , H01L2224/11 , H01L2924/00014 , H01L2924/00012 , H01L2224/81
摘要： A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump.
摘要翻译： 公开了一种用于形成导电连接的系统和方法。 一个实施例包括在半导体衬底的触点上形成导电材料。 然后半导体衬底是反射器，使得导电材料在半导体衬底下方，并且导电材料被回流以形成导电凸块。 使用重力进行回流，以便为导电凸块形成更均匀的形状。
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公开(公告)号：US09991190B2
公开(公告)日：2018-06-05
申请号：US13475674
申请日：2012-05-18
申请人： Hui-Min Huang , Yen-Chang Hu , Chih-Wei Lin , Ming-Da Cheng , Chung-Shi Liu , Chen-Shien Chen
发明人： Hui-Min Huang , Yen-Chang Hu , Chih-Wei Lin , Ming-Da Cheng , Chung-Shi Liu , Chen-Shien Chen
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/495 , H01L23/00 , H01L23/31 , H01L21/56 , H01L23/498 , H01L25/10
CPC分类号： H01L23/495 , H01L21/568 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L24/19 , H01L25/105 , H01L2224/12105 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor die. The mechanisms involve using a molding compound to attach the semiconductor die to the interposer frame and forming a redistribution layer on one or both sides of the semiconductor die. The redistribution layer(s) in the package enables fan-out connections and formation of external connection structures. Conductive columns in the interposer frame assist in thermal management.
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公开(公告)号：US09679836B2
公开(公告)日：2017-06-13
申请号：US13298102
申请日：2011-11-16
申请人： Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
发明人： Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
IPC分类号： H01L23/48 , H01L23/498 , H01L21/683 , H01L25/10 , H01L23/31 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/6835 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L25/105 , H01L2221/68318 , H01L2221/68345 , H01L2221/68381 , H01L2224/131 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2924/014 , H01L2924/00
摘要： A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface.
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公开(公告)号：US20130119539A1
公开(公告)日：2013-05-16
申请号：US13298102
申请日：2011-11-16
申请人： Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
发明人： Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
IPC分类号： H05K1/11 , H01L21/60 , H01L23/485
CPC分类号： H01L23/49816 , H01L21/6835 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L25/105 , H01L2221/68318 , H01L2221/68345 , H01L2221/68381 , H01L2224/131 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2924/014 , H01L2924/00
摘要： A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface.
摘要翻译： 一种装置包括再分布线，以及在再分配线上模制的聚合物区域。 聚合物区域包括第一平坦顶表面。 焊料区域设置在聚合物区域中并电耦合到再分配线路。 焊料区域包括不高于第一平坦顶表面的第二平坦顶表面。
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公开(公告)号：US20120299181A1
公开(公告)日：2012-11-29
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US08927391B2
公开(公告)日：2015-01-06
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US10128206B2
公开(公告)日：2018-11-13
申请号：US12904506
申请日：2010-10-14
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Meng-Wei Chou , Hung-Jui Kuo , Chung-Shi Liu
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Meng-Wei Chou , Hung-Jui Kuo , Chung-Shi Liu
IPC分类号： H01L21/768 , H01L23/48 , H01L23/00
摘要： The invention relates to a bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate; a contact pad over the substrate; a passivation layer extending over the substrate having an opening over the contact pad; and a conductive pillar over the opening of the passivation layer, wherein the conductive pillar comprises an upper portion substantially perpendicular to a surface of the substrate and a lower portion having tapered sidewalls.
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