公开(公告)号：US06515324B2

公开(公告)日：2003-02-04

申请号：US09942817

申请日：2001-08-30

Applicant: Akinobu Shibuya ,  Shintaro Yamamichi ,  Toru Mori ,  Takao Yamazaki ,  Yuzo Shimada

Inventor： Akinobu Shibuya ,  Shintaro Yamamichi ,  Toru Mori ,  Takao Yamazaki ,  Yuzo Shimada

IPC: H01L27178

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A capacitor has a lower electrode, a dielectric thin film, an upper electrode, and an insulation cover layer formed on an insulation substrate made of an organic film or a ceramic material, and through holes formed at positions corresponding to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package, with electrodes for connection to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package provided within through holes. In a method for mounting the capacitor, the capacitor is interposed between a flip-chip connected semiconductor element and a mounting substrate.