Abstract:
In an Mn-containing perovskite oxide which is a conventional phase-change substance (A1−xBx)MnO3, when the mixing amount x is increased, the transition temperature (Tc) is shifted to higher temperature side, but the slope of a change in the emittance become gentle and Δε (ε at higher temperature−ε at lower temperature) also become small. In the present invention, the compositional formula of the phase-change substance is the Mn-containing perovskite oxide represented by (A1−xBx)Mn1+yO3 with 0
Abstract:
A non-volatile memory device includes a memory cell region which is formed on a semiconductor substrate to store predetermined information, and a peripheral circuit region which is formed on the semiconductor substrate. The memory cell region includes a gate electrode; and a charge storage layer, the charge storage layer being formed to be a notch or wedge shape having an edge extending into both sides of a bottom end of the gate electrode. The peripheral circuit region includes no charge storage layer therein.
Abstract:
A non-volatile memory device includes a memory cell region which is formed on a semiconductor substrate to store predetermined information, and a peripheral circuit region which is formed on the semiconductor substrate. The memory cell region includes a gate electrode; and a charge storage layer, the charge storage layer being formed to be a notch or wedge shape having an edge extending into both sides of a bottom end of the gate electrode. The peripheral circuit region includes no charge storage layer therein.
Abstract:
A non-volatile memory device includes a memory cell region which is formed on a semiconductor substrate to store predetermined information, and a peripheral circuit region which is formed on the semiconductor substrate. The memory cell region includes a gate electrode; and a charge storage layer, the charge storage layer being formed to be a notch or wedge shape having an edge extending into both sides of a bottom end of the gate electrode. The peripheral circuit region includes no charge storage layer therein.
Abstract:
To provide a catalyst for production of a polyester, a process for producing a polyester using the catalyst and a titanium-containing polyethylene terephthalate having excellent characteristics.A catalyst for production of a polyester, characterized by comprising at least (1) a Group 4A compound (hereinafter referred to as compound (1)), (2) a compound of at least one element selected from the group consisting of magnesium, calcium and zinc (hereinafter referred to as compound (2)) and an oxygen-containing organic solvent. A process for producing a polyester using this catalyst. A titanium-containing polyethylene terephthalate, having characteristics represented by the following (A), (B) and (C): (A) titanium K absorption edge: the peak intensity ratio R defined by R=A/B exceeds 0.2, where A is the intensity of a peak having the maximum intensity among K absorption pre-edge peaks, and B is the maximum peak intensity of K absorption post-edge peaks in a XANES spectrum obtained by normalizing a XAFS spectrum; (B) the amount of carboxyl end groups is less than 35 eq/ton; and (C) the intrinsic viscosity is at least 0.5 dl/g.
Abstract:
An LSI device includes a core region to which a first driving voltage is applied and an interface region to which a second driving voltage higher than the above first driving voltage is applied. The LSI device includes an SOI substrate and a device separation region for separating a SOI layer of the SOI substrate into the core region and the interface region. The thickness of the SOI layer of the core region is thinner than the thickness of the SOI layer of the interface region. The LSI device further includes first MOSFETs formed in the core region and in which the SOI layer of the core region is a fully depleted Si channel and second MOSFETs formed in the interface region and in which the SOI layer of the interface region is a fully depleted Si channel.
Abstract:
A manufacturing method for an SOI semiconductor device includes creating transistors and an element isolation region on a semiconductor layer in an SOI substrate. The method also includes covering the transistors and the element isolation region with a first insulation film. The method also includes creating a first opening section which penetrates the first insulation film, element isolation region and a buried oxide film to expose the support substrate. The method also includes creating a first source interconnect, first drain interconnect and first gate interconnect which are electrically connected to the transistors, on the second insulation film. The method also includes forming dummy interconnects which are connected with these interconnects, and are electrically connected with the support substrate via the first opening section, on the second insulation film. The method also includes disconnecting the dummy interconnects to electrically insulate the first source interconnect, first drain interconnect and first gate interconnect from the support substrate.
Abstract:
A capacitor has a lower electrode, a dielectric thin film, an upper electrode, and an insulation cover layer formed on an insulation substrate made of an organic film or a ceramic material, and through holes formed at positions corresponding to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package, with electrodes for connection to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package provided within through holes. In a method for mounting the capacitor, the capacitor is interposed between a flip-chip connected semiconductor element and a mounting substrate.
Abstract:
An oxide thin film for bolometer having a vanadium oxide represented by VOx, where x satisfies 1.5≦x≦2.0, part of vanadium ion in the vanadium oxide being substituted by metal ion M, where the metal ion M is at least one of chromium (Cr), aluminum (Al), iron (Fe), manganese (Mn), niobium (Nb), tantalum (Ta) and titanium (Ti). Also, provided is an infrared detector having a bolometer thin film defined above. The oxide thin film for bolometer offers a low resistivity and a large TCR value. Also, the infrared detector offers a finer temperature resolution capability (NETD) as low as 0.03° C.
Abstract translation:一种用于具有由VOx表示的氧化钒的测辐射热计的氧化物薄膜,其中x满足1.5 <= x <= 2.0,氧化钒中的钒离子的一部分被金属离子M取代,其中金属离子M是 铬(Cr),铝(Al),铁(Fe),锰(Mn),铌(Nb),钽(Ta)和钛(Ti)。 而且,提供了一种具有上述定影仪薄膜的红外检测器。 测辐射热计的氧化物薄膜具有低电阻率和较大的TCR值。 此外,红外检测器可提供低至0.03°C的更精细的温度分辨能力(NETD)。
Abstract:
A dielectric porcelain composition includes lead magnesium tungstate (Pb(Mg.sub.1/2 W.sub.1/2)O.sub.3), lead titanate (PbTiO.sub.3) and lead zirconate (PbZrO.sub.3) as main components at composition ratios of x, y and z respectively, wherein a point (x, y, z) in a ternary system is positioned on or within a boundary which comprises four straight line segments defined by four points of (0.725, 0.25, 0.025), (0.45, 0.525, 0.025), (0.30, 0.30, 0.40) and (0.475, 0.125, 0.40) in said ternary system as illustrated in FIG. 1, and wherein said main components are added with at least one rare earth oxide at a molar ratio in the range of 0.1-5.0 mol %.
Abstract translation:电介质陶瓷组合物包括钨酸铅镁(Pb(Mg + E,fra 1/2 + EE W + E,fra 1/2 + EE)O 3),钛酸铅(PbTiO 3)和锆酸铅(PbZrO 3) 分别为x,y和z的组成比,其中三元系统中的点(x,y,z)位于包含由(0.725,0.25,0.025)的四个点定义的四个直线段的边界上或内部, (0.45,0.525,0.025),(0.30,0.30,0.40)和(0.475,0.125,0.40),如图3所示。 1,其中所述主要组分以0.1-5.0摩尔%的摩尔比加入至少一种稀土氧化物。