公开(公告)号：US06655021B2

公开(公告)日：2003-12-02

申请号：US09826018

申请日：2001-04-05

申请人： Ulf Jansson

发明人： Ulf Jansson

IPC分类号： H05K339

CPC分类号： H05K7/20509 ,  H05K3/0061 ,  H05K3/308 ,  H05K3/341 ,  H05K7/1417 ,  H05K2201/10598 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： The present invention relates to a method for fastening a printed board to an element. The method comprises the steps of: mounting at least one guide element to said printed board before said printed board is guided towards said element, fastening said at least one guide element to said printed board by soldering before said printed board is guided towards said element, and positioning said printed board on said element with the help of said at least one guide element. The invention also relates to a guide element for the method.

公开(公告)号：US06493932B1

公开(公告)日：2002-12-17

申请号：US09629728

申请日：2000-07-31

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H05K339

CPC分类号： H01R12/7076 ,  H01R12/57 ,  H05K3/326 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49218

摘要： A method of using a socket to electrically interconnect a microelectronic assembly having electrically conductive joining units and a substrate having electrically conductive contacts includes providing a socket having a plurality of apertures with deflectable, resilient lip regions, and positioning the socket over the substrate so that the plurality of apertures are in substantial alignment with at least some of the electrically conductive contacts of the substrate. The microelectronic assembly is then juxtaposed with the substrate so that the socket is between the microelectronic assembly and the substrate and so that the joining units of the microelectronic assembly confront the contacts of the substrate. The joining units of the microelectronic assembly are then inserted into the apertures of the socket so that the conductive joining units deflect the deflectable lip regions of the socket for allowing the plurality of joining units to pass through each aperture, whereby the conductive joining units of the microelectronic assembly are held in electrical contact with the contacts of the substrate by the resilience of the deflectable lip regions contacting the conductive joining units.

摘要翻译： 使用插座将具有导电接合单元的微电子组件和具有导电触点的衬底电气互连的方法包括提供具有多个具有可偏转的弹性唇缘区域的孔的插座，并将插座定位在衬底上，使得 多个孔与衬底的至少一些导电触点基本上对齐。 微电子组件然后与衬底并置，使得插座位于微电子组件和衬底之间，并且使得微电子组件的接合单元面对衬底的触点。 然后将微电子组件的接合单元插入插座的孔中，使得导电接合单元偏转插座的可偏转唇缘区域，以允许多个接合单元通过每个孔，由此导电接合单元 微电子组件通过与导电接合单元接触的可偏转唇缘的弹性保持与基板的触点电接触。