公开(公告)号：US5939132A

公开(公告)日：1999-08-17

申请号：US833193

申请日：1997-04-14

申请人： Toyokazu Fujii ,  Mikio Nishio ,  Mitsuru Sekiguchi ,  Kazuhiko Hashimoto

发明人： Toyokazu Fujii ,  Mikio Nishio ,  Mitsuru Sekiguchi ,  Kazuhiko Hashimoto

IPC分类号： C23C14/04 ,  C23C16/04 ,  H01L21/00 ,  H01L21/677 ,  B05D5/12 ,  H07L21/301

CPC分类号： H01L21/67167 ,  C23C14/042 ,  C23C16/042 ,  H01L21/67207 ,  H01L21/67225 ,  H01L21/67796 ,  H01L2223/54473 ,  H01L2223/5448 ,  Y10S438/975

摘要： On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.

摘要翻译： 在半导体基板上，形成从半导体基板的周边部分留出的成为产品的芯片和位于其一部分的对准芯片。 在作为产品的芯片和对准芯片上形成接触孔和对准标记。 用衬底保持器的对准标记覆盖部分覆盖对准芯片，在半导体衬底上沉积用于金属布线的材料，以在衬底上形成金属膜。 使用未形成金属膜的取向芯片的对准标记，在金属膜上形成掩模图案。