公开(公告)号：US11594799B2

公开(公告)日：2023-02-28

申请号：US16748512

申请日：2020-01-21

申请人： VEGA Grieshaber KG

发明人： Klaus Kienzle ,  Fritz Lenk ,  Roland Baur

IPC分类号： H01P3/12 ,  G01F23/284 ,  H01P11/00

摘要： A waveguide arrangement for transmitting microwaves, and for measuring a limit level or a filling level, is provided, the waveguide arrangement for transmitting microwaves including a waveguide tube having a rectangular or elliptical inner cavity and an outer wall; and a jacket, an inner wall of which corresponds at least in sections with a shape of the outer wall of the waveguide tube.

公开(公告)号：US11539107B2

公开(公告)日：2022-12-27

申请号：US17135268

申请日：2020-12-28

申请人： Waymo LLC

发明人： Edwin Lim ,  Tegan Argo ,  Marvin Weinstein

IPC分类号： H01P5/107 ,  H01P3/12 ,  H01P3/08 ,  H05K1/02

摘要： Example embodiments relate to substrate integrated waveguide (SIW) transitions. An example SIW may include a dielectric substrate having a top surface and a bottom surface and a first metallic layer portion coupled to the top surface of the dielectric substrate that includes a single-ended termination, an impedance transformer, and a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch. The SIW also includes a second metallic layer portion coupled to the bottom surface of the dielectric substrate and metallic via-holes electrically coupling the first metallic layer to the second metallic layer. The SIW may be implemented in a radar unit to couple antennas to a printed circuit board (PCB). In some examples, the SIW may be implemented with only a non-conductive opening that lacks the metallic rectangular patch.

公开(公告)号：US11538758B2

公开(公告)日：2022-12-27

申请号：US15963066

申请日：2018-04-25

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Johanna M. Swan

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/66 ,  H01P3/12 ,  H01P5/12

摘要： Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

公开(公告)号：US11527808B2

公开(公告)日：2022-12-13

申请号：US16829409

申请日：2020-03-25

申请人： Aptiv Technologies Limited

发明人： Shawn Shi

IPC分类号： G01S7/03 ,  H01P3/12 ,  H01Q1/22 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q9/04 ,  H01Q9/16

摘要： A transceiver includes first electrical channels and second electrical channels. The first electrical channels are configured to transfer electromagnetic signals to first air waveguides. Each of the first electrical channels extend from a transmitter along an exterior surface of a chip package that supports the transmitter and terminate at first transitions on the exterior surface. Each of the first plurality of air waveguides are attached to the exterior surface and overlay one of the first transitions. The transceiver also includes second electrical channels configured to transfer second electromagnetic signals from second air waveguides. Each of the second electrical channels extend from a receiver along the exterior surface of the chip package that supports the receiver and terminate at second transitions on the exterior surface. Each of the second air waveguides are attached to the exterior surface and overlay one of the second transitions.

公开(公告)号：US11495871B2

公开(公告)日：2022-11-08

申请号：US16758454

申请日：2018-10-26

申请人： METASUM AB

发明人： Abbas Vosoogh ,  Zhongxia Simon He

IPC分类号： H01P3/12 ,  H01P11/00

摘要： A multi-layer waveguide device, a multi-layer waveguide arrangement, and a method for production thereof, wherein the multi-layer waveguide comprises at least three horizontally divided layers assembled into a multi-layer waveguide. The layers are at least a top layer, an intermediate layer, and a bottom layer, wherein each layer has through going holes extending through the entire layer. The holes are arranged with an offset to adjacent holes of adjoining layers creating a leak suppressing structure.

公开(公告)号：US20220352614A1

公开(公告)日：2022-11-03

申请号：US17661267

申请日：2022-04-28

申请人： Optisys, Inc.

发明人： Michael Hollenbeck ,  Robert Smith

IPC分类号： H01P3/12 ,  H01P1/219 ,  H01P1/207

摘要： Waveguide cross sections designed for waveguide filters. An apparatus includes a waveguide cavity for propagating an electromagnetic signal, wherein the waveguide cavity is defined by a plurality of sidewalls. The waveguide cavity comprises an irregular hexagonal cross-sectional geometry that has a complex side, wherein the complex side comprises a first side and a second side connected to the first side, and wherein the first side and the second side of the complex side meet at a radiused edge.

公开(公告)号：US20220336384A1

公开(公告)日：2022-10-20

申请号：US17809903

申请日：2022-06-30

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： HUAN-NENG CHEN ,  WEN-SHIANG LIAO

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01P3/12 ,  H01L23/498 ,  H01L25/00

摘要： A semiconductor structure includes: a substrate; a first dielectric layer over the substrate; a waveguide over the first dielectric layer; a second dielectric layer over the first dielectric layer and laterally surrounding the waveguide; a first conductive member and a second conductive member over the second dielectric layer and the waveguide, the first conductive member and the second conductive member being in contact with the waveguide; a conductive bump on one side of the substrate and electrically connected to the first conductive member or the second conductive member; and a conductive via extending through the substrate and electrically connecting the conductive bump to the first conductive member or the second conductive member. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

公开(公告)号：US11462810B2

公开(公告)日：2022-10-04

申请号：US17194022

申请日：2021-03-05

申请人： Intel Corporation

发明人： Telesphor Kamgaing ,  Sasha Oster ,  Georgios Dogiamis ,  Johanna Swan

IPC分类号： H01P5/08 ,  H01P1/207 ,  H01P3/12

摘要： Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

公开(公告)号：US11450937B2

公开(公告)日：2022-09-20

申请号：US17347649

申请日：2021-06-15

申请人： VAYYAR IMAGING LTD.

发明人： Naftali Chayat

IPC分类号： H01P3/12 ,  H05K1/11 ,  H05K1/02

摘要： A printed circuit board is provided, comprising a horizontally extending dielectric substrate and a substrate integrated waveguide (SIW). The SIW comprises two horizontally disposed conductive ground planes spaced by a vertical distance, and two vertically disposed conductive fences spanning therebetween. The fences extend in a first horizontal direction, and are spaced from one another in a second horizontal direction, perpendicular to the first horizontal direction. A space defined between the ground planes and the fences comprises material of the substrate formed with one or more channels being free of material of the substrate and extending in the first horizontal direction. Each of the channels is formed by a plurality of vertical cylindrical cavities, and each cavity horizontally overlaps one or more adjacent cavities.

公开(公告)号：US11444379B2

公开(公告)日：2022-09-13

申请号：US16637740

申请日：2017-08-09

申请人： Sony Corporation

发明人： Kun Zhao ,  Zhinong Ying

IPC分类号： H01Q1/24 ,  H01Q5/55 ,  H01P3/12 ,  H05K1/11

摘要： An antenna (100) comprises a waveguide (120) formed by a first horizontal conductive layer (121) of a multi-layer circuit board (110), a second horizontal conductive layer (122) of the multi-layer circuit board, and vertical sidewalls formed by conductive vias (123, 124) extending between the first conductive layer (121) and the second conductive layer (122). Further, the antenna (100) of comprises a parallel plate resonator (150) at one end of the waveguide (120). The parallel plate resonator (150) is formed in the multilayer circuit board (110), by a first horizontal conductive plate (151) adjacent to the first conductive layer (121) and a second horizontal conductive plate (152) adjacent to the second conductive layer (122). Further, the antenna (100) comprises at least one conductive via (155) extending from one of the first conductive plate (151) and the second conductive plate (152) towards the other of the first conductive plate (151) and the second conductive plate (151).