Abstract:
Certain aspects of the present disclosure relate to methods and apparatus for selectively activating bearers in a connection. An exemplary method generally includes configuring one or more radio bearers for communicating with the network, determining that data associated with at least one radio bearer of the one or more radio bearers needs to be transmitted, selectively activating the at least one radio bearer based on the determination that the data associated with the at least one radio bearer needs to be transmitted, transmitting the data over the at least one activated radio bearer.
Abstract:
Certain aspects of the present disclosure provide methods and apparatus for enhancing a beamforming training procedure between wireless nodes comprising multiple transmit and receive antenna arrays (multi-antenna array devices). For example, an apparatus can include a processing system that generates a plurality of transmit beamforming refinement frames for a transmit sector sweep that each include a preamble, a data field, at least one beamforming training field, identification of a transmit antenna array to be used for transmitting the at least one beamforming training field, and a status indication of whether the transmit beamforming refinement frame is a last transmit beamforming refinement frame in the transmit sector sweep for one or more receive antenna arrays of a wireless node. The apparatus also includes a first interface that outputs the transmit beamforming refinement frames using a first transmit beamforming sector for the preambles and data fields, and one or more second transmit beamforming sectors for subfields of the beamforming training fields. Said apparatus can be used in a split beamforming refinement phase based sector level sweep (split BRP-based SLS).
Abstract:
Certain aspects of the present disclosure generally relate to methods and apparatus for generating clock signals. For example, certain aspects of the present disclosure provide a clock generation circuit. The clock generation circuit may include a first transistor (402) connected in cascode with a second transistor (404), wherein an input clock (Clk_in) node of the circuit is coupled to gates of the first and second transistors. The clock generation circuit may also include a frequency divider circuit (406) having an input coupled to the input clock node, wherein an output (Div_out) of the frequency divider circuit is coupled to a source of the second transistor, and wherein an output node (Clk_out) of the circuit is coupled to drains of the first and second transistors.
Abstract:
A reconfigurable microacoustic filter (MAF) is specified which comprises a ladder-type-like filter topology and a suitably placed adjustable capacitive element (AKE).
Abstract:
Certain aspects of the present disclosure provide methods and apparatus for calibrating a tunable active filter. One example apparatus is a filter circuit that generally includes a tunable active filter comprising at least one amplifier and a first feedback path coupled between an input and an output of the at least one amplifier, the first feedback path comprising at least one switch; and an amplitude limiter coupled to the tunable active filter and comprising at least one transistor disposed in a second feedback path coupled between the input and the output of the at least one amplifier.
Abstract:
The invention relates to an RF filter with reduced insertion loss. The filter (F) includes a first bandpass filter (BPF1) having a passband, a circuit unit (SE) having an undesired excitation at a critical frequency (f s ) and a reflector (R) that reflects RF signals of this frequency before the circuit unit is undesirably excited and the power is lost as a result.
Abstract:
In a first group (FG1) of transducer fingers of an interdigital transducer of the SAW filter, a geometric parameter (eta) determining the resonance of the main mode of the transducer is varied in the transverse direction (TR) with a first increment. In a second group (FG2) of transducer fingers (EF), the geometric parameter is varied with a second increment that is opposed in effect to the first, so that the transverse geometric variation of the first and the second groups of transducer fingers accordingly compensate for each other, wherein the resonance of the main mode (M1) remains unchanged, while the interfering secondary mode (M2) is suppressed.
Abstract:
In a multiplexer configured for signal separation in carrier-aggregation mode, two filters of the multiplexer are designed in different technologies with different reflection behavior. The selection and assignment of the respective technology for one of the two filters respectively takes place such that the filter designed with the respective technology has a higher reflectivity for the respective counter band. The first filter (FEl) may be configured for band 8 and designed as an SAW filter on a lithium tantalate substrate, in which the second filter (FE2) may be configured for band 20 and designed as an SAW filter on a lithium niobate substrate and provided with a temperature compensation layer.
Abstract:
To compensate the negative effect of a parasitic impedance element in a two-stage arrangement of a first and a second electric component a compensation element is inserted between first and second stage to supplement the parasitic impedance elements to yield a phase shifter.
Abstract:
[Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate.